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1.发明授权公开(公告)号：US08415778B2
公开(公告)日：2013-04-09
申请号：US13215131
申请日：2011-08-22
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
摘要翻译： 一种非引线集成电路封装系统，包括：引线框的裸片; 包括外端子和内端子的双列端子; 以及内部端子和相邻的内部端子，以形成熔融引线。
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2.发明申请公开(公告)号：US20110298108A1
公开(公告)日：2011-12-08
申请号：US13215131
申请日：2011-08-22
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
摘要翻译： 一种非引线集成电路封装系统，包括：引线框的裸片; 包括外端子和内端子的双列端子; 以及内部端子和相邻的内部端子，以形成熔融引线。
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3.发明授权公开(公告)号：US08003443B2
公开(公告)日：2011-08-23
申请号：US11276684
申请日：2006-03-10
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L2924/0002 , H01L2924/3025 , H01L2924/00
摘要： A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including an outer terminal and an inner terminal, and selectively fusing an inner terminal and an adjacent inner terminal to form a fused lead.
摘要翻译： 提供了一种非引线集成电路封装系统，其提供引线框架的管芯焊盘，形成包括外部端子和内部端子的双列端子，并且选择性地熔合内部端子和相邻的内部端子以形成熔接引线 。
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公开(公告)号：US08629537B2
公开(公告)日：2014-01-14
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
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公开(公告)号：US07545032B2
公开(公告)日：2009-06-09
申请号：US11456544
申请日：2006-07-10
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle; soldering a stiffener structure; having an opening; on the mounting structure; connecting the stiffener structure to a ground; and molding the integrated circuit die and partially the stiffener structure through the opening.
摘要翻译： 提供了一种集成电路封装系统，包括形成具有外部互连件，桨形件和连接杆的安装结构; 在桨上安装集成电路管芯; 焊接加强筋结构; 有开口 在安装结构上; 将加强筋结构连接到地面上; 并且通过开口模制集成电路模具并且部分地加强加强件结构。
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公开(公告)号：US20080142934A1
公开(公告)日：2008-06-19
申请号：US11610304
申请日：2006-12-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49565 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
摘要翻译： 集成电路封装系统包括升高的边缘引线框架阵列，隔离升高的边缘引线框阵列的引线框架，验证附接到引线框架的集成电路管芯，以及形成包括集成电路管芯的集成电路封装。
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公开(公告)号：US08207597B2
公开(公告)日：2012-06-26
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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公开(公告)号：US20090250798A1
公开(公告)日：2009-10-08
申请号：US12484131
申请日：2009-06-12
IPC分类号： H01L23/495 , H01L21/56 , H01L23/498 , H01L23/28
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L2224/10175 , H01L2224/16 , H01L2224/16245 , H01L2924/3841 , Y10T29/49121 , Y10T29/49169 , Y10T29/49181
摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.
摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路在芯片上的支持。
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公开(公告)号：US07420265B2
公开(公告)日：2008-09-02
申请号：US11164321
申请日：2005-11-17
IPC分类号： H01L23/495
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/73 , H01L2224/1012 , H01L2224/16245 , H01L2224/81136 , H01L2224/81138 , H01L2924/00013 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2224/29099 , H01L2924/00
摘要： An integrated circuit package system including an integrated circuit die, a leadframe and an integrated circuit support. The integrated circuit support between the integrated circuit die and the leadframe with the electrical interconnects connected to the leadframe.
摘要翻译： 一种集成电路封装系统，包括集成电路管芯，引线框架和集成电路支架。 集成电路管芯与引线框架之间的集成电路支持，电气互连连接到引线框。
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公开(公告)号：US20080012100A1
公开(公告)日：2008-01-17
申请号：US11670899
申请日：2007-02-02
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L21/4828 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided including forming a lead frame including forming an inner lead having a planar surface, the inner lead extending inwardly from the lead frame and forming a stiffening structure integral with the lead frame for maintaining the planar surface; encapsulating the inner lead with an electrical connection to an integrated circuit die and with a first inner lead body of the inner lead exposed; and singulating the inner lead from the lead frame.
摘要翻译： 提供了一种集成电路封装系统，包括形成引线框架，该引线框架包括形成具有平坦表面的内引线，该内引线从引线框架向内延伸并形成与引线框架一体的加强结构，用于保持平面; 将内部引线封装到集成电路管芯的电连接处，并且内部引线的第一内部引线体被暴露; 并从引线框架中分离出内引线。
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