摘要:
A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.
摘要:
A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.
摘要:
A heat sink comprises a base and a fin support larger in area than the base and supporting fins that may be positioned in a plurality of orientations relative to the base. The base is adapted for being connected to a heat-generating electronic component on a circuit board, and the heat sink dissipates heat generated by the heat-generating electronic device and conducted through the base and the fin support to the fins supported thereon. The heat sink dissipates heat from the heat-generating electronic device in a first operable position and in a second operable position. The heat sink may be moved from the first to the second operable position to facilitate access to electrical contacts proximal the heat-generating electronic component.
摘要:
A computer processor retention device comprises a load frame, a load plate, and a pair of retractable cover members. The load frame may be secured to a circuit board around a processor mounting site. The load plate is pivotally coupled to the load frame and is pivotable between being open for receiving a processor at the processor mounting site and closed in engagement with a periphery of the received processor. The load plate has a window that is open to the processor mounting site when the load plate is closed. The retractable cover members span the window and are alternately movable along a track toward one another to cover the processor mounting site and away from one another to expose the processor mounting site.
摘要:
In accordance with one embodiment of the invention, an I2C bus multiplexing circuit for use in an I2C bus interface can be provided. The I2C bus multiplexing circuit can facilitate multiplexer switching in an I2C bus interface by detecting a start command from an I2C master device via an I2C bus, buffering data from the I2C master device, detecting a clock frequency of a bus serial clock (SCL) line of the I2C master device, holding the serial data (SDA) line of the I2C master device in a clock stretch state and selecting a port based on the detected clock frequency of the SCL of the I2C master device. The method further can include sending the buffered data to an I2C slave device on the selected port. The method further can include receiving an acknowledgement from the I2C slave device on the selected port.
摘要:
Detecting TIM between a heat sink and an integrated circuit, the integrated circuit including TIM detection points adapted to receive TIM upon installation of the heat sink and including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; determining, by a TIM detection module of the integrated circuit in dependence upon the activations of the TIM detection devices, sufficiency of the TIM; and responsive to determining that the TIM between the heat sink and the integrated circuit is insufficient, controlling, in real-time by the TIM detection module, operation of the integrated circuit to reduce heat generated by the integrated circuit.
摘要:
Increasing data transmission rate in an I2C system that includes an I2C source device and an destination device, the source device coupled to the destination device through an SDL and SCL, including: receiving in parallel, by the destination device, an SDL data signal and an SCL data signal, the SCL data signal encoded with bits; and, for each bit of the SCL data signal: detecting rise time of the bit and determining, in dependence upon the detected rise time, whether the bit represents a first binary value or a second binary value including: determining that the bit represents a first binary value when the detected rise time is less than a predefined threshold; and determining that the bit represents a second binary value when the detected rise time is not less than the predefined threshold.
摘要:
A computer processor retention device comprises a load frame, a load plate, and a pair of retractable cover members. The load frame may be secured to a circuit board around a processor mounting site. The load plate is pivotally coupled to the load frame and is pivotable between being open for receiving a processor at the processor mounting site and closed in engagement with a periphery of the received processor. The load plate has a window that is open to the processor mounting site when the load plate is closed. The retractable cover members span the window and are alternately movable along a track toward one another to cover the processor mounting site and away from one another to expose the processor mounting site.
摘要:
Selectively filtering incoming communications events in a communications device, including: receiving, by a communications event filtering module, an incoming communications event; determining, by the communications event filtering module, whether the communications device is currently servicing a call; responsive to determining that the communications device is currently servicing a call, determining, by the communications event filtering module, whether the call is interruptible; and responsive to determining that the call is not interruptible, blocking, by the communications event filtering module, the incoming communications event from presentation by the communications device until the call has ended.
摘要:
A method uses scales onboard a lift apparatus to weigh an uninstalled component that is positioned on the lift apparatus for installation into a rack. Data is accessed that identifies the weight and rack location of components currently installed in the rack, and one or more available rack locations are identified where the component may be installed without violating one or more predetermined rack stability rules. The method then uses the lift apparatus to raise the component into a selected one of the one or more available rack locations. The components are preferably information technology components, such as servers, network switches and power distribution units.