摘要:
A method of forming fine patterns of a semiconductor device, in which a plurality of conductive lines formed in a cell array region are integrally formed with contact pads for connecting the conductive lines to a peripheral circuit. In this method, a plurality of mold mask patterns, each including a first portion extending in a first direction and a second portion which is integrally formed with the first portion and extends in a second direction, are formed within a cell block on a substrate comprising a film which is to be etched. A first mask layer covering sidewalls and an upper surface of each of the plurality of mold mask patterns is formed on the substrate. First mask patterns are formed by partially removing the first mask layer so that a first area of the first mask layer remains and a second area of the first mask layer is removed. The first area of the first mask layer covers sidewalls of adjacent mold mask patterns from among the plurality of mold mask patterns by being located between the adjacent mold mask patterns, and the second area of the first mask layer covers portions of the sidewalls of the plurality of mold mask patterns, the portions corresponding to an outermost sidewall of a mold mask pattern block.
摘要:
A method of forming fine patterns of a semiconductor device, in which a plurality of conductive lines formed in a cell array region are integrally formed with contact pads for connecting the conductive lines to a peripheral circuit. In this method, a plurality of mold mask patterns, each including a first portion extending in a first direction and a second portion which is integrally formed with the first portion and extends in a second direction, are formed within a cell block on a substrate comprising a film which is to be etched. A first mask layer covering sidewalls and an upper surface of each of the plurality of mold mask patterns is formed on the substrate. First mask patterns are formed by partially removing the first mask layer so that a first area of the first mask layer remains and a second area of the first mask layer is removed. The first area of the first mask layer covers sidewalls of adjacent mold mask patterns from among the plurality of mold mask patterns by being located between the adjacent mold mask patterns, and the second area of the first mask layer covers portions of the sidewalls of the plurality of mold mask patterns, the portions corresponding to an outermost sidewall of a mold mask pattern block.
摘要:
Provided are a method of forming patterns for a semiconductor device in which a pattern density is doubled by performing double patterning in a part of a device region while patterns having different widths are being simultaneously formed, and a semiconductor device having a structure to which the method is easily applicable. The semiconductor device includes a plurality of line patterns extending parallel to each other in a first direction. A plurality of first line patterns are alternately selected in a second direction from among the plurality of line patterns and each have a first end existing near the first side. A plurality of second line patterns are alternately selected in the second direction from among the plurality of line patterns and each having a second end existing near the first side. The first line patterns alternate with the second line patterns and the first end of each first line pattern is farther from the first side than the second end of each second line pattern.
摘要:
Provided are a method of forming patterns for a semiconductor device in which a pattern density is doubled by performing double patterning in a part of a device region while patterns having different widths are being simultaneously formed, and a semiconductor device having a structure to which the method is easily applicable. The semiconductor device includes a plurality of line patterns extending parallel to each other in a first direction. A plurality of first line patterns are alternately selected in a second direction from among the plurality of line patterns and each have a first end existing near the first side. A plurality of second line patterns are alternately selected in the second direction from among the plurality of line patterns and each having a second end existing near the first side. The first line patterns alternate with the second line patterns and the first end of each first line pattern is farther from the first side than the second end of each second line pattern.
摘要:
A first mask layer pattern including a plurality of parallel line portions is formed on an etch target layer on a semiconductor substrate. A sacrificial layer is formed on the first mask layer pattern and portions of the etch target layer between the parallel line portions of the first mask layer pattern. A second mask layer pattern is formed on the sacrificial layer, the second mask layer pattern including respective parallel lines disposed between respective adjacent ones of the parallel line portions of the first mask layer pattern, wherein adjacent line portions of the first mask layer pattern and the second mask layer pattern are separated by the sacrificial layer. A third mask layer pattern is formed including first and second portions covering respective first and second ends of the line portions of the first mask layer pattern and the second mask layer pattern and having an opening at the line portions of the first and second mask layer patterns between the first and second ends. The sacrificial layer and the etch target layer are etched using the third mask layer pattern, the first mask layer pattern and the second mask layer pattern as a mask to thereby form a plurality of parallel trenches in the etch target layer between the line portions of the first and second mask layer patterns. Conductive lines may be formed in the trenches.
摘要:
A semiconductor device and a method of manufacturing the semiconductor device maintain an insulating distance between contact plugs and wiring lines formed on the contact plugs by using an etch mask pattern for forming contact holes. The device comprises a substrate comprising a plurality of conductive areas; an inter-layer insulating layer on the substrate having a plurality of contact holes through which the conductive areas are exposed; a first insulating layer covering the top surface of the inter-layer insulating layer; a plurality of contact plugs respectively connected to the plurality of conductive areas through the plurality of contact holes, the plurality of contact plugs having top surfaces a distance from each of which to a top surface of the substrate is less than a distance from the top surface of the inter-layer insulating layer to the top surface of the substrate; a plurality of ring-shaped insulating spacers covering inner sidewalls of the inter-layer insulating layer, inner sidewalls of the first insulating layer, and outer edge areas of top surfaces of the contact plugs so as to expose center areas of the top surfaces of the contact plugs in the contact holes; and a plurality of wiring lines above the first insulating layer and on the insulating spacers and respectively electrically connected to the plurality of contact plugs.
摘要:
A field sequential display apparatus and an image display method thereof are provided. A field sequential display apparatus includes: a color-coordinate conversion unit which analyses image state information of a plurality of input image signals of primary colors representing one image and converts the input image signals of primary colors into image signals of primary colors and at least one image signal of specific colors by using the image state information; a display panel displaying the converted image signals; and a light source driving unit which sequentially drives light sources corresponding to colors of the converted image signals. Accordingly, color breakup can be prevented, and image quality can be improved.
摘要:
An image processing device and method to select a field to use in interpolation, if an input image is a film image. The image processing device includes a field selector to select a field to use to interpolate a current field based on difference values in field data among first, second, and third fields being consecutively input in an input image, the field to use to interpolate the current image being one of the first and the third fields and the current field being the second field, a film detector to generate a pattern based on the difference values in the field data between the first, second, and third fields and to determine whether the input image is a film image based on the generated pattern, and an interpolator to interpolate the second field using the one of the first and third field selected by the field selector if the film detector determines the input image to be a film image. Accordingly, when the input image is a film image without a bad-edit, the interpolation process is executed by selecting two temporarily consecutive fields of a field to be interpolated, and using the field with a smaller difference values in field data from the field to be interpolated and a problem of judder in images can be resolved.
摘要:
An image processing apparatus using a judder-map and a method thereof. The image processing apparatus using a judder-map includes: a field storage block to receive an input interlaced video signal including an input image having a plurality of consecutive fields, a film detecting block to receive the plurality of the consecutive fields from the field storage block and to detect whether the input image is an image in a film mode, a judder-map generating block to detect judder created on a pixel or block of neighboring fields among the plurality of consecutive fields provided from the field storage block to generate a judder-map, and an image interpolating block to perform image interpolation using the judder-map if the input video signal is detected to be an image in the film mode and to generate and output a progressive video signal. The image processing apparatus prevents the creation of judder on CGI (Computer Graphic Imagery) or subtitles, to which pulldown technologies are not applied.
摘要:
An image processing device and a method thereof. The image processing device includes a mapper to map a two-dimensional plane of an input image into a three-dimensional vector surface, a coefficient calculator to calculate a coefficient with respect to an equation of a plane formed by a plurality of pixels mapped by the mapper, and an interpolator to interpolate by calculating a gray-level of a location to be interpolated based on the equation of the plane obtained by the coefficient calculator. When the pixels on the 2-D plane are mapped into the 3-D vector space, the image processing device according to an exemplary embodiment of the present general inventive concept prevents overshoot or undershoot which may occur at the edges or on planes, and thus displays a smooth image.