Contactless interconnect for transducers
    1.
    发明授权
    Contactless interconnect for transducers 失效
    用于传感器的非接触式互连

    公开(公告)号:US07684872B2

    公开(公告)日:2010-03-23

    申请号:US11380315

    申请日:2006-04-26

    IPC分类号: A61N1/08

    摘要: A medical device for implantation within a patient comprising a lead body including a conductor within the lead body and a transducer supported by the lead body. The conductor is electrically coupled to the transducer by a conductive fluid, paste or gel. The conductive fluid, paste or gel may be contained within a well in the lead body. The transducer may be a MEMS chip and/or an integrated circuit and may perform any of a variety of functions such as sensing physiological data.

    摘要翻译: 一种用于植入患者体内的医疗装置,包括:引线体,其包括引线体内的导体;以及由引线体支撑的换能器。 导体通过导电流体,糊剂或凝胶电耦合到换能器。 导电流体,糊状物或凝胶可以包含在引线体内的阱中。 换能器可以是MEMS芯片和/或集成电路,并且可以执行诸如感测生理数据的各种功能中的任何一种。

    Pressure sensor configurations for implantable medical electrical leads
    4.
    发明授权
    Pressure sensor configurations for implantable medical electrical leads 有权
    用于植入式医疗电线的压力传感器配置

    公开(公告)号:US07886608B2

    公开(公告)日:2011-02-15

    申请号:US12544342

    申请日:2009-08-20

    IPC分类号: G01L9/12

    摘要: An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

    摘要翻译: 可植入的压力传感器,其可并入可植入医疗电引线内,包括绝缘侧壁,其包含间隙电容器和集成电路。 压力传感器的绝缘侧壁包括压敏膜部分,并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板 第一电极板并且耦合到集成电路,其通过侧壁耦合到电源触点和接地触点。 导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

    Implantable capacitive pressure sensor system and method
    6.
    发明授权
    Implantable capacitive pressure sensor system and method 有权
    可植入电容式压力传感器系统及方法

    公开(公告)号:US08118748B2

    公开(公告)日:2012-02-21

    申请号:US11116804

    申请日:2005-04-28

    IPC分类号: A61B5/02

    摘要: Embodiments of the invention provide systems and methods for an implantable capacitive pressure sensor. Some embodiments of the invention include a capacitive pressure sensor capsule comprising a substrate, a conductive plate functionally coupled to the substrate, a conductive diaphragm spaced from the conductive plate and functionally coupled to the substrate, a lid hermetically sealed against the substrate, and pressure sensing circuitry disposed within a volume generally defined by the lid and the substrate. Embodiments of the invention also include a lead provided with an implantable pressure sensor capsule and a method of manufacturing a capacitive pressure sensor capsule.

    摘要翻译: 本发明的实施例提供了一种用于可植入电容式压力传感器的系统和方法。 本发明的一些实施例包括电容式压力传感器胶囊,其包括基底,功能性地连接到基底的导电板,与导电板隔开并功能耦合到基底的导电隔膜,密封地密封在基底上的盖,以及压力感测 设置在通常由盖和基板限定的体积内的电路。 本发明的实施例还包括具有可植入压力传感器胶囊的引线和制造电容式压力传感器胶囊的方法。

    Antenna structures for implantable medical devices
    9.
    发明授权
    Antenna structures for implantable medical devices 有权
    用于可植入医疗器械的天线结构

    公开(公告)号:US08939905B2

    公开(公告)日:2015-01-27

    申请号:US13250755

    申请日:2011-09-30

    摘要: This disclosure describes antenna structures for use with implantable medical devices (IMDs). The IMD may include a housing that hermetically encloses electronic components of the IMD and a fixation mechanism that attaches the IMD to a target location within a patient, such as a wall of a vessel. The fixation mechanism may function as a radiating element of an antenna of the IMD. The fixation mechanism may be attached to a housing of the IMD with two different members. One member may be an anchoring structure that mechanically anchors the fixation mechanism to the housing. The second member may be a connector that electrically connects the fixation mechanism to the housing such that the fixation mechanism is configured to transmit and/or receive communication signals with other implantable or external devices.

    摘要翻译: 本公开描述了与可植入医疗装置(IMD)一起使用的天线结构。 IMD可以包括密封地包围IMD的电子部件的壳体和将IMD附接到病人(例如血管壁)内的目标位置的固定机构。 固定机构可以用作IMD天线的辐射元件。 固定机构可以用两个不同的构件附接到IMD的壳体。 一个构件可以是将固定机构机械地锚定到壳体的锚固结构。 第二构件可以是将固定机构电连接到壳体的连接器,使得固定机构配置成与其他可植入或外部装置传输和/或接收通信信号。

    PRESSURE SENSOR CONFIGURATIONS FOR IMPLANTABLE MEDICAL ELECTRICAL LEADS
    10.
    发明申请
    PRESSURE SENSOR CONFIGURATIONS FOR IMPLANTABLE MEDICAL ELECTRICAL LEADS 有权
    用于可植入式医疗电源的压力传感器配置

    公开(公告)号:US20090308169A1

    公开(公告)日:2009-12-17

    申请号:US12544342

    申请日:2009-08-20

    IPC分类号: G01L9/12

    摘要: An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

    摘要翻译: 可植入的压力传感器,其可并入可植入医疗电引线内,包括绝缘侧壁,其包含间隙电容器和集成电路。 压力传感器的绝缘侧壁包括压敏膜部分,并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板 第一电极板并且耦合到集成电路,其通过侧壁耦合到电源触点和接地触点。 导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。