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14 条记录 (耗时 0.02 秒)

    Method for encapsulating a microcomponent using a mechanically reinforced cap
    1.
    发明授权
    Method for encapsulating a microcomponent using a mechanically reinforced cap 有权
    使用机械加强盖封装微组件的方法

    公开(公告)号：US08338282B2

    公开(公告)日：2012-12-25

    申请号：US13019581

    申请日：2011-02-02

    申请人： Jean-Louis Pornin ,  Charlotte Gillot

    发明人： Jean-Louis Pornin ,  Charlotte Gillot

    IPC分类号： H01L21/3213 ,  H01L21/311

    CPC分类号： B81B7/0058 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

    摘要： A method for encapsulating a micro component positioned on and/or in a substrate, including: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap and forming a cavity in which the micro component is positioned, depositing, at least on the cap, at least one layer of plugging material that plugs the at least one opening, and performing a localized deposition of at least one portion of mechanically reinforcing material of the cap, covering at least the cap, wherein the mechanically reinforcing material is not subsequently etched.

    摘要翻译： 一种用于封装位于衬底上和/或衬底中的微组件的方法，包括：沉积覆盖微组件的至少一种牺牲材料，制造覆盖牺牲材料的帽，通过形成于帽上的至少一个开口去除牺牲材料 以及形成其中定位所述微组件的空腔，至少在所述盖上沉积至少一层堵塞所述至少一个开口的堵塞材料，以及执行至少一部分机械增强材料的局部沉积 所述盖至少覆盖所述盖，其中所述机械增强材料未被蚀刻。

    Process for making a structure with hermetically closed cavity under controlled atmosphere
    4.
    发明授权
    Process for making a structure with hermetically closed cavity under controlled atmosphere 有权
    在受控气氛下制作具有密封腔的结构的方法

    公开(公告)号：US08962069B2

    公开(公告)日：2015-02-24

    申请号：US13605019

    申请日：2012-09-06

    申请人： Jean-Louis Pornin ,  Xavier Baillin ,  Charlotte Gillot ,  Laurent Vandroux

    发明人： Jean-Louis Pornin ,  Xavier Baillin ,  Charlotte Gillot ,  Laurent Vandroux

    IPC分类号： B05D5/12 ,  B29C41/20 ,  B81C1/00 ,  H01L23/053 ,  H01L23/31

    CPC分类号： B29C41/20 ,  B81C1/00285 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L23/053 ,  H01L23/315 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.

    摘要翻译： 一种制造封装结构的方法，包括以下步骤：1）当所述材料被加热时，使材料的至少一部分能够释放至少一种气体，所述材料部分与封装的气密封闭腔的内部连通 结构，2）加热所述部分材料的全部或部分，使得至少部分气体从空腔中的所述材料部分释放，并且其中当所述材料为所述材料时能够释放至少一种气体的所述材料部分 被加热的元件被捕获在材料的所述部分中，当所述材料被加热时，所述被捕获元件从气态形式的所述材料部分释放。

    Sealed cavity and method for producing such a sealed cavity
    8.
    发明授权
    Sealed cavity and method for producing such a sealed cavity 有权
    密封腔和制造这种密封腔的方法

    公开(公告)号：US08772883B2

    公开(公告)日：2014-07-08

    申请号：US13381241

    申请日：2010-07-06

    申请人： Jean-Louis Pornin ,  Fabrice Jacquet

    发明人： Jean-Louis Pornin ,  Fabrice Jacquet

    IPC分类号： H01L29/84

    CPC分类号： B81C1/00285 ,  B81B2203/0384 ,  B81C2203/0136 ,  B81C2203/0145

    摘要： A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 μm, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

    摘要翻译： 一种密封空腔的制造方法，包括：a）在基板上制造牺牲层; b）产生覆盖层，该覆盖层至少覆盖牺牲层和未被牺牲层覆盖的衬底的一部分表面，覆盖层包括侧面，其与衬底形成小于90°的角度; c）通过覆盖层的侧面之一产生孔，使得基板和孔的边缘之间的最大距离小于约3μm，穿过覆盖层的一部分上的空穴沉积在 所述基板未被所述牺牲层覆盖; d）通过孔消除牺牲层，形成空腔; 以及e）以密封方式沉积至少一种堵塞所述孔的材料。

    SEALED CAVITY AND METHOD FOR PRODUCING SUCH A SEALED CAVITY
    9.
    发明申请
    SEALED CAVITY AND METHOD FOR PRODUCING SUCH A SEALED CAVITY 有权
    密封孔和生产这种密封空间的方法

    公开(公告)号：US20120112293A1

    公开(公告)日：2012-05-10

    申请号：US13381241

    申请日：2010-07-06

    申请人： Jean-Louis Pornin ,  Fabrice Jacquet

    发明人： Jean-Louis Pornin ,  Fabrice Jacquet

    IPC分类号： H01L29/84 ,  H01L21/02

    CPC分类号： B81C1/00285 ,  B81B2203/0384 ,  B81C2203/0136 ,  B81C2203/0145

    摘要： A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 μm, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

    摘要翻译： 一种密封空腔的制造方法，包括：a）在基板上制造牺牲层; b）产生覆盖层，该覆盖层至少覆盖牺牲层和未被牺牲层覆盖的衬底的一部分表面，覆盖层包括侧面，其与衬底形成小于90°的角度; c）通过覆盖层的侧面之一产生孔，使得基板和孔的边缘之间的最大距离小于约3μm，穿过覆盖层的一部分上的空穴沉积在 所述基板未被所述牺牲层覆盖; d）通过孔消除牺牲层，形成空腔; 以及e）以密封方式沉积至少一种堵塞所述孔的材料。

    METHOD OF ENCAPSULATING A MICROELECTRONIC DEVICE BY A GETTER MATERIAL
    10.
    发明申请
    METHOD OF ENCAPSULATING A MICROELECTRONIC DEVICE BY A GETTER MATERIAL 有权
    通过材料封装微电子器件的方法

    公开(公告)号：US20100003789A1

    公开(公告)日：2010-01-07

    申请号：US12494123

    申请日：2009-06-29

    申请人： Stephane CAPLET ,  Xavier Baillin ,  Jean-Louis Pornin

    发明人： Stephane CAPLET ,  Xavier Baillin ,  Jean-Louis Pornin

    IPC分类号： H01L21/56

    CPC分类号： B81C1/00285 ,  B81C2203/0136 ,  B81C2203/0145

    摘要： A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.

    摘要翻译： 一种封装布置在衬底上的微电子器件的方法，至少包括以下步骤：a）形成覆盖微电子器件的至少一部分的牺牲材料的一部分，其体积占据至少形成的空间 腔体的一部分，其中装置旨在被包封; b）沉积基于至少一种吸气材料的层，覆盖牺牲材料部分的至少一部分; c）通过至少所述吸气材料层形成至少一个孔口，形成对所述牺牲材料部分的通路; d）通过孔口消除部分牺牲材料，形成其中封装有微电子器件的腔体; 和e）密封腔。