公开(公告)号：US08222529B2

公开(公告)日：2012-07-17

申请号：US12588502

申请日：2009-10-16

申请人： Je Hong Sung ,  Jin Waun Kim ,  Myung Whun Chang

发明人： Je Hong Sung ,  Jin Waun Kim ,  Myung Whun Chang

IPC分类号： H05K1/03

CPC分类号： H05K3/4061 ,  H05K1/113 ,  H05K3/0029 ,  H05K3/245 ,  H05K3/4629 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.

摘要翻译： 本发明提供一种陶瓷基板，其特征在于，包括：陶瓷层叠体，其中多个陶瓷层通过设置在各陶瓷层内的通孔进行层叠而互连，所述陶瓷层叠体结构具有设置在其内的孔， 位于作为表层的陶瓷层内的通孔; 填充在孔内的导电材料; 以及外部电极，其形成在陶瓷层叠结构的表面上，使得外部电极与导电材料电连接，及其制造方法。

公开(公告)号：US20110042131A1

公开(公告)日：2011-02-24

申请号：US12588502

申请日：2009-10-16

申请人： Je Hong Sung ,  Jin Waun Kim ,  Myung Whun Chang

发明人： Je Hong Sung ,  Jin Waun Kim ,  Myung Whun Chang

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K3/4061 ,  H05K1/113 ,  H05K3/0029 ,  H05K3/245 ,  H05K3/4629 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.

摘要翻译： 本发明提供一种陶瓷基板，其特征在于，包括：陶瓷层叠体，其中多个陶瓷层通过设置在各陶瓷层内的通孔进行层叠而互连，所述陶瓷层叠体结构具有设置在其内的孔， 位于作为表层的陶瓷层内的通孔; 填充在孔内的导电材料; 以及外部电极，其形成在陶瓷层叠结构的表面上，使得外部电极与导电材料电连接，及其制造方法。

公开(公告)号：US20070246825A1

公开(公告)日：2007-10-25

申请号：US11736201

申请日：2007-04-17

申请人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

发明人： Kwang Jae Oh ,  Je Hong Sung ,  Yoon Hyuck Choi ,  Tae Soo Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K9/003 ,  H05K9/0032 ,  H01L2924/00

摘要： A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.

摘要翻译： 高频模块及其制造方法在该模块中，基板具有接地。 多个表面安装的装置安装在基板上。 金属壁连接到基板的地面。 树脂模制气密地密封表面安装的装置和金属壁，形成为暴露金属壁的顶表面的树脂模制件。 另外，在树脂成形体上形成金属膜，与露出的金属壁的顶面接触。

公开(公告)号：US20080230963A1

公开(公告)日：2008-09-25

申请号：US12076573

申请日：2008-03-20

申请人： Je Hong Sung

发明人： Je Hong Sung

IPC分类号： B28B3/00

CPC分类号： H05K3/4007 ,  H01L21/4867 ,  H05K1/0306 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/28 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0568 ,  H05K2203/308

摘要： There is provided a method of manufacturing an LTCC substrate, capable of enhancing coatability of an external electrode pad, yield of the LTCC substrate as a package and product reliability and ensuring compactness of a product utilizing the LTCC substrate package. The method includes: forming a cavity on external electrode pad forming layers, respectively and filling the cavity with an external electrode pad material; depositing the external electrode pad forming layers on a ceramic stack with a printed circuit pattern formed therein; and sintering the ceramic stack having the external electrode pad forming layers deposited thereon at a low temperature.

摘要翻译： 提供了一种制造LTCC基板的方法，其能够增强外部电极焊盘的涂覆性，LTCC基板的产量作为封装，并且产品可靠性并且确保利用LTCC基板封装的产品的紧凑性。 该方法包括：分别在外部电极焊盘形成层上形成空腔，并用外部电极焊盘材料填充空腔; 将外部电极焊盘形成层沉积在其上形成有印刷电路图案的陶瓷堆叠上; 并且在低温下烧结具有沉积在其上的外部电极焊盘形成层的陶瓷堆叠。

公开(公告)号：US08397379B2

公开(公告)日：2013-03-19

申请号：US13017950

申请日：2011-01-31

申请人： Je Hong Sung ,  Yoon Hyuck Choi

发明人： Je Hong Sung ,  Yoon Hyuck Choi

IPC分类号： H05K3/36

CPC分类号： H05K3/28 ,  H05K3/0073 ,  H05K3/4629 ,  H05K2201/0154 ,  H05K2203/0759 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for fabricating a ceramic substrate includes: preparing a ceramic substrate; disposing a metal mask having a plurality of holes at an upper side of the ceramic substrate; and injecting a polyimide resin into the holes of the metal mask to form a polyimide thin film on the ceramic substrate. A thin film is formed on a ceramic substrate in a simpler manner, so the fabrication cost can be reduced and a fixed time can be shortened, thus increasing the efficiency of a product.

摘要翻译： 陶瓷基板的制造方法包括：制备陶瓷基板; 在陶瓷基板的上侧设置具有多个孔的金属掩模; 并将聚酰亚胺树脂注入到金属掩模的孔中，以在陶瓷基片上形成聚酰亚胺薄膜。 以简单的方式在陶瓷基板上形成薄膜，可以降低制造成本，缩短固定时间，提高产品的效率。