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1.发明授权公开(公告)号：US07732902B2
公开(公告)日：2010-06-08
申请号：US11516469
申请日：2006-09-05
IPC分类号： H01L23/02
CPC分类号： H01L23/26 , G01J5/045 , H01L2924/0002 , Y10T428/24355 , Y10T428/31678 , H01L2924/00
摘要： A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
摘要翻译： 半导体封装包括在空腔中具有第一表面部分的衬底。 第一表面部分包括人造地形成的草结构。 该包装包括形成在草地结构上的吸气膜。
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公开(公告)号：US07147908B2
公开(公告)日：2006-12-12
申请号：US10964331
申请日：2004-10-13
CPC分类号： H01L23/26 , G01J5/045 , H01L2924/0002 , Y10T428/24355 , Y10T428/31678 , H01L2924/00
摘要： A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
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3.发明授权公开(公告)号：US07205675B2
公开(公告)日：2007-04-17
申请号：US10353632
申请日：2003-01-29
CPC分类号： H01L35/32 , G11B9/10 , H01L23/38 , H01L2924/0002 , H01L2924/09701 , H01L2924/10158 , Y10S257/93 , H01L2924/00
摘要： A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.
摘要翻译： 微制造装置包括其中形成有孔的支撑结构和设置在孔内的装置基板。 微制造装置还包括将装置基板热耦合到支撑结构的热隔离结构。 热隔离结构包括至少一个n掺杂区域和形成在隔热结构上或隔热结构中并且彼此分离的至少一个p掺杂区域。 此外，隔热结构包括连接至少一个n掺杂区域和至少一个p掺杂区域的电互连，形成集成的热电装置。
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公开(公告)号：US06969667B2
公开(公告)日：2005-11-29
申请号：US10114392
申请日：2002-04-01
IPC分类号： H01L25/18 , B81B7/00 , H01L21/50 , H01L21/60 , H01L21/98 , H01L23/02 , H01L23/10 , H01L25/065 , H01L25/07 , H01L21/30
CPC分类号： H01L25/50 , B81B7/0006 , H01L21/50 , H01L23/10 , H01L24/81 , H01L25/0657 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16105 , H01L2224/81191 , H01L2224/81801 , H01L2225/06513 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01032 , H01L2924/01033 , H01L2924/01073 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2224/05541 , H01L2224/05005
摘要： An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation condition. The deformation condition can be a predetermined pressure from opposing surfaces on the first and second substrates or it can be a predetermined combination of temperature and pressure from opposing surfaces on the first and second substrates.
摘要翻译： 电气装置包括分别制造在第一基板中的多个集成电路，该第一基板通过在变形条件之上而不是在变形条件下变形的结合到第二基板上。 变形条件可以是来自第一和第二基板上的相对表面的预定压力，或者它可以是来自第一和第二基板上的相对表面的温度和压力的预定组合。
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公开(公告)号：US07508132B2
公开(公告)日：2009-03-24
申请号：US10689819
申请日：2003-10-20
IPC分类号： H01J61/26
CPC分类号： H01L23/26 , B81C1/00285 , H01L27/12 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： A device including a substrate, a getter structure coupled to the substrate, and a photomask disposed over the getter structure. The photomask has a substantially transmissive and a substantially non-transmissive region. The substantially transmissive region substantially aligns with the getter structure.
摘要翻译： 包括衬底，耦合到衬底的吸气体结构和设置在吸气剂结构上的光掩模的器件。 光掩模具有基本上透射的和基本上非透射的区域。 基本上透射的区域基本上与吸气剂结构对准。
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6.发明申请公开(公告)号：US20070052108A1
公开(公告)日：2007-03-08
申请号：US11516469
申请日：2006-09-05
申请人： James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
发明人： James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
IPC分类号： H01L23/52
CPC分类号： H01L23/26 , G01J5/045 , H01L2924/0002 , Y10T428/24355 , Y10T428/31678 , H01L2924/00
摘要： A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
摘要翻译： 半导体封装包括在空腔中具有第一表面部分的衬底。 第一表面部分包括人造地形成的草结构。 该包装包括形成在草地结构上的吸气膜。
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7.发明申请公开(公告)号：US20060083896A1
公开(公告)日：2006-04-20
申请号：US10964331
申请日：2004-10-13
申请人： James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
发明人： James McKinnell , Chien-Hua Chen , Kenneth Diest , Kenneth Kramer , Daniel Kearl
IPC分类号： G11B5/64
CPC分类号： H01L23/26 , G01J5/045 , H01L2924/0002 , Y10T428/24355 , Y10T428/31678 , H01L2924/00
摘要： A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
摘要翻译： 半导体封装包括在空腔中具有第一表面部分的衬底。 第一表面部分包括人造地形成的草结构。 该包装包括形成在草地结构上的吸气膜。
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公开(公告)号：US07211881B2
公开(公告)日：2007-05-01
申请号：US10808068
申请日：2004-03-24
申请人： James McKinnell , Kenneth Diest , Chien-Hua Chen
发明人： James McKinnell , Kenneth Diest , Chien-Hua Chen
IPC分类号： H01L23/02
CPC分类号： H01L23/26 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.
摘要翻译： 气密密封区域包括其上具有微电子的衬底。 干燥剂可操作地设置在密封区域内。 基本上保持在干燥剂周围的等电位区域。
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公开(公告)号：US20050212115A1
公开(公告)日：2005-09-29
申请号：US10808068
申请日：2004-03-24
申请人： James McKinnell , Kenneth Diest , Chien-Hua Chen
发明人： James McKinnell , Kenneth Diest , Chien-Hua Chen
CPC分类号： H01L23/26 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially maintained around the desiccant.
摘要翻译： 气密密封区域包括其上具有微电子的基板。 干燥剂可操作地设置在密封区域内。 基本上保持在干燥剂周围的等电位区域。
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10.发明授权Particle tolerant ink-feed channel structure for fully integrated inkjet printhead 有权用于全集成喷墨打印头的耐磨油墨通道结构公开(公告)号：US06364466B1
公开(公告)日：2002-04-02
申请号：US09727429
申请日：2000-11-30
申请人： Chien-Hua Chen , Kenneth M. Kramer
发明人： Chien-Hua Chen , Kenneth M. Kramer
IPC分类号： B41J205
CPC分类号： B41J2/17513 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B41J2002/14467
摘要： Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including a resistive layer, are formed on a top surface of a silicon substrate. The various layers are etched to provide heater resistors and conductors. The thin film layers are also etched to expose portions of the upper surface of the substrate where ink feed holes leading into ink chambers are to be formed. A trench is etched in the bottom surface of the substrate while leaving a relatively thin membrane of the substrate underlying the thin film layers. After the trench is formed and using a backside etch, ink feed holes are formed in the substrate membrane leading from the trench to the ink chambers. Ink channels are also formed in the substrate membrane leading to sides of the ink feed holes. These channels preferably have widths smaller than the widths of the ink feed holes. Ink particles or other particles which may clog an ink feed hole opening do not block the narrower channels leading to the sides of the ink feed holes. Various examples of such channels and ink feed holes are described to form a particle-tolerant printhead for use in an inkjet printer.
摘要翻译： 这里描述的是使用集成电路技术形成的单片打印头。 包括电阻层的薄膜层形成在硅衬底的顶表面上。 蚀刻各层以提供加热电阻和导体。 还蚀刻薄膜层以暴露出将要形成通向墨水腔的墨水供给孔的基板的上表面的部分。 在衬底的底表面中蚀刻沟槽，同时留下薄膜层下面的较薄的衬底的薄膜。 在形成沟槽并使用背面蚀刻之后，在从沟槽引导到墨室的基板膜中形成墨水供给孔。 油墨通道也形成在通向油墨供给孔侧面的基板膜中。 这些通道优选具有小于供墨孔的宽度的宽度。 可能堵塞墨水供给孔开口的墨水颗粒或其它颗粒不会阻塞通向墨水供给孔侧面的较窄通道。 描述了这种通道和供墨孔的各种实例以形成用于喷墨打印机的耐磨性打印头。
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