摘要:
A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.
摘要:
The invention relates to a frequency filter comprising a structure with, on one face, two extreme evanescent areas and at least one wave guide area between the evanescent areas, characterised in that the at least one wave guide area and the evanescent areas form a single closed cavity, the said single cavity being partitioned by at least two resonator elements that are embedded in the said single cavity at placement areas and that contribute to delimiting the said at least one wave guide area and the evanescent areas. The invention also relates to a process for manufacturing at least one such frequency filter, the said process comprising the following steps: manufacture of a structure comprising at least one cavity on one of its faces, called the back face, embedment of at least two resonator elements in the cavity at placement areas so as to delimit the at least one wave guide area and the evanescent areas.
摘要:
A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.
摘要:
The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4).Application in particular in MEMS.
摘要:
This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on object and on support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of object forms an angle of 70° to 110° with respect to each wettability area of support. Object and support are mutually distant.
摘要:
A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.
摘要:
An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.The invention relates to an electronic device with integrated discrete components (4), including: a wafer (2), a so-called receiving wafer, said wafer having cavities (5, 5′) containing said components, the active face (10) of which is in a same plane as a face (8) of the receiving wafer, a material (6) for laterally coating the components in the cavities.
摘要:
The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4).Application in particular in MEMS.
摘要:
The invention relates to a frequency filter including a structure with, on one face, two extreme evanescent areas and at least one wave guide area between the evanescent areas. The at least one wave guide area and the evanescent areas form a single closed cavity. The single cavity is partitioned by at least two resonator elements that are embedded in the single cavity at placement areas and that contribute to delimiting the at least one wave guide area and the evanescent areas.
摘要:
The invention provides a device for the gravimetric detection of particles in a fluid medium, comprising a flat electromechanical oscillator (1), means for supporting the oscillator, means (15a, 15b, 15c, 15d) for actuating said oscillator and, on either side of the plane of the oscillator (1), two cavities (3, 5) enabling the oscillator (1) to vibrate when it is activated by the actuation means (15a, 15b, 15c, 15d), characterized in that at least one of the two cavities (3, 5) forms an integral part of a channel (2, 4) for the passage of a fluid over at least one of the faces (1a, 1b) of the oscillator and in that said actuation means (15a, 15b, 15c, 15d) take the form of at least one electrode (15a, 15b, 15c, 15d) lying in the same plane as that of the electromechanical oscillator and at a defined distance (g) from the oscillator, so as to ensure that the oscillator vibrates in its plane.