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1.发明授权公开(公告)号：US07253503B1
公开(公告)日：2007-08-07
申请号：US10986634
申请日：2004-11-12
IPC分类号： H01L23/495
CPC分类号： H01L23/66 , H01L23/3121 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/40 , H01L2224/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48195 , H01L2224/48227 , H01L2224/48228 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/078 , H01L2924/14 , H01L2924/181 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012
摘要： Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad and planar metal are attached to the second surface of the polyimide sheet. The apertures in the polyimide sheet are juxtaposed to the leads. A package made using the substrate includes an integrated circuit device mounted above the first surface of the polyimide sheet opposite the die pad. Bond wires are connected between the integrated circuit device and the leads through the apertures in the polyimide sheet. An encapsulant material covers the first surface of the polyimide sheet, the integrated circuit device, the bone wires, and the apertures. The die pad and leads are exposed at an exterior surface of the package.
摘要翻译： 公开了用于制造封装的集成电路器件封装和衬底。 衬底的一个实施例包括具有第一表面，相对的第二表面以及第一和第二表面之间的孔的聚酰亚胺的平面片。 平面金属管芯焊盘和平面金属附接到聚酰亚胺片的第二表面。 聚酰亚胺片中的孔与引线并列。 使用该基板制成的封装包括集成电路装置，安装在与芯片衬垫相对的聚酰亚胺片的第一表面上方。 接合线通过聚酰亚胺片中的孔连接在集成电路器件和引线之间。 密封剂材料覆盖聚酰亚胺片的第一表面，集成电路器件，骨线和孔。 芯片焊盘和引线暴露在封装的外表面。
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2.发明授权公开(公告)号：US06580159B1
公开(公告)日：2003-06-17
申请号：US09434589
申请日：1999-11-05
IPC分类号： H01L23495
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/0665 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad and planar metal are attached to the second surface of the polyimide sheet. The apertures in the polyimide sheet are juxtaposed to the leads. A package made using the substrate includes an integrated circuit device mounted above the first surface of the polyimide sheet opposite the die pad. Bond wires are connected between the integrated circuit device and the leads through the apertures in the polyimide sheet. An encapsulant material covers the first surface of the polyimide sheet, the integrated circuit device, the bond wires, and the apertures. The die pad and leads are exposed at an exterior surface of the package.
摘要翻译： 公开了用于制造封装的集成电路器件封装和衬底。 衬底的一个实施例包括具有第一表面，相对的第二表面以及第一和第二表面之间的孔的聚酰亚胺的平面片。 平面金属管芯焊盘和平面金属附接到聚酰亚胺片的第二表面。 聚酰亚胺片中的孔与引线并列。 使用该基板制成的封装包括集成电路装置，安装在与芯片衬垫相对的聚酰亚胺片的第一表面上方。 接合线通过聚酰亚胺片中的孔连接在集成电路器件和引线之间。 密封剂材料覆盖聚酰亚胺片的第一表面，集成电路器件，接合线和孔。 芯片焊盘和引线暴露在封装的外表面。
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3.发明授权公开(公告)号：US06833609B1
公开(公告)日：2004-12-21
申请号：US10354772
申请日：2003-01-30
IPC分类号： H01L2338
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/27013 , H01L2224/2919 , H01L2224/32013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2924/0665 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad and planar metal are attached to the second surface of the polyimide sheet. The apertures in the polyimide sheet are juxtaposed to the leads. A package made using the substrate includes an integrated circuit device mounted above the first surface of the polyimide sheet opposite the die pad. Bond wires are connected between the integrated circuit device and the leads through the apertures in the polyimide sheet. An encapsulant material covers the first surface of the polyimide sheet, the integrated circuit device, the bond wires, and the apertures. The die pad and leads are exposed at an exterior surface of the package.
摘要翻译： 公开了用于制造封装的集成电路器件封装和衬底。 衬底的一个实施例包括具有第一表面，相对的第二表面以及第一和第二表面之间的孔的聚酰亚胺的平面片。 平面金属管芯焊盘和平面金属附接到聚酰亚胺片的第二表面。 聚酰亚胺片中的孔与引线并列。 使用该基板制成的封装包括集成电路装置，安装在与芯片衬垫相对的聚酰亚胺片的第一表面上方。 接合线通过聚酰亚胺片中的孔连接在集成电路器件和引线之间。 密封剂材料覆盖聚酰亚胺片的第一表面，集成电路器件，接合线和孔。 芯片焊盘和引线暴露在封装的外表面。
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4.发明授权Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages 有权制造具有改进的热性能的薄集成电路器件封装的方法和用于制造封装的衬底公开(公告)号：US06331451B1
公开(公告)日：2001-12-18
申请号：US09434546
申请日：1999-11-05
IPC分类号： H01L2158
CPC分类号： H01L24/32 , H01L21/561 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/27013 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48599 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/97 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , Y10T29/49128 , H01L2924/00014 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： Methods of making integrated circuit device packages and substrates for making the packages are disclosed. An embodiment of a method of making a substrate includes providing an unpatterned sheet of polyimide material having a first surface and an opposite second surface. A planar metal layer is attached to the second surface of the polyimide sheet. The metal layer is patterned to form an array of package sites, with each site including a planar die pad and planar leads. Apertures are formed through the polyimide sheet, either before or after attaching the metal layer. Each aperture is juxtaposed with a lead allowing access thereto. A method of making a package using the substrate includes mounting an integrated circuit device above the die pad (e.g., on the substrate or on the die pad through an aperture in the substrate). Bond wires are connected between the integrated circuit device and the leads through the apertures. An insulative encapsulant is applied so as to cover the integrated circuit device and fill the apertures. A method of making multiple packages includes a final step of cutting an encapsulated array of package sites with a saw to separate individual packages.
摘要翻译： 公开了制造集成电路器件封装和制造封装的衬底的方法。 制造基板的方法的实施例包括提供具有第一表面和相对的第二表面的未图案化的聚酰亚胺材料片。 平面金属层附接到聚酰亚胺片的第二表面。 将金属层图案化以形成封装位置的阵列，其中每个位置包括平面管芯焊盘和平面引线。 在安装金属层之前或之后，通过聚酰亚胺片形成孔。 每个孔与一个允许进入其的引线并置。 使用衬底制造封装的方法包括将集成电路器件安装在管芯焊盘之上（例如，在衬底上或通过衬底中的孔的芯片焊盘上）。 接合线通过孔连接在集成电路器件和引线之间。 施加绝缘密封剂以覆盖集成电路器件并填充孔。 制造多个包装的方法包括用锯切割封装位置的封装阵列以分离单独包装的最后步骤。
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