-
公开(公告)号：US09305684B2
公开(公告)日：2016-04-05
申请号：US13808580
申请日：2010-09-09
申请人： Jae Ku Kim
发明人： Jae Ku Kim
CPC分类号： H01B17/14 , B81C2203/054 , C23F1/02 , C23F1/18 , G02F1/13452 , H01B19/00 , H05K1/02 , H05K1/115 , H05K3/0017 , H05K3/3442 , H05K3/42 , H05K2201/10204 , H05K2201/2036 , Y10T29/303 , Y10T29/49227 , Y10T428/24488 , Y10T428/31678
摘要： The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.
摘要翻译： 根据本发明的一个实施例的基板间隙支撑件（30）包括具有六面体形状并由绝缘体制成的主体（31），安装在主体（31）的相对侧表面上的金属箔（32a）和（32b） ）露出两侧面的上部并覆盖两个侧面的下部，以及安装在主体（31）的底面的基板（210）。 根据本发明，间隙支撑件可以通过自动化工艺制造，从而精确地控制尺寸。 由于间隙支撑体附着在基板的表面上，所以发生高度差异的可能性很小。 而且，由于间隙支架可以安装在自动化过程中，因此适用于批量生产过程。
-
2.发明申请公开(公告)号：US20130087826A1
公开(公告)日：2013-04-11
申请号：US13805666
申请日：2011-03-23
申请人： Jae Ku Kim
发明人： Jae Ku Kim
CPC分类号： H01L33/62 , H01L21/561 , H01L23/3107 , H01L23/49562 , H01L24/34 , H01L24/37 , H01L24/97 , H01L33/005 , H01L33/486 , H01L33/647 , H01L2224/37011 , H01L2224/37599 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/1203 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2224/84 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： Disclosed is a diode package, wherein an upper lead wire and a lower lead wire are each formed in a long and flat plate and each have a first stage and a second stage, both stages being opposite from each other, the upper side of the diode chip is attached to the lower side of the first stage of the upper lead wire, the lower side of the diode chip is attached to the lower side of the first stage of the upper lead wire, and the second stage of the upper lead wire and the second stage of the lower lead wire are led out in the lateral direction of the molding compound. Furthermore, the first stage of the upper lead wire has a hemispherical contact groove which protrudes downward, and the hemispherical contact groove has a through hole in the center thereof.
摘要翻译： 公开了一种二极管封装，其中上引线和下引线各自形成在长平板中，并且每个具有第一级和第二级，两级彼此相对，二极管的上侧 芯片安装在上部引线的第一级的下侧，二极管芯片的下侧安装在上部引线的第一级的下侧，上部引线的第二级和 下引线的第二级在模塑料的横向被引出。 此外，上引线的第一级具有向下突出的半球形接触槽，并且半球形接触槽在其中心具有通孔。
-
3.发明授权公开(公告)号：US09065030B2
公开(公告)日：2015-06-23
申请号：US13805666
申请日：2011-03-23
申请人： Jae Ku Kim
发明人： Jae Ku Kim
IPC分类号： H01L23/48 , H01L33/62 , H01L23/00 , H01L33/00 , H01L23/495 , H01L21/56 , H01L33/48 , H01L33/64 , H01L23/31
CPC分类号： H01L33/62 , H01L21/561 , H01L23/3107 , H01L23/49562 , H01L24/34 , H01L24/37 , H01L24/97 , H01L33/005 , H01L33/486 , H01L33/647 , H01L2224/37011 , H01L2224/37599 , H01L2224/84801 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/1203 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2224/84 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： According to the present invention, there is provided a diode package in which a diode chip is sealed by a molding compound and a lead wire connected to the diode chip is led outside the molding compound, wherein the lead wire is divided into an upper lead wire and a lower lead wire, both lead wires each being formed in a long, flat plate and having a first stage and a second stage, both stages being opposite from each other, the upper side of the diode chip is attached to the lower side of the first stage of the upper lead wire, the lower side of the diode chip is attached to the upper side of the first stage of the lower lead wire, and the second stage of the upper lead wire and the second stage of the lower lead wire are led out in the lateral direction of the molding compound.
摘要翻译： 根据本发明，提供一种二极管封装，其中二极管芯片通过模塑料密封，并且连接到二极管芯片的引线被引导到模塑料外部，其中引线被分成上引线 和一个下引线，两条引线各自形成在一个长的平板上，并且具有第一级和第二级，两级彼此相对，二极管芯片的上侧安装在 上引线的第一级，二极管芯片的下侧安装在下导线的第一级的上侧，上引线的第二级和下引线的第二级 沿着模塑料的横向被引出。
-
公开(公告)号：US10966320B2
公开(公告)日：2021-03-30
申请号：US16979809
申请日：2018-09-20
申请人： GNE TECH CO., LTD. , Jae Ku Kim
发明人： Jae Ku Kim
摘要： The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.
-
公开(公告)号：US20130115428A1
公开(公告)日：2013-05-09
申请号：US13808580
申请日：2010-09-09
申请人： Jae Ku Kim
发明人： Jae Ku Kim
CPC分类号： H01B17/14 , B81C2203/054 , C23F1/02 , C23F1/18 , G02F1/13452 , H01B19/00 , H05K1/02 , H05K1/115 , H05K3/0017 , H05K3/3442 , H05K3/42 , H05K2201/10204 , H05K2201/2036 , Y10T29/303 , Y10T29/49227 , Y10T428/24488 , Y10T428/31678
摘要： The substrate gap supporter (30) according to one embodiment of the present invention comprises a body (31) having a hexahedron shape and made of an insulator, metal foils (32a) and (32b) installed on opposite side surfaces of the body (31) to expose the upper portions of both side surfaces and cover the lower portions of both side surfaces, and a substrate (210) attached to the bottom surface of the body (31). According to the present invention, the gap supporter can be made through an automated process, thus precisely controlling size. Since the gap supporter is attached to the surface of the substrate, there is little possibility for a height difference to occur. And also, because the gap supporter can be installed in an automated process, it is suitable for a mass production process.
摘要翻译： 根据本发明的一个实施例的基板间隙支撑件（30）包括具有六面体形状并由绝缘体制成的主体（31），安装在主体（31）的相对侧表面上的金属箔（32a）和（32b） ）露出两侧面的上部并覆盖两个侧面的下部，以及安装在主体（31）的底面的基板（210）。 根据本发明，间隙支撑件可以通过自动化工艺制造，从而精确地控制尺寸。 由于间隙支撑体附着在基板的表面上，所以发生高度差异的可能性很小。 而且，由于间隙支架可以安装在自动化过程中，因此适用于批量生产过程。
-
-
-
-
搜索结果
5 条记录 (耗时 0.011 秒)
