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1.发明授权Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistance 有权微组件具有由具有增强的机械阻力的盖限定的空腔公开(公告)号：US08183474B2
公开(公告)日：2012-05-22
申请号：US12227339
申请日：2007-05-21
IPC分类号： H05K7/14
CPC分类号： B81B3/007 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11). The cap (12) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b), said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).
摘要翻译： 它由微组件组成，其包括由封闭由衬底（11）支撑的有源部分（10）的盖（12）限定的空腔（13）。 盖（12）包括顶壁（12a），其包括具有至少一个突出加强构件（12b）的加强装置，所述加强构件（12b）位于顶壁（12a）的两个凹陷区域（12c）之间，并且具有 在与凹陷区域（12c）相距一定距离处的一端（14），而不与衬底（11）接触。
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公开(公告)号：US08772883B2
公开(公告)日：2014-07-08
申请号：US13381241
申请日：2010-07-06
申请人： Jean-Louis Pornin , Fabrice Jacquet
发明人： Jean-Louis Pornin , Fabrice Jacquet
IPC分类号： H01L29/84
CPC分类号： B81C1/00285 , B81B2203/0384 , B81C2203/0136 , B81C2203/0145
摘要： A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 μm, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.
摘要翻译： 一种密封空腔的制造方法，包括：a）在基板上制造牺牲层; b）产生覆盖层，该覆盖层至少覆盖牺牲层和未被牺牲层覆盖的衬底的一部分表面，覆盖层包括侧面，其与衬底形成小于90°的角度; c）通过覆盖层的侧面之一产生孔，使得基板和孔的边缘之间的最大距离小于约3μm，穿过覆盖层的一部分上的空穴沉积在 所述基板未被所述牺牲层覆盖; d）通过孔消除牺牲层，形成空腔; 以及e）以密封方式沉积至少一种堵塞所述孔的材料。
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公开(公告)号：US20120112293A1
公开(公告)日：2012-05-10
申请号：US13381241
申请日：2010-07-06
申请人： Jean-Louis Pornin , Fabrice Jacquet
发明人： Jean-Louis Pornin , Fabrice Jacquet
CPC分类号： B81C1/00285 , B81B2203/0384 , B81C2203/0136 , B81C2203/0145
摘要： A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 μm, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.
摘要翻译： 一种密封空腔的制造方法，包括：a）在基板上制造牺牲层; b）产生覆盖层，该覆盖层至少覆盖牺牲层和未被牺牲层覆盖的衬底的一部分表面，覆盖层包括侧面，其与衬底形成小于90°的角度; c）通过覆盖层的侧面之一产生孔，使得基板和孔的边缘之间的最大距离小于约3μm，穿过覆盖层的一部分上的空穴沉积在 所述基板未被所述牺牲层覆盖; d）通过孔消除牺牲层，形成空腔; 以及e）以密封方式沉积至少一种堵塞所述孔的材料。
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4.发明申请Microcomponent Provided with a Cavity Delimited by a Cap with Enhanced Mechanical Resistance 有权微型组件具有由具有增强的机械电阻的盖限定的腔公开(公告)号：US20090194309A1
公开(公告)日：2009-08-06
申请号：US12227339
申请日：2007-05-21
CPC分类号： B81B3/007 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11) The cap (13) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b) said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).
摘要翻译： 它包括一个微组件，它包括一个由盖子（12）限定的空腔（13），盖子（12）包围由衬底（11）支撑的活性部件（10）。盖子（13）包括顶壁（12a），其包括至少具有加强装置 一个突出的加强构件（12b），所述加强构件（12b）位于顶壁（12a）的两个凹陷区域（12c）之间，并且具有距离凹陷区域（12c）一定距离的一端（14），而不会接触 与基板（11）。
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公开(公告)号：US09003654B2
公开(公告)日：2015-04-14
申请号：US13039902
申请日：2011-03-03
IPC分类号： H01K3/10 , H01L21/768 , H01L21/683 , H01L23/00
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/24 , H01L24/32 , H01L24/82 , H01L2221/68372 , H01L2224/0556 , H01L2224/24011 , H01L2224/2405 , H01L2224/24051 , H01L2224/245 , H01L2224/32057 , H01L2224/82101 , H01L2224/82399 , H01L2224/82815 , H01L2224/82896 , H01L2224/9202 , H01L2224/92144 , H01L2224/92244 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , Y10T29/49155 , Y10T29/49165 , H01L2924/014 , H01L2224/05552
摘要： A method for metalizing at least one blind via formed in at least one substrate, including: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.
摘要翻译： 一种用于金属化在至少一个衬底中形成的至少一个盲孔的方法，包括：a）在所述盲孔中布置导电材料的至少一个实心部分，b）对导电材料的实心部分进行热处理， 使其在盲孔中熔化，冷却导电材料，将其固化在盲孔中，并且其中，在进行步骤a）之前，盲孔通孔的至少一部分壁被能够防止润湿的材料覆盖 通过在步骤b）执行期间获得的熔融导电材料的盲孔的所述部分壁的所述部分，在执行步骤c）之后获得的凝固的导电材料不能固定到所述非润湿部分 盲人通道的墙壁。
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6.发明授权Method for making a cavity in the thickness of a substrate which may form a site for receiving a component 有权用于制造可形成用于接收部件的部位的基板的厚度的空腔的方法公开(公告)号：US08470184B2
公开(公告)日：2013-06-25
申请号：US13264170
申请日：2010-04-20
IPC分类号： C23F1/00
CPC分类号： B81C1/00047 , B81B2203/0315
摘要： A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.
摘要翻译： 一种制造微型器件的方法，所述微器件包括形成在衬底厚度中的用于部件的至少一个接收部位。 该方法包括：a）通过蚀刻第一基底，通过不连续的粘合界面，至少一个第一基底的至少一个牺牲块周围的至少一个第一沟槽，在至少一个第一基底上制造粘合的第二基底， 暴露粘合界面; 以及b）去除所述牺牲块，以便在所述第一基板中形成至少一个第一空腔。
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公开(公告)号：US08482130B2
公开(公告)日：2013-07-09
申请号：US13031917
申请日：2011-02-22
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/24 , H01L24/92 , H01L2224/24226 , H01L2224/24992 , H01L2224/24997 , H01L2224/30151 , H01L2224/32225 , H01L2224/82 , H01L2224/8203 , H01L2224/82101 , H01L2224/83 , H01L2224/83192 , H01L2224/8385 , H01L2224/9202 , H01L2924/00014 , H01L2924/00
摘要： An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.
摘要翻译： 一种互连结构，包括：至少一个第一基底，其中至少一个第一面与至少一个第二基底的至少一个表面整体形成，至少一个盲孔通过第一基底并出现在第一基底的第一面上 第一基板，并且在与第一基板相对的第二面处的第一基板的至少一个电触点，布置成抵靠第二基板的所述表面并与盲孔相对和/或抵靠第一表面和/或抵靠第二基板的第二表面 第一基板的表面，至少一个通道，其将盲孔通孔与互连结构外部的环境和/或形成在互连结构中的至少一个空腔连通，并且基本平行于第一或第二基板的一个 第二基板。
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公开(公告)号：US20120006783A1
公开(公告)日：2012-01-12
申请号：US13177840
申请日：2011-07-07
CPC分类号： G02B3/14 , F04B43/043 , G02B26/004
摘要： The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which: two substrates (110, 120) are provided; a membrane (111) is placed on one and/or on the other of the substrates; one or more walls (113) are formed, helping to laterally define the cavity (114), in which said walls are located on or in one of the substrates and/or on or in the other of the substrates, and said cavity is intended to contain the fluid, the two substrates (110, 120) are assembled together by superimposing one on the other so as to complete the cavity, in which the or each membrane (111) also helps to define the cavity, the fluid (117) is encapsulated in the cavity between the substrates, and the or each membrane is soaked by the fluid, at least a portion of one of the substrates and/or the other of the substrates is removed insofar as one and/or the other of the substrates are equipped with a membrane, in order to release the membrane at least in the central portion thereof.
摘要翻译： 本发明涉及一种用于制造具有用于封装包含在空腔中的流体的膜的装置的方法，其中：设置两个基板（110,120）; 膜（111）被放置在基板的一个和/或另一个上; 形成一个或多个壁（113），有助于横向限定空腔（114），其中所述壁位于其中一个基板上和/或其中一个基板上和/或其中一个基板上，并且所述空腔旨在 为了容纳流体，通过将两个基板（110,120）叠置在另一个上以便完成空腔（其中所述隔膜（111）也有助于限定空腔），所述流体（117） 被封装在基板之间的空腔中，并且每个膜被流体浸泡，至少一部分基板和/或另一个基板被去除，只要一个和/或另一个基板 配备有膜，以便至少在其中心部分释放膜。
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9.发明申请公开(公告)号：US20110221068A1
公开(公告)日：2011-09-15
申请号：US13031917
申请日：2011-02-22
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/24 , H01L24/92 , H01L2224/24226 , H01L2224/24992 , H01L2224/24997 , H01L2224/30151 , H01L2224/32225 , H01L2224/82 , H01L2224/8203 , H01L2224/82101 , H01L2224/83 , H01L2224/83192 , H01L2224/8385 , H01L2224/9202 , H01L2924/00014 , H01L2924/00
摘要： An interconnect structure including: at least one first substrate, whereof at least one first face is made integral with at least one face of at least one second substrate, at least one blind via passing through the first substrate and emerging at the first face of the first substrate and at a second face, opposite the first face, of the first substrate, at least one electric contact arranged against said face of the second substrate and opposite the blind via, and/or against the first face and/or against the second face of the first substrate, at least one channel putting the blind via in communication with an environment outside the interconnect structure and/or with at least one cavity formed in the interconnect structure, and extending substantially parallel to one of said faces of the first or second substrate.
摘要翻译： 一种互连结构，包括：至少一个第一基底，其中至少一个第一面与至少一个第二基底的至少一个表面整体形成，至少一个盲孔通过第一基底并出现在第一基底的第一面上 第一基板，并且在与第一基板相对的第二面处的第一基板的至少一个电触点，布置成抵靠第二基板的所述表面并与盲孔相对和/或抵靠第一表面和/或抵靠第二基板的第二表面 第一基板的表面，至少一个通道，其将盲孔通孔与互连结构外部的环境和/或形成在互连结构中的至少一个空腔连通，并且基本平行于第一或第二基板的一个 第二基板。
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10.发明授权Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same 有权具有一个或多个接触的空腔的互连结构在腔的壁上上升，并且用于制造其的方法公开(公告)号：US08674489B2
公开(公告)日：2014-03-18
申请号：US12912203
申请日：2010-10-26
IPC分类号： H01L23/02
CPC分类号： B81B7/0006 , B81B2203/0353 , B81B2207/012 , B81B2207/07 , H01L23/481 , H01L23/5389 , H01L27/14618 , H01L27/14627 , H01L2924/0002 , H05K1/0219 , H05K1/183 , H05K3/403 , H05K3/4697 , H05K2201/09172 , H05K2201/09181 , H05K2201/09645 , H01L2924/00012 , H01L2924/00
摘要： An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.
摘要翻译： 公开了一种互连装置，其包括其中形成有至少一个孔的支撑件，所述孔具有形成封闭轮廓的壁，并且由空腔和与腔体连通的一个或多个槽形成。 狭槽在与支撑件的主平面成非零角度的方向上延伸。 几个导电元件位于孔的至少一个壁上并穿过该孔。 导电元件各自旨在将位于支撑体两侧的导电区域彼此连接。 至少一个槽将两个导电元件彼此分开。
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