公开(公告)号：US20070263698A1

公开(公告)日：2007-11-15

申请号：US11545506

申请日：2006-10-11

Applicant: Kevin Lin ,  Vincent Weng ,  James Huang

Inventor： Kevin Lin ,  Vincent Weng ,  James Huang

IPC: G01K1/08

CPC classification number: G01J5/02 ,  G01J5/021

Abstract: The present invention discloses a probe cover for an ear thermometer, which comprises: a film cover and a base. The film cover has a cover window able to contact the probe window at the front end of the ear thermometer and a hollow cone able to contact the sidewall of the probe. The width of the cover window is greater than the width of the probe window. Thereby, the present invention can prevent the variation of infrared transmittance caused by the misarrangement and non-uniform thickness of the probe cover film disposed at the front of the probe window.

Abstract translation: 本发明公开了一种用于耳温度计的探针盖，其包括：胶片盖和底座。 胶片盖具有能够接触耳温度计前端的探针窗口和能够接触探针侧壁的中空锥体的盖窗。 盖窗口的宽度大于探头窗口的宽度。 由此，本发明能够防止由设置在探针窗前部的探针覆盖膜的误差和不均匀厚度引起的红外线透射率的变化。

公开(公告)号：US06190041B1

公开(公告)日：2001-02-20

申请号：US09327478

申请日：1999-06-09

Applicant: James Huang ,  Kevin Lin

Inventor： James Huang ,  Kevin Lin

IPC: G01K100

CPC classification number: G01J5/08 ,  A61B5/01 ,  G01J5/04 ,  G01J5/049 ,  G01J5/0818 ,  G01J5/0834 ,  G01J5/62

Abstract: The shutter construction of a tympanic thermometer comprises a base formed with a horizontal groove and a vertical slot that communicate with each other, wherein said horizontal groove is for mounting a wave guiding duct; a supporting frame formed at the rear end of said base and formed with at least a first engaging portion and at least a second engaging portion; a shutter plate mounted in said vertical slot for closing said wave guiding duct; a linking element, the fore end of the linking element being coupled to the lower portion of said shutter plate and the rear end of the linking element being engaged with said first engaging portion of said supporting frame so that the fore end of the linking element can be swayed up and down relative to the rear end thereof; a spring element, the fore end of the spring element being coupled to said linking element; and an actuating element, the fore end of the actuating element being engaged with said second engaging portion of said supporting frame and the rear end of the supporting frame being coupled to the rear end of said spring element so that the rear end of said actuating element can be swayed up and down relative to the fore end of said actuating element, thereby said linking element can be moved down by said spring element when said actuating element is pressed down.

Abstract translation: 鼓膜温度计的快门结构包括形成有水平槽和垂直槽的基座，所述垂直槽彼此连通，其中所述水平槽用于安装波导管; 支撑框架，形成在所述底座的后端，并形成有至少第一接合部分和至少第二接合部分; 安装在所述垂直槽中的挡板，用于关闭所述波导管; 联接元件的前端联接到所述活门板的下部，并且连接元件的后端与所述支撑框架的所述第一接合部分接合，使得连接元件的前端可以 相对于其后端上下摆动; 弹簧元件，弹簧元件的前端联接到所述连接元件; 和致动元件，所述致动元件的前端与所述支撑框架的所述第二接合部分接合，并且所述支撑框架的后端联接到所述弹簧元件的后端，使得所述致动元件的后端 可以相对于所述致动元件的前端上下摆动，由此当所述致动元件被按压时，所述连接元件可以被所述弹簧元件向下移动。

公开(公告)号：US07722250B2

公开(公告)日：2010-05-25

申请号：US12318357

申请日：2008-12-29

Applicant: Vincent Weng ,  Kevin Lin ,  James Huang

Inventor： Vincent Weng ,  Kevin Lin ,  James Huang

IPC: G01K1/08

CPC classification number: G01J5/02 ,  G01J5/021

Abstract: The present invention discloses a probe cover for an ear thermometer, which comprises: a film cover and a base. The film cover has a cover window able to contact the probe window at the front end of the ear thermometer, a hollow cone able to contact the sidewall of the probe and a strengthened element able to contact the cover window and the hollow cone. The thickness of the cover window is same as the thickness of the strengthened element and greater than the thickness of the hollow cone. Thereby, the present invention can prevent the variation of infrared transmittance caused by the misarrangement and non-uniform thickness of the probe cover film disposed at the front of the probe window.

Abstract translation: 本发明公开了一种用于耳温度计的探针盖，其包括：胶片盖和底座。 胶片盖具有能够接触耳温度计前端的探针窗口的遮盖窗口，能够接触探针侧壁的中空锥体和能够接触遮盖窗和中空锥体的加强元件。 盖窗的厚度与加强元件的厚度相同，大于中空锥体的厚度。 由此，本发明能够防止由设置在探针窗前部的探针覆盖膜的误差和不均匀厚度引起的红外线透射率的变化。

公开(公告)号：US20090116540A1

公开(公告)日：2009-05-07

申请号：US12318357

申请日：2008-12-29

Applicant: Vincent Weng ,  Kevin Lin ,  James Huang

Inventor： Vincent Weng ,  Kevin Lin ,  James Huang

IPC: G01K1/08

CPC classification number: G01J5/02 ,  G01J5/021

Abstract: The present invention discloses a probe cover for an ear thermometer, which comprises: a film cover and a base. The film cover has a cover window able to contact the probe window at the front end of the ear thermometer, a hollow cone able to contact the sidewall of the probe and a strengthened element able to contact the cover window and the hollow cone. The thickness of the cover window is same as the thickness of the strengthened element and greater than the thickness of the hollow cone. Thereby, the present invention can prevent the variation of infrared transmittance caused by the misarrangement and non-uniform thickness of the probe cover film disposed at the front of the probe window.

Abstract translation: 本发明公开了一种用于耳温度计的探针盖，其包括：胶片盖和底座。 胶片盖具有能够接触耳温度计前端的探针窗口的遮盖窗口，能够接触探针侧壁的中空锥体和能够接触遮盖窗和中空锥体的加强元件。 盖窗的厚度与加强元件的厚度相同，大于中空锥体的厚度。 由此，本发明能够防止由设置在探针窗前部的探针覆盖膜的误差和不均匀厚度引起的红外线透射率的变化。

公开(公告)号：US20150171010A1

公开(公告)日：2015-06-18

申请号：US14133385

申请日：2013-12-18

Applicant: Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

Inventor： Robert L. Bristol ,  Kevin Lin ,  Kanwal Jit Singh ,  Alan M. Myers ,  Richard E. Schenker

IPC: H01L23/522 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768

CPC classification number: H01L21/76897 ,  H01L21/0274 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/76802 ,  H01L21/76808 ,  H01L21/76816 ,  H01L21/76825 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects is described. In an example, an interconnect structure for an integrated circuit includes a first layer of the interconnect structure disposed above a substrate, the first layer having a first grating of alternating metal lines and dielectric lines in a first direction. The dielectric lines have an uppermost surface higher than an uppermost surface of the metal lines. The integrated circuit also includes a second layer of the interconnect structure disposed above the first layer of the interconnect structure. The second layer includes a second grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. The dielectric lines have a lowermost surface lower than a lowermost surface of the metal lines of the second grating. The dielectric lines of the second grating overlap and contact, but are distinct from, the dielectric lines of the first grating. The integrated circuit also includes a region of dielectric material disposed between the metal lines of the first grating and the metal lines of the second grating, and in a same plane as upper portions of the dielectric lines of the first grating and lower portions of the dielectric lines of the second grating. The region of dielectric material is composed of a cross-linked photolyzable material.

Abstract translation: 描述了用于后端（BEOL）互连的带有光触点的自对准通孔和插头图案。 在一个示例中，用于集成电路的互连结构包括设置在衬底上方的互连结构的第一层，第一层具有在第一方向上交替的金属线和介质线的第一光栅。 介质线具有高于金属线的最上表面的最上表面。 集成电路还包括布置在互连结构的第一层之上的互连结构的第二层。 第二层包括垂直于第一方向的第二方向的交替金属线和介质线的第二光栅。 介质线具有比第二光栅的金属线的最下表面低的最低表面。 第二光栅的介质线与第一光栅的介质线重叠并接触，但不同。 集成电路还包括设置在第一光栅的金属线和第二光栅的金属线之间的电介质材料区域，并且在与第一光栅的介质线的上部和电介质的下部相同的平面中 第二光栅的线。 介电材料的区域由交联的可光致发光材料组成。

公开(公告)号：US20140083858A1

公开(公告)日：2014-03-27

申请号：US13624288

申请日：2012-09-21

Applicant: Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

Inventor： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

IPC: B01D43/00 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0212 ,  H05K1/185 ,  H05K3/0097 ,  H05K2201/097 ,  H05K2203/1536 ,  H05K2203/308 ,  Y10T29/4913

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

公开(公告)号：US20110295349A1

公开(公告)日：2011-12-01

申请号：US13121088

申请日：2008-09-26

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: A61B18/18

CPC classification number: A61N5/0619 ,  A61N5/0616 ,  A61N2005/0643 ,  A61N2005/066

Abstract: A portable far-infrared physiotherapy equipment for thermal moxibustion may comprise at least a heating unit and a power control device connected to the heating unit for supplying power to the latter. The power control device may comprise: a charging control circuit connected to a power supply port to receive power supply from an external power source; an electricity storage unit connected to the charging control circuit to be charged; a power output control unit connecting the charging control circuit and the electricity storage unit to the heating unit respectively to enable to transfer power to the heating unit; and a micro controller unit connected to the electricity storage unit, the charging control circuit and the power output control unit to enable to control them. The present far-infrared physiotherapy equipment for thermal moxibustion is portable and convenient for users.

Abstract translation: 用于热灸的便携式远红外物理治疗设备可以包括至少一个加热单元和连接到加热单元的功率控制装置，用于向后者供电。 功率控制装置可以包括：充电控制电路，连接到电源端口以从外部电源接收电力供应; 连接到要充电的充电控制电路的蓄电单元; 功率输出控制单元，分别将充电控制电路和蓄电单元连接到加热单元，以便能够将功率传递到加热单元; 以及连接到蓄电单元，充电控制电路和功率输出控制单元的微控制器单元，以便能够控制它们。 目前用于热灸的远红外理疗设备便于携带，方便用户使用。

公开(公告)号：US20110163083A1

公开(公告)日：2011-07-07

申请号：US13062856

申请日：2008-09-09

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: H05B1/02

CPC classification number: H05B1/02 ,  A47J27/21058 ,  F24H1/185 ,  F24H9/2014 ,  F24H9/2021 ,  G05D23/1931

Abstract: A heating control device for a heating apparatus comprises a power control unit connected between an external power source and a heating unit of the heating apparatus to transfer power therebetween; a first temperature sensor provided near the heating unit for detecting the temperature thereof; a second temperature sensor provided at a portion of the heating apparatus for containing an object to be heated and for detecting the temperature of the object; a storage unit for storing temperature reference values; a micro controller unit electrically connected to the first and second temperature sensors, the power control unit and the storage unit, which is used to receive temperature signals from the sensors, compare the detected temperatures to the temperature reference values, and command the power control unit to supply the heating unit with different powers. A heating control method therefore is also disclosed.

Abstract translation: 一种用于加热装置的加热控制装置包括连接在外部电源和加热装置的加热单元之间的功率控制单元，用于在其间传递动力; 第一温度传感器，设置在加热单元附近，用于检测其温度; 第二温度传感器，设置在加热装置的一部分，用于容纳待加热物体并检测物体的温度; 用于存储温度参考值的存储单元; 电连接到第一和第二温度传感器的微控制器单元，用于从传感器接收温度信号的功率控制单元和存储单元将检测到的温度与温度参考值进行比较，并且命令功率控制单元 为不同功率的加热单元供电。 因此，还公开了一种加热控制方法。

公开(公告)号：US20100136919A1

公开(公告)日：2010-06-03

申请号：US12452617

申请日：2008-07-28

Applicant: Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

Inventor： Satha Sathananthan ,  Kevin Lin ,  Thanh Bui ,  Dobrica Vasic

IPC: H04B17/00 ,  H04L27/28

CPC classification number: H04L25/0232

Abstract: The present invention relates to methods that can be used in a wireless communication system, and systems adapted to use such methods. In a preferred form the methods are useful in channel estimation in a wireless communication system using orthogonal frequency division multiplexing (OFDM). The system is provided with a control block to optimise channel estimation.

Abstract translation: 本发明涉及可用于无线通信系统的方法，以及适用于使用这种方法的系统。 在优选形式中，该方法在使用正交频分复用（OFDM）的无线通信系统中的信道估计中是有用的。 该系统具有控制块以优化信道估计。

公开(公告)号：US20090238498A1

公开(公告)日：2009-09-24

申请号：US12050426

申请日：2008-03-18

Applicant: Kevin Lin

Inventor： Kevin Lin

IPC: B65D33/00

CPC classification number: B65D75/002 ,  B65D75/28

Abstract: Provided is a compaction package that includes a flexible film portion and a heat shrink film portion coupled to part of the flexible film portion. The compaction package has a bottom, a sidewall, and an open top that together define a hollow interior space adapted to receive and contain a granular material. In a first configuration prior to exposure to a heat source sufficient to raise the temperature of the compaction package to a certain critical heat shrink temperature, the interior space of the compaction package has a first volume. In a second configuration after exposure to the heat source, the interior space of the compaction package has a second volume that is less than the first volume.

Abstract translation: 提供了一种压实包装，其包括柔性膜部分和耦合到柔性膜部分的一部分的热收缩膜部分。 压实包装具有底部，侧壁和开口顶部，其一起限定适于接收和容纳颗粒材料的中空内部空间。 在暴露于足以将压实包装的温度升高到某一临界热收缩温度的热源之前的第一配置中，压实包装的内部空间具有第一容积。 在暴露于热源之后的第二配置中，压缩包装的内部空间具有小于第一容积的第二容积。