公开(公告)号：US20050206457A1

公开(公告)日：2005-09-22

申请号：US10980394

申请日：2004-11-03

申请人： James Martin ,  Izzac Khayo ,  Rich Keenan ,  Valter Karavanic ,  Greg Mendolia

发明人： James Martin ,  Izzac Khayo ,  Rich Keenan ,  Valter Karavanic ,  Greg Mendolia

IPC分类号： H03F1/02 ,  H03F1/56 ,  H03F3/189 ,  H03F3/191 ,  H03F3/68

CPC分类号： H03F3/68 ,  H03F1/0211 ,  H03F1/565 ,  H03F3/189 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/451 ,  H04B1/0458

摘要： An embodiment of the present invention provides an amplifier system, comprising at least one variable impedance matching network, the output of which provides the input to at least one amplifier stage or provides an output of the power amplifier itself, and a bias network associated with the at least one amplifier stage. The amplifier system may further comprise a controller enabling impedance control to the at least one variable impedance matching network and a supply voltage provided to the at least one variable impedance network and/or the at least one amplifier stage and wherein the at least one variable impedance network and the at least one amplifier stage may be a plurality of impedance networks connected to a plurality of amplifier stages. The at least one variable impedance network may include at least one variable capacitor and the at least one variable capacitor may be a voltage tunable dielectric capacitor which may include Parascan® voltage tunable dielectric material.

摘要翻译： 本发明的实施例提供了一种放大器系统，其包括至少一个可变阻抗匹配网络，其输出为至少一个放大器级提供输入或提供功率放大器本身的输出，以及与该功率放大器本身相关联的偏置网络 至少一个放大器级。 放大器系统还可以包括控制器，其实现至少一个可变阻抗匹配网络的阻抗控制和提供给至少一个可变阻抗网络和/或至少一个放大器级的电源电压，并且其中所述至少一个可变阻抗 网络，并且所述至少一个放大器级可以是连接到多个放大器级的多个阻抗网络。 所述至少一个可变阻抗网络可以包括至少一个可变电容器，并且所述至少一个可变电容器可以是可以包括Parascan（R）电压可调电介质材料的电压可调介质电容器。

公开(公告)号：US07151411B2

公开(公告)日：2006-12-19

申请号：US10980394

申请日：2004-11-03

申请人： James Martin ,  Izzac Khayo ,  Rich Keenan ,  Valter Karavanic ,  Greg Mendolia

发明人： James Martin ,  Izzac Khayo ,  Rich Keenan ,  Valter Karavanic ,  Greg Mendolia

IPC分类号： H03F3/04

CPC分类号： H03F3/68 ,  H03F1/0211 ,  H03F1/565 ,  H03F3/189 ,  H03F2200/222 ,  H03F2200/318 ,  H03F2200/387 ,  H03F2200/451 ,  H04B1/0458

摘要： An embodiment of the present invention provides an amplifier system, comprising at least one variable impedance matching network, the output of which provides the input to at least one amplifier stage or provides an output of the power amplifier itself, and a bias network associated with the at least one amplifier stage. The amplifier system may further comprise a controller enabling impedance control to the at least one variable impedance matching network and a supply voltage provided to the at least one variable impedance network and/or the at least one amplifier stage and wherein the at least one variable impedance network and the at least one amplifier stage may be a plurality of impedance networks connected to a plurality of amplifier stages. The at least one variable impedance network may include at least one variable capacitor and the at least one variable capacitor may be a voltage tunable dielectric capacitor which may include Parascan® voltage tunable dielectric material.

摘要翻译： 本发明的实施例提供了一种放大器系统，其包括至少一个可变阻抗匹配网络，其输出为至少一个放大器级提供输入或提供功率放大器本身的输出，以及与该功率放大器本身相关联的偏置网络 至少一个放大器级。 放大器系统还可以包括控制器，其实现至少一个可变阻抗匹配网络的阻抗控制和提供给至少一个可变阻抗网络和/或至少一个放大器级的电源电压，并且其中所述至少一个可变阻抗 网络，并且所述至少一个放大器级可以是连接到多个放大器级的多个阻抗网络。 所述至少一个可变阻抗网络可以包括至少一个可变电容器，并且所述至少一个可变电容器可以是可以包括Parascan（R）电压可调电介质材料的电压可调介质电容器。

公开(公告)号：US20060267174A1

公开(公告)日：2006-11-30

申请号：US11349500

申请日：2006-02-06

申请人： William Macropoulos ,  Greg Mendolia ,  Izzac Khayo

发明人： William Macropoulos ,  Greg Mendolia ,  Izzac Khayo

IPC分类号： H01L23/02

CPC分类号： H05K1/145 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/09063

摘要： An embodiment of the present invention provides an apparatus, comprising a plurality of stacked substrates, wherein the substrates are capable of accepting surface mounted components (SMCs) and wherein the plurality of stacked substrates are separated and connected by the surface mounted components (SMC) or solder balls or both.

摘要翻译： 本发明的一个实施例提供了一种装置，包括多个堆叠的基板，其中所述基板能够接受表面安装部件（SMC），并且其中所述多个堆叠的基板由表面安装的部件（SMC）分离和连接， 焊球或两者。

公开(公告)号：US20090078456A1

公开(公告)日：2009-03-26

申请号：US12286012

申请日：2008-09-27

申请人： William Macropoulos ,  Izzac Khayo ,  Greg Mendolia

发明人： William Macropoulos ,  Izzac Khayo ,  Greg Mendolia

IPC分类号： H01L21/50 ,  H01R12/04

CPC分类号： H05K1/144 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/165 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0187 ,  H05K2201/045 ,  H05K2201/09972 ,  H05K2201/1031 ,  H05K2201/10636 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/0401

摘要： At least an embodiment of the present technology provides a method of manufacturing a mechanically adapting interconnecting device for multi-substrate packages comprising placing a metal laminate on each side of a polymer composite, forming a channel in the metal laminate; and metallizing the laminate to create a metal connection inside the channel.

摘要翻译： 本技术的至少一个实施例提供了一种制造用于多基板封装的机械适应互连装置的方法，包括在金属层压板中形成通道的聚合物复合材料的每一侧上放置金属层压板; 并且对层压体进行金属化以在通道内形成金属连接。

公开(公告)号：US20060245308A1

公开(公告)日：2006-11-02

申请号：US11361513

申请日：2006-02-24

申请人： William Macropoulos ,  Izzac Khayo ,  Greg Mendolia

发明人： William Macropoulos ,  Izzac Khayo ,  Greg Mendolia

IPC分类号： H04B1/20

CPC分类号： H05K1/144 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/0237 ,  H05K1/024 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/165 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0187 ,  H05K2201/045 ,  H05K2201/09972 ,  H05K2201/1031 ,  H05K2201/10636 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/0401

摘要： At least an embodiment of the present technology provides a device, comprising at least one passive component, at least one active component and at least two substrates. The substrates may be advantageously stacked to form a 3D structure. The active and passive components may be advantageously placed in between said substrates to create a compact monolithic 3D device. At least one embodiment of the technology comprises at least a passive component disposed in between said substrates in order to manipulate, distort or otherwise transform at least one electrical signal from one substrate to the next. In another embodiment of the technology at least an interconnector device may be disposed upon at least one substrate in order to respond to mechanical distortions of said substrates under thermal and mechanical stresses. Said interconnector device may be strategically but disjunctively positioned along with other passive components in order to create a rugged compact more efficient 3D package for high frequency operation.

摘要翻译： 本技术的至少一个实施例提供了一种包括至少一个无源部件，至少一个有源部件和至少两个基板的装置。 衬底可有利地堆叠以形成3D结构。 有源和无源部件可以有利地放置在所述基板之间，以产生紧凑的单片3D装置。 该技术的至少一个实施例至少包括设置在所述基板之间的无源部件，以便操纵，扭曲或以其他方式将至少一个电信号从一个基板转换到下一个基板。 在该技术的另一实施例中，至少一个互连器件可以设置在至少一个衬底上，以便在热和机械应力下响应于所述衬底的机械畸变。 所述互连器件可以与其他无源部件一起战略地分开定位，以便为高频操作创建坚固的紧凑的更有效的3D封装。