-
公开(公告)号：US20120086135A1
公开(公告)日：2012-04-12
申请号：US13267703
申请日：2011-10-06
CPC分类号： H01L23/5389 , H01L23/13 , H01L2224/73204 , H01L2924/09701 , H01L2924/1461 , H01L2924/15165 , H05K1/0281 , H05K1/189 , H05K3/0067 , H05K3/284 , H05K2201/10674 , H01L2924/15153 , H01L2924/00
摘要： In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.
摘要翻译： 在各种实施例中，电子模块具有衬底的第一侧中的第一腔，从第一空腔延伸的填充孔和在衬底的第二侧中的第二腔。 第二腔与填充孔流体连通，并且管芯被封装在第二腔内。
-
公开(公告)号：US08535984B2
公开(公告)日：2013-09-17
申请号：US13222764
申请日：2011-08-31
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
-
公开(公告)号：US08273603B2
公开(公告)日：2012-09-25
申请号：US12407252
申请日：2009-03-19
CPC分类号： H01L21/486 , B81B2207/012 , B81C1/00333 , B81C2201/019 , B81C2201/0191 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2224/04105 , H01L2224/24227 , H01L2224/73267 , H01L2224/8203 , H01L2224/92144 , H01L2224/9222 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01084 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49124 , H01L2924/00
摘要： In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.
摘要翻译： 根据用于形成插入件的方法，在基板的第一侧中形成填充孔，并且在第二侧形成空腔。 空腔与填充孔流体连通。 在空腔中形成多个柱，并且通过填充孔将密封剂注入空腔中以封装多个柱。 根据热管理的方法，电子部件和散热器布置在包括多个密封柱的插入件的相对侧上。
-
公开(公告)号：US20110309528A1
公开(公告)日：2011-12-22
申请号：US13222764
申请日：2011-08-31
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
-
公开(公告)号：US20090250823A1
公开(公告)日：2009-10-08
申请号：US12164614
申请日：2008-06-30
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
-
公开(公告)号：US20090250249A1
公开(公告)日：2009-10-08
申请号：US12407252
申请日：2009-03-19
CPC分类号： H01L21/486 , B81B2207/012 , B81C1/00333 , B81C2201/019 , B81C2201/0191 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2224/04105 , H01L2224/24227 , H01L2224/73267 , H01L2224/8203 , H01L2224/92144 , H01L2224/9222 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01084 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49124 , H01L2924/00
摘要： Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.
摘要翻译： 电子模块和内插件通过将微电子模具和/或柱体在空腔内封装在衬底中而形成。
-
公开(公告)号：US08017451B2
公开(公告)日：2011-09-13
申请号：US12164614
申请日：2008-06-30
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
-
公开(公告)号：US07960247B2
公开(公告)日：2011-06-14
申请号：US12062864
申请日：2008-04-04
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , H01L21/67092 , H01L2221/6834
摘要： Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
摘要翻译： 微电子管芯根据各种方法变薄，其可以包括在真空下将管芯结合到衬底上，在膜和衬底上设置膜，和/或在变薄期间改变压力中心。
-
公开(公告)号：US20090251879A1
公开(公告)日：2009-10-08
申请号：US12062864
申请日：2008-04-04
IPC分类号： H01L21/463 , H05K7/00 , B24B41/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L2221/6834
摘要： Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
摘要翻译： 微电子管芯根据各种方法变薄，其可以包括在真空下将管芯结合到衬底上，在膜和衬底上设置膜，和/或在变薄期间改变压力中心。
-
公开(公告)号：US20180332091A1
公开(公告)日：2018-11-15
申请号：US16039612
申请日：2018-07-19
CPC分类号： H04L67/36 , H04L67/025 , H04L67/10 , H04L67/20
摘要： According to some embodiments, systems, methods, apparatus, computer program code and means may receive data streams from remote third-party administrator computer servers. A back-end application computer server may receive a set of requests from a first third-party administrator computer server, each request being associated with a request value. The back-end application server may retrieve a first set of pre-determined rules and automatically apply them to the set of requests, resulting in an adjusted request value and an overall value. The back-end computer server may then automatically transmit a settlement instruction, including the overall value, to an electronic transaction system, and render a transaction activity report display via a remote computer device, associated with the first third-party administrator computer server, including information about the set of requests, the adjusted request value along with an indication of a reason for the adjustment, and the overall value.
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.028 秒)
