摘要:
A method of forming an integrated circuit and a structure therefore is provided. A gate dielectric is formed on a semiconductor substrate, and a gate is formed over the gate dielectric. Shallow source/drain junctions are formed in the semiconductor substrate. A sidewall spacer is formed around the gate. Deep source/drain junctions are formed in the semiconductor substrate using the sidewall spacer. A siliciding spacer is formed over the sidewall spacer after forming the shallow and deep source/drain junctions. A silicide is formed on the deep source/drain junctions adjacent the siliciding spacer, and a dielectric layer is deposited above the semiconductor substrate. Contacts are then formed in the dielectric layer to the silicide.
摘要:
An integrated circuit is provided. A gate dielectric is formed on a semiconductor substrate, and a gate is formed over the gate dielectric. A sidewall spacer is formed around the gate and a source/drain junction is formed in the semiconductor substrate using the sidewall spacer. A bottom silicide metal is deposited on the source/drain junction and then a top silicide metal is deposited on the bottom silicide metal. The bottom and top silicide metals are formed into their suicides. A dielectric layer is deposited above the semiconductor substrate and a contact is formed in the dielectric layer to the top silicide.
摘要:
An integrated circuit with a semiconductor substrate is provided. A gate dielectric is on the semiconductor substrate, and a gate is on the gate dielectric. A metallic layer is on the semiconductor substrate, and the metallic layer is reacted with the semiconductor substrate to form an early phase of silicide. Implanted shallow source/drain junctions are immediately beneath the silicide. A final phase of the silicide is formed. An interlayer dielectric is above the semiconductor substrate, and contacts are formed to the silicide.
摘要:
A method of forming an integrated circuit with a semiconductor substrate is provided. A gate dielectric is formed on the semiconductor substrate, and a gate is formed on the gate dielectric. Source/drain junctions are formed in the semiconductor substrate. A sidewall spacer is formed around the gate using a low power plasma enhanced chemical vapor deposition process A silicide is formed on the source/drain junctions and on the gate, and an interlayer dielectric is deposited above the semiconductor substrate. Contacts are then formed in the interlayer dielectric to the silicide.
摘要:
A self-adjusting parking brake actuator includes a brake lever that is movable between brake-released and brake-applied positions. In addition, the parking brake cable adjust system includes a self-adjustment assembly having a frame; a rack mounted for movement relative to the frame along a longitudinal direction of the rack in a tension direction and an opposite direction; a cable connector for operatively connecting the rack to a brake cable, a first resilient member biasing the rack relative to the frame along its longitudinal direction in the tensioning direction, a primary locking device configured to engage the rack and permit movement of the rack relative to the frame in the tensioning direction only; a secondary locking device moveable between (a) a locking to lock the primary locking device to prevent adjusting movement of the rack relative to the frame in the tensioning direction, and (b) a releasing position to permit the primary locking device to allow adjusting movement of the rack relative to the frame in the tensioning direction by the biasing of the resilient member; and a second resilient member biasing the secondary locking device to the locking position.
摘要:
A self-adjusting parking brake actuator includes a brake lever that is movable between brake-released and brake-applied positions. In addition, the parking brake cable adjust system includes a self-adjustment assembly having a frame; a rack mounted for movement relative to the frame along a longitudinal direction of the rack in a tension direction and an opposite direction; a cable connector for operatively connecting the rack to a brake cable, a first resilient member biasing the rack relative to the frame along its longitudinal direction in the tensioning direction, a primary locking device configured to engage the rack and permit movement of the rack relative to the frame in the tensioning direction only; a secondary locking device moveable between (a) a locking to lock the primary locking device to prevent adjusting movement of the rack relative to the frame in the tensioning direction, and (b) a releasing position to permit the primary locking device to allow adjusting movement of the rack relative to the frame in the tensioning direction by the biasing of the resilient member; and a second resilient member biasing the secondary locking device to the locking position.
摘要:
A method of manufacturing an integrated circuit (IC) can utilizes semiconductor substrate configured in accordance with a trench process. The substrate utilizes trenches in a base layer to induce stress in a layer. The substrate can include silicon. The trenches define pillars on a back side of a bulk substrate or base layer of a semiconductor-on-insulator (SOI) wafer.
摘要:
A system and method for providing copper interconnect in a trench formed in a dielectric is disclosed. In one aspect, the method and system include providing a copper layer; removing a portion of the copper layer outside of the trench; annealing the copper layer; and providing a layer disposed above the copper layer. In another aspect, the method and system include providing a copper interconnect formed in a trench on a dielectric. The copper interconnect includes a copper layer disposed in the trench and a layer disposed above the copper layer. The copper layer has a bamboo structure at least one grain. The at least one grain has substantially one orientation.
摘要:
An ultraviolet light absorbent silicon oxynitride layer overlies a memory cell including a pair of source/drains, a gate insulator, a floating gate, a dielectric layer, and a control gate. A conductor is disposed through the silicon oxynitride layer for electrical connection to the control gate, and another conductor is disposed through the silicon oxynitride layer for electrical connection to a source/drain.