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公开(公告)号：US20180332091A1
公开(公告)日：2018-11-15
申请号：US16039612
申请日：2018-07-19
CPC分类号： H04L67/36 , H04L67/025 , H04L67/10 , H04L67/20
摘要： According to some embodiments, systems, methods, apparatus, computer program code and means may receive data streams from remote third-party administrator computer servers. A back-end application computer server may receive a set of requests from a first third-party administrator computer server, each request being associated with a request value. The back-end application server may retrieve a first set of pre-determined rules and automatically apply them to the set of requests, resulting in an adjusted request value and an overall value. The back-end computer server may then automatically transmit a settlement instruction, including the overall value, to an electronic transaction system, and render a transaction activity report display via a remote computer device, associated with the first third-party administrator computer server, including information about the set of requests, the adjusted request value along with an indication of a reason for the adjustment, and the overall value.
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公开(公告)号：US20120086135A1
公开(公告)日：2012-04-12
申请号：US13267703
申请日：2011-10-06
CPC分类号： H01L23/5389 , H01L23/13 , H01L2224/73204 , H01L2924/09701 , H01L2924/1461 , H01L2924/15165 , H05K1/0281 , H05K1/189 , H05K3/0067 , H05K3/284 , H05K2201/10674 , H01L2924/15153 , H01L2924/00
摘要： In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.
摘要翻译： 在各种实施例中，电子模块具有衬底的第一侧中的第一腔，从第一空腔延伸的填充孔和在衬底的第二侧中的第二腔。 第二腔与填充孔流体连通，并且管芯被封装在第二腔内。
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公开(公告)号：US07960247B2
公开(公告)日：2011-06-14
申请号：US12062864
申请日：2008-04-04
IPC分类号： H01L21/30
CPC分类号： H01L21/6835 , H01L21/67092 , H01L2221/6834
摘要： Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
摘要翻译： 微电子管芯根据各种方法变薄，其可以包括在真空下将管芯结合到衬底上，在膜和衬底上设置膜，和/或在变薄期间改变压力中心。
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公开(公告)号：US20090250823A1
公开(公告)日：2009-10-08
申请号：US12164614
申请日：2008-06-30
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
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公开(公告)号：US20090250249A1
公开(公告)日：2009-10-08
申请号：US12407252
申请日：2009-03-19
CPC分类号： H01L21/486 , B81B2207/012 , B81C1/00333 , B81C2201/019 , B81C2201/0191 , H01L21/568 , H01L21/6835 , H01L23/13 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2224/04105 , H01L2224/24227 , H01L2224/73267 , H01L2224/8203 , H01L2224/92144 , H01L2224/9222 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01084 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49124 , H01L2924/00
摘要： Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.
摘要翻译： 电子模块和内插件通过将微电子模具和/或柱体在空腔内封装在衬底中而形成。
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公开(公告)号：US08590570B2
公开(公告)日：2013-11-26
申请号：US12476980
申请日：2009-06-02
IPC分类号： F16K1/44
CPC分类号： F16K1/123 , F15B13/0832 , F15B21/00 , F16K1/126 , F16K3/26 , F16K3/265 , F16K31/1221 , F16K31/1226 , F16K31/124 , F16K31/445 , Y10T137/85978 , Y10T137/86501 , Y10T137/86549 , Y10T137/86775 , Y10T137/86799 , Y10T137/86879 , Y10T137/87096 , Y10T137/87249 , Y10T137/87499 , Y10T137/87555 , Y10T137/87885 , Y10T137/87917
摘要： A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
摘要翻译： 提供了包括第一阀构件和第二阀构件的阀。 第一阀构件包括与第一台相邻的第一台阶和第一孔。 第二阀构件包括与第二台相邻的第二台阶和第二孔。 第二阀构件可相对于第一阀构件在第一孔与第二孔流体连接的打开位置和闭合位置之间移动，在该位置，第一孔基本上与第二孔口流体连通。 当第二阀构件处于关闭位置时，第一和第二步骤流体地连接到第二孔口并与第一孔口基本上流体地分离，并且当第二阀门处于关闭位置时，第一和第二台阶流体地连接到第一和第二孔口 会员处于公开位置。
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公开(公告)号：US08017451B2
公开(公告)日：2011-09-13
申请号：US12164614
申请日：2008-06-30
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
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公开(公告)号：US20090294709A1
公开(公告)日：2009-12-03
申请号：US12476980
申请日：2009-06-02
IPC分类号： F16K31/12
CPC分类号： F16K1/123 , F15B13/0832 , F15B21/00 , F16K1/126 , F16K3/26 , F16K3/265 , F16K31/1221 , F16K31/1226 , F16K31/124 , F16K31/445 , Y10T137/85978 , Y10T137/86501 , Y10T137/86549 , Y10T137/86775 , Y10T137/86799 , Y10T137/86879 , Y10T137/87096 , Y10T137/87249 , Y10T137/87499 , Y10T137/87555 , Y10T137/87885 , Y10T137/87917
摘要： A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
摘要翻译： 提供了包括第一阀构件和第二阀构件的阀。 第一阀构件包括与第一台相邻的第一台阶和第一孔。 第二阀构件包括与第二台相邻的第二台阶和第二孔。 第二阀构件可相对于第一阀构件在第一孔与第二孔流体连接的打开位置和闭合位置之间移动，在该位置，第一孔基本上与第二孔口流体连通。 当第二阀构件处于关闭位置时，第一和第二步骤流体地连接到第二孔口并与第一孔口基本上流体地分离，并且当第二阀门处于关闭位置时，第一和第二台阶流体地连接到第一和第二孔口 会员处于公开位置。
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公开(公告)号：US20090251879A1
公开(公告)日：2009-10-08
申请号：US12062864
申请日：2008-04-04
IPC分类号： H01L21/463 , H05K7/00 , B24B41/00
CPC分类号： H01L21/6835 , H01L21/67092 , H01L2221/6834
摘要： Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
摘要翻译： 微电子管芯根据各种方法变薄，其可以包括在真空下将管芯结合到衬底上，在膜和衬底上设置膜，和/或在变薄期间改变压力中心。
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公开(公告)号：US08535984B2
公开(公告)日：2013-09-17
申请号：US13222764
申请日：2011-08-31
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/563 , H01L21/6835 , H01L23/31 , H01L23/3157 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68359 , H01L2221/68377 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/24227 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
摘要： Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
摘要翻译： 电子模块通过将微电子管芯封装在衬底中的空腔内而形成。
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