摘要:
A medical device for implantation within a patient comprising a lead body including a conductor within the lead body and a transducer supported by the lead body. The conductor is electrically coupled to the transducer by a conductive fluid, paste or gel. The conductive fluid, paste or gel may be contained within a well in the lead body. The transducer may be a MEMS chip and/or an integrated circuit and may perform any of a variety of functions such as sensing physiological data.
摘要:
Communication power in a medical device system is managed by providing power from a power supply to a communication circuit in a sensing device according to a first communication wake up mode set for a first time period and according to a second communication wake up mode set for a second time period. The second communication wake-up mode is established by a second device.
摘要:
An implantable pedometer for measuring the amount of joint use is disclosed. The implantable pedometer includes a sensor adapted for detecting indicators of joint usage. A counter is configured for storing count data corresponding to the number of indicators detected by the sensor and a telemetry circuit is configured for transmitting the count data outside of the body.
摘要:
An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.
摘要:
This disclosure relates to implantable medical devices (IMDs); in particular, to medical electrical leads having an integrated sensor disposed in a hermetic package and said sensor package accommodates a torque coil and an elongated cable conductor extending therethrough. The integrated sensor can include a pressure sensor, an accelerometer, and the like. The coil and the cable can couple to pacing and sensing electrode coupled to the lead distal to the sensor package. The sensor package is compact, substantially circular in cross section and robust, in that the overall design promote mechanical stability.
摘要:
Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.
摘要:
An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
摘要:
Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.
摘要:
This disclosure describes antenna structures for use with implantable medical devices (IMDs). The IMD may include a housing that hermetically encloses electronic components of the IMD and a fixation mechanism that attaches the IMD to a target location within a patient, such as a wall of a vessel. The fixation mechanism may function as a radiating element of an antenna of the IMD. The fixation mechanism may be attached to a housing of the IMD with two different members. One member may be an anchoring structure that mechanically anchors the fixation mechanism to the housing. The second member may be a connector that electrically connects the fixation mechanism to the housing such that the fixation mechanism is configured to transmit and/or receive communication signals with other implantable or external devices.
摘要:
An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.