-
公开(公告)号：US09401293B2
公开(公告)日：2016-07-26
申请号：US13330881
申请日：2011-12-20
IPC分类号： B24B49/12 , B24B37/10 , B24B37/30 , B24B37/013 , H01L21/67 , H01L21/687 , B24B37/04 , B24B37/005
CPC分类号： B24B37/26 , B24B37/005 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/10 , B24B49/12 , H01L21/31053 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L21/68721 , H01L22/26
摘要： A polishing apparatus for polishing a substrate includes a polishing table holding a polishing pad, a top ring configured to press the substrate against the polishing pad, and first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate. The polishing apparatus also includes spectroscopes each configured to measure at each wavelength an intensity of the reflected light received, and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
摘要翻译： 用于抛光基板的抛光装置包括：保持抛光垫的抛光台，被配置为将基板压靠在抛光垫上的顶环;以及第一和第二光学头，每个被配置为将光施加到基板并且接收来自 底物。 抛光装置还包括分别被配置成在每个波长处测量接收到的反射光的强度，以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。
-
公开(公告)号：US20120164917A1
公开(公告)日：2012-06-28
申请号：US13330881
申请日：2011-12-20
IPC分类号： B24B49/00
CPC分类号： B24B37/26 , B24B37/005 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/10 , B24B49/12 , H01L21/31053 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L21/68721 , H01L22/26
摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.
摘要翻译： 提供了用于研磨衬底的抛光装置。 抛光装置包括：抛光台，其保持抛光垫; 顶环，构造成将衬底压靠在抛光垫上; 第一和第二光学头，每个被配置为将光施加到衬底并且接收来自衬底的反射光; 每个光谱分别被配置成在每个波长处测量接收到的反射光的强度; 以及处理器，被配置为产生指示反射光的强度和波长之间的关系的光谱。 第一光学头被布置为面对基板的中心，并且第二光学头被布置成面对基板的周边部分。
-
公开(公告)号：US5104573A
公开(公告)日：1992-04-14
申请号：US422103
申请日：1989-10-16
申请人： Katsutoshi Ono , Tomohiko Abe , Tsuneo Kusunoki , Yuichi Kimizuka
发明人： Katsutoshi Ono , Tomohiko Abe , Tsuneo Kusunoki , Yuichi Kimizuka
CPC分类号： C09K11/7774
摘要： A green light emitting phosphor comprising tetravalent elements added to a green light emitting phosphor, Y.sub.3 (Al,Ga).sub.5 O.sub.12 :Tb, wherein the green light emitting phosphor can prevent a so-called electron beam burning even when excited by electron beams of high energy. The green light emitting phosphor is, particularly suitable to be applied to a projector tube or a high-brightness phosphor display tube.
-
公开(公告)号：US4095553A
公开(公告)日：1978-06-20
申请号：US734751
申请日：1976-10-22
申请人： Katsutoshi Ono , Yasumasa Takagi
发明人： Katsutoshi Ono , Yasumasa Takagi
CPC分类号： G01P1/11
摘要： A lever fixed to a metal cap or speed cup of a speedometer is vibratably engageable with projections provided on a rotating ring member when a speed pointer rotatable with the metal cap deflects beyond a predetermined maximum index, so that the speed pointer is vibrated to give a warning to the vehicle driver.
摘要翻译： 固定在速度计的金属盖或速度杯上的杠杆，当与金属盖可旋转的速度指示器偏转超过预定的最大指标时，与设置在旋转环构件上的突起可振动地接合，从而使速度指示器振动， 警告车辆司机。
-
5.发明授权公开(公告)号：US08845391B2
公开(公告)日：2014-09-30
申请号：US12974123
申请日：2010-12-21
IPC分类号： B24B1/00 , B24B55/02 , B24B37/015 , B24B37/34 , B24B37/10
CPC分类号： B24B37/015 , B24B37/042 , B24B37/10 , B24B37/34 , B24B55/02
摘要： An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
摘要翻译： 用于抛光基板的装置包括：支撑抛光垫的可旋转的抛光台;衬底保持器，其构造成保持基板，并将基板压靠在旋转的抛光台上的抛光垫的抛光表面上，以便抛光基板;以及 衬垫温度检测器，被配置为测量抛光垫的抛光表面的温度。 该装置还包括：衬垫温度调节器，其被配置为接触抛光表面以调节抛光表面的温度;以及温度控制器，其被配置为通过基于关于温度的信息控制焊盘温度调节器来控制抛光表面的温度 由焊盘温度检测器检测到的抛光表面。
-
公开(公告)号：US20120276816A1
公开(公告)日：2012-11-01
申请号：US13454146
申请日：2012-04-24
申请人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
发明人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
IPC分类号： B24B1/00 , B24B37/005
CPC分类号： B24B37/015 , B24B37/042 , B24B37/105 , B24B57/02
摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
摘要翻译： 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括预先确定抛光液的供给流量与抛光衬底时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。
-
公开(公告)号：US6119483A
公开(公告)日：2000-09-19
申请号：US999479
申请日：1997-12-29
申请人： Koji Takahashi , Kazuhiko Maeda , Shinji Eda , Jun Ozawa , Katsutoshi Ono , Kinobu Osakabe , Nobuyuki Eto
发明人： Koji Takahashi , Kazuhiko Maeda , Shinji Eda , Jun Ozawa , Katsutoshi Ono , Kinobu Osakabe , Nobuyuki Eto
CPC分类号： C03C19/00 , C03C17/06 , C03C21/002 , C03C23/0075 , G11B5/8404
摘要： An object of the present invention is to prevent the dhesion of particles such as fine iron powders onto a glass substrate upon the production of a glass substrate for an information recording medium. To attain the above object, any one of the following means is adopted: (1) at least one of the production, inspection, packing and filling steps of the glass substrate for an information recording medium is carried out under a clean atmosphere which does not permit the adhesion of particles; (2) at least a wall surface of a chemical reinforcement tank containing a chemical reinforcement liquid therein and/or said retaining means which is contact with the chemical reinforcement liquid is formed of a stainless alloy having corrosion resistance in a high-temperature region as high as the heating temperature of the chemical reinforcement liquid; (3) a means for trapping fine particles existing in the chemical reinforcement liquid used in the chemical reinforcement step is provided; and (4) the glass substrate is washed with hydrochloric acid.
摘要翻译： 本发明的目的是在生产用于信息记录介质的玻璃基板时，防止微细铁粉等颗粒在玻璃基板上的粘附。 为了实现上述目的，采用以下方法之一：（1）用于信息记录介质的玻璃基板的生产，检查，包装和填充步骤中的至少一个在不干净的气氛下进行 允许颗粒的粘附; （2）至少在其中含有化学增强液体的化学加固槽的壁面和/或与化学增强液体接触的所述保持装置由在高温区域具有高耐腐蚀性的不锈钢合金形成 作为化学增强液的加热温度; （3）提供用于捕获存在于化学增强步骤中使用的化学增强液体中的微粒的装置; 和（4）玻璃基板用盐酸洗涤。
-
公开(公告)号：US09067296B2
公开(公告)日：2015-06-30
申请号：US13454146
申请日：2012-04-24
申请人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
发明人： Katsutoshi Ono , Yu Ishii , Hisanori Matsuo , Kuniaki Yamaguchi
IPC分类号： B24B37/015 , B24B37/04 , B24B37/10 , B24B57/02
CPC分类号： B24B37/015 , B24B37/042 , B24B37/105 , B24B57/02
摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.
摘要翻译： 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括事先确定抛光液的供给流量与抛光基板时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。
-
公开(公告)号：US20050221720A1
公开(公告)日：2005-10-06
申请号：US11098430
申请日：2005-04-05
申请人： Katsutoshi Ono
发明人： Katsutoshi Ono
IPC分类号： B24B49/10 , B24B53/007 , B24B53/017 , B24B53/02 , H01L21/304 , B24B49/00
CPC分类号： B24B53/017 , B24B49/10
摘要： A polishing apparatus can detect completion of initialization of a polishing pad quantitatively. The polishing apparatus has a polishing table having a polishing pad attached thereto and a substrate holder configured to bring a surface of a substrate into contact with the polishing pad and press the substrate against the polishing pad. The polishing apparatus also has a drive mechanism operable to drive at least one of the polishing table and the substrate holder so as to provide a relative movement between the polishing pad and the substrate. The polishing apparatus includes a current sensor operable to detect a drive current supplied to the driving mechanism. The polishing apparatus also includes a polishing pad condition detector operable to detect a condition of the polishing pad based on the drive current detected by the current sensor when the dummy substrate is polished by a relative movement between the polishing pad and a dummy substrate held by the substrate holder.
摘要翻译： 抛光装置可以定量地检测抛光垫的初始化的完成。 抛光装置具有：抛光台，其具有安装在其上的抛光垫，以及基板保持器，其构造成使基板的表面与抛光垫接触，并将基板压靠在抛光垫上。 抛光装置还具有可操作以驱动抛光台和基板保持器中的至少一个的驱动机构，以便在抛光垫和基板之间提供相对移动。 抛光装置包括可用于检测提供给驱动机构的驱动电流的电流传感器。 抛光装置还包括抛光装置状态检测器，其可操作以基于由电流传感器检测到的驱动电流来检测抛光垫的状态，当通过抛光垫和由基板保持的虚设基板之间的相对运动来抛光虚拟基板时 基板支架
-
公开(公告)号：US06548139B2
公开(公告)日：2003-04-15
申请号：US10074002
申请日：2002-02-14
申请人： Hiroyuki Sakai , Katsutoshi Ono , Syoji Matsuda
发明人： Hiroyuki Sakai , Katsutoshi Ono , Syoji Matsuda
IPC分类号： G11B582
CPC分类号： G11B5/8404 , B82Y15/00 , C03C15/00 , C03C15/02 , C03C19/00 , C03C2204/08 , Y10T428/24355
摘要： In a glass substrate for use in a magnetic recording medium, a surface roughness of at least a principal surface of the glass substrate is measured by the use of the interatomic force microscope (AFM), Ra falls within the range between 0.2 and 2.5 nm, Rmax falls within the range between 3 and 25 nm, and Rmax/Ra falls within the range between 3 and 35.
-
-
-
-
-
-
-
-
-
搜索结果
14 条记录 (耗时 0.024 秒)
