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    Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same
    9.
    发明授权
    Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same 有权
    采用焊料涂覆堆叠突起的堆叠型半导体封装模块及其制造方法

    公开(公告)号：US07462508B2

    公开(公告)日：2008-12-09

    申请号：US11927968

    申请日：2007-10-30

    申请人： Dae Woong Lee

    发明人： Dae Woong Lee

    IPC分类号： H01L21/00

    CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/15311

    摘要： The stack type semiconductor package module includes a lower semiconductor package having a main substrate, a chip mounted on the main substrate and electrically connected to the main substrate through a wire. An epoxy molding compound (EMC) is provided on the main substrate to cover the chip and the wire. Contact holes are formed in the EMC. A sub-substrate having protrusions coated with solder is connected to the lower semiconductor package by inserting the solder coated protrusions into the contact holes. Heat is applied to the protrusions, and the molten solder solidifies inside the contact holes. An upper semiconductor package having substantially identical structure as the lower package is then stacked on the sub-substrate.

    摘要翻译： 堆叠型半导体封装模块包括具有主衬底的下半导体封装，安装在主衬底上的芯片，并通过导线与主衬底电连接。 在主基板上设置环氧树脂模塑料（EMC）以覆盖芯片和导线。 EMC中形成接触孔。 通过将焊料涂覆的突起插入到接触孔中，具有涂覆有焊料的突起的子基板连接到下半导体封装。 对突起施加热量，并且熔融的焊料在接触孔内固化。 然后将具有与下封装基本相同的结构的上半导体封装堆叠在子基板上。