System and methods for semiconductor device performance prediction during processing
    1.
    发明授权
    System and methods for semiconductor device performance prediction during processing 有权
    处理过程中半导体器件性能预测的系统和方法

    公开(公告)号:US08962353B2

    公开(公告)日:2015-02-24

    申请号:US13234964

    申请日:2011-09-16

    CPC classification number: H01L22/20 H01L22/12

    Abstract: Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.

    Abstract translation: 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。

    System and Methods for Semiconductor Device Performance Prediction During Processing
    2.
    发明申请
    System and Methods for Semiconductor Device Performance Prediction During Processing 有权
    半导体器件性能预测的系统和方法

    公开(公告)号:US20130071957A1

    公开(公告)日:2013-03-21

    申请号:US13234964

    申请日:2011-09-16

    CPC classification number: H01L22/20 H01L22/12

    Abstract: Methods and systems for predicting semiconductor device performance criteria during processing. A method is described that includes receiving a semiconductor wafer; performing semiconductor processing on the semiconductor wafer forming active devices that, when completed, will exhibit a device performance criteria; during the semiconductor processing, measuring in line at least one device performance criteria related physical parameter; projecting an estimated value for the device performance criteria of the active devices using the at least one in line measurement and using estimated measurements for device performance criteria related physical parameters corresponding to later semiconductor processing steps; comparing the estimated value for the device performance criteria to an acceptable range; and determining, based on the comparing, whether the active devices on the semiconductor wafer will have a device performance criteria within the acceptable range. A system for processing semiconductor wafers that includes a programmable processor for performing the methods is described.

    Abstract translation: 用于在处理过程中预测半导体器件性能标准的方法和系统。 描述了一种包括接收半导体晶片的方法; 在形成有源器件的半导体晶片上执行半导体处理,其在完成时将呈现器件性能标准; 在半导体处理期间,测量至少一个器件性能标准相关的物理参数; 使用所述至少一个在线测量来估计所述有源器件的器件性能标准的估计值,并使用对应于后续半导体处理步骤的器件性能标准相关物理参数的估计测量值; 将设备性能标准的估计值与可接受范围进行比较; 以及基于所述比较来确定所述半导体晶片上的有源器件是否将器件性能标准在可接受的范围内。 描述了一种用于处理半导体晶片的系统,其包括用于执行该方法的可编程处理器。

    Focus control method for photolithography
    3.
    发明授权
    Focus control method for photolithography 有权
    光刻对焦控制方法

    公开(公告)号:US08772054B2

    公开(公告)日:2014-07-08

    申请号:US13227805

    申请日:2011-09-08

    Abstract: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A topography of the top surface is determined based on the detected sound wave. The determined topography is used to control an immersion lithography process.

    Abstract translation: 一种方法包括提供在衬底上具有至少一层材料的半导体衬底。 对基板施加声音,使得声波被材料层的顶表面反射。使用传感器检测声波。 基于检测到的声波来确定顶面的形貌。 确定的地形用于控制浸没光刻工艺。

    INPUT/OUTPUT SIGNAL PROCESSING CIRCUIT AND INPUT/OUTPUT SIGNAL PROCESSING METHOD

    公开(公告)号:US20160020825A1

    公开(公告)日:2016-01-21

    申请号:US14755686

    申请日:2015-06-30

    Abstract: The present invention discloses an input/output (I/O) signal processing circuit and processing method. The I/O signal processing circuit includes a level adjustable I/O circuit and an adjustment circuit. The I/O signal processing circuit includes an output driver and/or an input comparator. The output driver transmits an output signal via a signal transmission line according to an output data. The output driver has an adjustable high operation voltage level and an adjustable low operation voltage level, which determine a high level and a low level of the output signal, respectively. The input comparator receives an input signal via the signal transmission line and comparing the input signal with an adjustable reference voltage, so as to generate an input data. The adjustment circuit generates an adjustment signal according to voltage drop related information, to correspondingly adjust the adjustable high and low operation voltage level and/or the adjustable reference voltage.

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