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    POLISHING APPARATUS AND POLISHING METHOD
    2.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 有权
    抛光装置和抛光方法

    公开(公告)号：US20120164917A1

    公开(公告)日：2012-06-28

    申请号：US13330881

    申请日：2011-12-20

    申请人： Itsuki KOBATA ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

    发明人： Itsuki KOBATA ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

    IPC分类号： B24B49/00

    CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

    摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

    摘要翻译： 提供了用于研磨衬底的抛光装置。 抛光装置包括：抛光台，其保持抛光垫; 顶环，构造成将衬底压靠在抛光垫上; 第一和第二光学头，每个被配置为将光施加到衬底并且接收来自衬底的反射光; 每个光谱分别被配置成在每个波长处测量接收到的反射光的强度; 以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。

    Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
    3.
    发明申请
    Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method 有权
    用于选择用于抛光终点检测的光的波长的图的制作方法，用于选择用于抛光终点检测的光的波长的选择方法和装置，抛光终点检测方法，抛光终点检测装置和抛光监测方法

    公开(公告)号：US20100093260A1

    公开(公告)日：2010-04-15

    申请号：US12461533

    申请日：2009-08-14

    申请人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta ,  Toshifumi Kimba ,  Masaki Kinoshita

    发明人： Yoichi Kobayashi ,  Noburu Shimizu ,  Shinrou Ohta ,  Toshifumi Kimba ,  Masaki Kinoshita

    IPC分类号： B24B49/12

    CPC分类号： B24B49/12 ,  B24B37/013

    摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.

    摘要翻译： 提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。 该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

    Electron beam apparatus for inspecting a pattern on a sample using multiple electron beams
    4.
    发明授权
    Electron beam apparatus for inspecting a pattern on a sample using multiple electron beams 有权
    用于使用多个电子束检查样品上的图案的电子束装置

    公开(公告)号：US08639463B2

    公开(公告)日：2014-01-28

    申请号：US13600814

    申请日：2012-08-31

    申请人： Toshifumi Kimba ,  Keisuke Mizuuchi

    发明人： Toshifumi Kimba ,  Keisuke Mizuuchi

    IPC分类号： G06F19/00 ,  G01N23/00

    CPC分类号： H01J37/3045 ,  G01N23/00 ,  H01J37/28 ,  H01J2237/2817 ,  H01L21/681

    摘要： An electron beam apparatus for inspecting a pattern on a sample using multiple electron beams includes a plurality of primary electro-optical systems and a plurality of secondary electro-optical systems associated with the respective primary electro-optical systems. The primary electro-optical systems are for irradiating multiple primary electron beams on a surface of the sample, and each includes an electron gun having an anode and an objective lens. The secondary electro-optical systems are for inducing secondary electrons emitted from a surface of the sample by irradiation of the primary electron beams. Detectors are each for detecting the secondary electrons and generating electric signals corresponding to the detected electrons. The anodes of the electron guns of the primary electro-optical systems comprise an anode substrate in common having multiple holes corresponding to the axes of the respective primary electro-optical systems. The anode substrate has metal coatings around the respective holes.

    摘要翻译： 用于使用多个电子束检查样品上的图案的电子束装置包括多个初级电光系统和与各个主电光系统相关联的多个次电光系统。 初级电光系统用于在样品的表面上照射多个一次电子束，并且每个包括具有阳极和物镜的电子枪。 次级电光系统用于通过照射一次电子束来诱导从样品表面发射的二次电子。 检测器各自用于检测二次电子并产生对应于检测到的电子的电信号。 初级电光学系统的电子枪的阳极包括共同的具有对应于各个主要电光学系统的轴的多个孔的阳极衬底。 阳极基板具有围绕相应孔的金属涂层。

    POLISHING APPARATUS
    6.
    发明申请
    POLISHING APPARATUS 有权
    抛光装置

    公开(公告)号：US20110034106A1

    公开(公告)日：2011-02-10

    申请号：US12668065

    申请日：2008-06-24

    申请人： Toshifumi Kimba ,  Hiroaki Kusa ,  Masaki Fujii

    发明人： Toshifumi Kimba ,  Hiroaki Kusa ,  Masaki Fujii

    IPC分类号： B24B49/04 ,  B24B49/12

    CPC分类号： B24B49/12 ,  B24B9/065 ,  B24B37/005

    摘要： A polishing apparatus is disclosed. The apparatus includes a stage (20) configured to hold a substrate W, a stage-rotating mechanism (40) configured to rotate the stage, a polishing head (42) configured to polish a periphery of the substrate held by the stage, a controller (70) configured to control operations of the stage (20), the stage-rotating mechanism (40), and the polishing head (42), an image-capturing device (61) configured to capture an image of the periphery of the substrate through at least one terminal imaging element (60) arranged so as to face the periphery of the substrate, an image processor (62) configured to process the image captured by the image-capturing device, and a liquid ejector (51) configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.

    摘要翻译： 公开了一种抛光装置。 该装置包括：配置成保持基板W的台架（20），配置成旋转台架的台架旋转机构（40），配置成抛光由台架保持的基板的周边的抛光头（42），控制器 （70），被配置为控制所述载物台（20），所述载物台旋转机构（40）和所述抛光头（42）的操作;图像捕获装置（61），其构造成捕获所述基板的周边的图像 通过被配置为面对基板周边的至少一个终端成像元件（60），被配置为处理由图像捕获装置捕获的图像的图像处理器（62）和被配置为喷射的液体喷射器 透光液体朝向基板的周边，以用液体填充基板的周边与端子成像元件之间的空间。

    Sheet beam-type testing apparatus
    7.
    发明授权
    Sheet beam-type testing apparatus 有权
    片式梁式试验机

    公开(公告)号：US07829871B2

    公开(公告)日：2010-11-09

    申请号：US12177733

    申请日：2008-07-22

    申请人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Shoji Yoshikawa ,  Mutsumi Saito

    发明人： Mamoru Nakasuji ,  Nobuharu Noji ,  Tohru Satake ,  Toshifumi Kimba ,  Hirosi Sobukawa ,  Tsutomu Karimata ,  Shin Oowada ,  Shoji Yoshikawa ,  Mutsumi Saito

    IPC分类号： H01J40/14 ,  G02B26/08

    CPC分类号： G01N23/225 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/082 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2816 ,  H01J2237/2817

    摘要： An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by the irradiation of the primary electron beam, and a detector for detecting the secondary electron beam image projected by the electron-optical system; specifically, the electron beam apparatus comprises beam generating means 2004 for irradiating an electron beam having a particular width, a primary electron-optical system 2001 for leading the beam to reach the surface of a substrate 2006 under testing, a secondary electron-optical system 2002 for trapping secondary electrons generated from the substrate 2006 and introducing them into an image processing system 2015, a stage 2003 for transportably holding the substrate 2006 with a continuous degree of freedom equal to at least one, a testing chamber for the substrate 2006, a substrate transport mechanism for transporting the substrate 2006 into and out of the testing chamber, an image processing analyzer 2015 for detecting defects on the substrate 2006, a vibration isolating mechanism for the testing chamber, a vacuum system for holding the testing chamber at a vacuum, and a control system 2017 for displaying or storing positions of defects on the substrate 2006.

    摘要翻译： 诸如基于片材束的测试装置的电子束装置具有电子光学系统，用于用来自电子束源的一次电子束照射待测物体，并且投射通过照射的二次电子束的图像 一次电子束和用于检测由电子 - 光学系统投影的二次电子束图像的检测器; 具体地，电子束装置包括用于照射具有特定宽度的电子束的光束产生装置2004，用于引导光束到达正在测试的基底2006的表面的初级电子 - 光学系统2001，二次电子光学系统2002 用于捕获从衬底2006产生的二次电子并将它们引入到图像处理系统2015中，用于以等于至少一个的连续自由度可移动地保持衬底2006的阶段2003，用于衬底2006的测试室，衬底 用于将基板2006输送到测试室中的传送机构，用于检测基板2006上的缺陷的图像处理分析器2015，用于测试室的隔振机构，用于将测试室保持在真空的真空系统，以及 用于在基板2006上显示或存储缺陷位置的控制系统2017。

    ELECTRON BEAM APPARATUS
    8.
    发明申请
    ELECTRON BEAM APPARATUS 有权
    电子束设备

    公开(公告)号：US20090218506A1

    公开(公告)日：2009-09-03

    申请号：US11996701

    申请日：2006-07-24

    申请人： Mamoru Nakasuji ,  Takeshi Murakami ,  Tohru Satake ,  Tsutomu Karimata ,  Toshifumi Kimba ,  Matsutaro Miyamoto ,  Hiroshi Sobukawa ,  Satoshi Mori

    发明人： Mamoru Nakasuji ,  Takeshi Murakami ,  Tohru Satake ,  Tsutomu Karimata ,  Toshifumi Kimba ,  Matsutaro Miyamoto ,  Hiroshi Sobukawa ,  Satoshi Mori

    IPC分类号： H01J1/50 ,  A61N5/00 ,  H01J3/14

    CPC分类号： H01J37/05 ,  H01J37/147 ,  H01J37/153 ,  H01J37/26 ,  H01J2237/057

    摘要： An electron beam emitted from an electron gun (G) forms a reduced image on a sample (S) through a non-dispersion Wien-filter (5-1), an electromagnetic deflector (11-1), a beam separator (12-1), and a tablet lens (17-1) as an objective lens. The beam separator (12-1) is configured such that a distance by which a secondary electron beam passes through the beam separator is approximately three times longer than a distance by which a primary electron beam passes through the beam separator. Therefore, even if a magnetic field in the beam separator is set to deflect the primary electron beam by a small angle equal to or less than approximately 10 degrees, the secondary electron beam can be deflected by approximately 30 degrees, so that the primary and secondary electron beams are sufficiently separated. Also, since the primary electron beam is deflected by a small angle, less aberration occurs in the primary electron beam. Accordingly, since a light path length of a primary electro-optical system, it is possible to reduce the influence of space charge and the occurrence of deflection aberration.

    摘要翻译： 从电子枪（G）发射的电子束通过非分散维恩滤波器（5-1），电磁偏转器（11-1），光束分离器（12- 1）和作为物镜的平板电脑镜头（17-1）。 束分离器（12-1）被构造成使得二次电子束通过分束器的距离比一次电子束通过分束器的距离大约三倍。 因此，即使将分束器中的磁场设定为使一次电子束偏转等于或小于约10度的小角度，二次电子束可以偏转大约30度，使得初级和次级 电子束充分分离。 此外，由于一次电子束以小角度偏转，所以在一次电子束中产生较小的像差。 因此，由于一次电光学系统的光路长度，可以减小空间电荷的影响和偏转像差的发生。

    Polishing end point detection method, polishing end point detection apparatus and polishing apparatus
    9.
    发明申请
    Polishing end point detection method, polishing end point detection apparatus and polishing apparatus 有权
    抛光终点检测方法，抛光终点检测装置和抛光装置

    公开(公告)号：US20090153859A1

    公开(公告)日：2009-06-18

    申请号：US12314839

    申请日：2008-12-17

    申请人： Toshifumi Kimba

    发明人： Toshifumi Kimba

    IPC分类号： G01J4/00

    CPC分类号： G01N21/211 ,  B24B37/013 ,  B24B49/12 ,  G01N2021/215

    摘要： A polishing end point detection method is to detect a polishing end point of a workpiece having a multilayer structure. The method is performed by emitting a first light and a second light to a surface of the workpiece at a first angle of incidence and a second angle of incidence, respectively, receiving the first light and the second light reflected from the surface through a polarizing filter, performing a first analyzing process of analyzing a brightness and a saturation of the surface from the first light received, performing a second analyzing process of analyzing a brightness and a saturation of the surface from the second light received, and determining removal of the upper layer based on changes in the brightness and the saturation of the surface.

    摘要翻译： 抛光终点检测方法是检测具有多层结构的工件的抛光终点。 该方法通过以第一入射角和第二入射角分别向工件的表面发射第一光和第二光，通过偏振滤光器接收第一光和从表面反射的第二光， 执行从接收的第一光分析表面的亮度和饱和度的第一分析处理，执行从接收的第二光分析表面的亮度和饱和度的第二分析处理，并且确定上层的去除 基于表面的亮度和饱和度的变化。