公开(公告)号：US08975118B2

公开(公告)日：2015-03-10

申请号：US13701277

申请日：2011-04-13

申请人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L27/088 ,  H01L23/48 ,  B81C1/00 ,  H01L21/768

CPC分类号： H01L23/481 ,  B81B2203/033 ,  B81B2207/095 ,  B81C1/00095 ,  H01L21/76837 ,  H01L23/04 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00

摘要： An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

摘要翻译： 一种有利的方法和系统，用于实现电气非常可靠和机械上非常稳定的通孔，用于在导电基底上的层结构中实现其功能的部件。 被引导到部件的背面并用于在层结构中实现的功能元件的电接触的通孔（垂直互连访问）包括在基板中的连接区域，该连接区域在整个厚度 并且通过类似于整个基板厚度延伸的沟槽状绝缘框架与邻接的基板电绝缘。 根据本系统，沟槽状绝缘框架填充有电绝缘聚合物。

公开(公告)号：US20120038030A1

公开(公告)日：2012-02-16

申请号：US13198651

申请日：2011-08-04

申请人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L29/41 ,  H01L21/762 ,  H01L29/06

CPC分类号： H01L21/76898 ,  H01L21/02118 ,  H01L21/02318 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method.

摘要翻译： 描述了一种用于在晶片中填充空腔的方法，空腔朝向晶片的预定表面开放，包括以下步骤：将漆状填充材料施加到晶片的预定表面; 在第一温度下加热晶片; 通过在等于或高于第一温度的第二温度下在真空下加热晶片来驱除封闭在填充材料中的气泡; 以及通过在高于第二温度的第三温度下加热晶片来固化填充材料。 此外，还描述了使用这种方法和一般3D空腔填充的盲孔以及具有使用这种方法填充的硅通孔的绝缘沟槽的晶片。

公开(公告)号：US20130147020A1

公开(公告)日：2013-06-13

申请号：US13701277

申请日：2011-04-13

申请人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Julian Gonska ,  Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  B81B2203/033 ,  B81B2207/095 ,  B81C1/00095 ,  H01L21/76837 ,  H01L23/04 ,  H01L2224/48463 ,  H01L2924/1461 ,  H01L2924/00

摘要： An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

摘要翻译： 一种有利的方法和系统，用于实现电气非常可靠和机械上非常稳定的通孔，用于在导电基底上的层结构中实现其功能的部件。 被引导到部件的背面并用于在层结构中实现的功能元件的电接触的通孔（垂直互连访问）包括在基板中的连接区域，该连接区域在整个厚度 并且通过类似于整个基板厚度延伸的沟槽状绝缘框架与邻接的基板电绝缘。 根据本系统，沟槽状绝缘框架填充有电绝缘聚合物。

公开(公告)号：US08647961B2

公开(公告)日：2014-02-11

申请号：US13198651

申请日：2011-08-04

申请人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

发明人： Jens Frey ,  Heribert Weber ,  Eckhard Graf ,  Roman Schlosser

IPC分类号： H01L21/76

CPC分类号： H01L21/76898 ,  H01L21/02118 ,  H01L21/02318 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is described for filling cavities in wafers, the cavities being open to a predetermined surface of the wafer, including the following steps: applying a lacquer-like filling material to the predetermined surface of the wafer; heating the wafer at a first temperature; driving out gas bubbles enclosed in the filling material by heating the wafer under vacuum at a second temperature which is equal to or higher than the first temperature; and curing the filling material by heating the wafer at a third temperature which is higher than the second temperature. Furthermore, also described is a blind hole filled using such a method and general 3D cavities as well as a wafer having insulation trenches of a silicon via filled using such a method.

摘要翻译： 描述了一种用于在晶片中填充空腔的方法，空腔朝向晶片的预定表面开放，包括以下步骤：将漆状填充材料施加到晶片的预定表面; 在第一温度下加热晶片; 通过在等于或高于第一温度的第二温度下在真空下加热晶片来驱除封闭在填充材料中的气泡; 以及通过在高于第二温度的第三温度下加热晶片来固化填充材料。 此外，还描述了使用这种方法和一般3D空腔填充的盲孔以及具有使用这种方法填充的硅通孔的绝缘沟槽的晶片。

公开(公告)号：US08748998B2

公开(公告)日：2014-06-10

申请号：US13206024

申请日：2011-08-09

申请人： Jens Frey ,  Heribert Weber ,  Eckhard Graf

发明人： Jens Frey ,  Heribert Weber ,  Eckhard Graf

IPC分类号： H01L29/84

CPC分类号： G01P15/125 ,  B81B7/02 ,  B81B2207/07 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C2203/0118 ,  B81C2203/035 ,  G01L9/0048 ,  G01L9/0052 ,  G01L9/0073 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/0802 ,  G01R33/0286

摘要： A sensor module includes a substrate system which has multiple substrates situated one on top of the other and connected in each case via a wafer bond connection. The substrate system includes at least one first sensor substrate and at least one second sensor substrate, the first sensor substrate having a first sensor structure and the second sensor substrate having a second sensor structure. The first and second sensor structures are designed for detecting different characteristics. At least the first sensor structure includes a micromechanical functional structure. Moreover, a method for manufacturing such a sensor module is disclosed.

摘要翻译： 传感器模块包括具有多个基板的基板系统，该基板一个在另一个之上并且通过晶片接合连接在每种情况下连接。 衬底系统包括至少一个第一传感器衬底和至少一个第二传感器衬底，第一传感器衬底具有第一传感器结构，第二传感器衬底具有第二传感器结构。 第一和第二传感器结构被设计用于检测不同的特性。 至少第一传感器结构包括微机械功能结构。 此外，公开了一种用于制造这种传感器模块的方法。

公开(公告)号：US20100133630A1

公开(公告)日：2010-06-03

申请号：US12597137

申请日：2008-04-08

申请人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

发明人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

IPC分类号： H01L29/84 ,  H01L21/30

CPC分类号： B81C1/00095 ,  H01L21/76898 ,  H01L23/481

摘要： A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate. In addition, an insulating layer and a filler layer are produced or applied on a first side of the substrate. The filler layer comprises a filler material that substantially fills up the trench structure. A planar first side of the substrate is produced by way of a subsequent planarization within a plane of the filler layer or of the insulating layer or of the substrate. A further planarization of the second side of the substrate is then accomplished. A micromechanical component that is manufactured in accordance with the method is also described.

摘要翻译： 提出了一种制造微机械部件的方法。 在本上下文中，在衬底中产生具有小于衬底厚度的深度的至少一个沟槽结构。 此外，在基板的第一面上制造或施加绝缘层和填充层。 填充层包括基本上填充沟槽结构的填充材料。 衬底的平面第一侧通过在填充层或绝缘层或衬底的平面内的随后的平坦化产生。 然后完成衬底的第二侧的进一步的平坦化。 还描述了根据该方法制造的微机械部件。

公开(公告)号：US20100089868A1

公开(公告)日：2010-04-15

申请号：US12450659

申请日：2008-04-08

申请人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

发明人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

IPC分类号： B81C1/00 ,  B44C1/22

CPC分类号： B81C1/00333 ,  B81B2203/033 ,  B81C1/0015 ,  B81C2201/0197

摘要： A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

摘要翻译： 提出了一种用于制造微机械部件的方法，其中沟槽结构基本上被第一填充层完全填充，第一掩模层被施加在第一填料层上，第二掩模层又在第二填料层和第二掩模层 被应用。 还提出了微机械部件，第一填充层填充微机械部件的沟槽结构，同时形成可移动的传感器结构。

公开(公告)号：US20120049301A1

公开(公告)日：2012-03-01

申请号：US13291350

申请日：2011-11-08

申请人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

发明人： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

IPC分类号： H01L29/84

CPC分类号： B81C1/00095 ,  H01L21/76898 ,  H01L23/481

摘要： A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate. In addition, an insulating layer and a filler layer are produced or applied on a first side of the substrate. The filler layer comprises a filler material that substantially fills up the trench structure. A planar first side of the substrate is produced by way of a subsequent planarization within a plane of the filler layer or of the insulating layer or of the substrate. A further planarization of the second side of the substrate is then accomplished. A micromechanical component that is manufactured in accordance with the method is also described.

摘要翻译： 提出了一种制造微机械部件的方法。 在本上下文中，在衬底中产生具有小于衬底厚度的深度的至少一个沟槽结构。 此外，在基板的第一面上制造或施加绝缘层和填充层。 填充层包括基本上填充沟槽结构的填充材料。 衬底的平面第一侧通过在填充层或绝缘层或衬底的平面内的随后的平坦化产生。 然后完成衬底的第二侧的进一步的平坦化。 还描述了根据该方法制造的微机械部件。

公开(公告)号：US08207585B2

公开(公告)日：2012-06-26

申请号：US12300544

申请日：2007-04-03

申请人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

发明人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

IPC分类号： H01L29/84

CPC分类号： B81C1/00158 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/04 ,  Y10T428/24802

摘要： A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

摘要翻译： 提供了一种用于制造微机械部件并提供微机械部件的方法，特别是麦克风，具有基板并具有光阑图案的微型扬声器或压力传感器（绝对压力传感器或相对压力传感器），用于 膜片图案的生产，仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤，施加到基板上的牺牲图案被去除以用于生产隔膜图案。

公开(公告)号：US20090162619A1

公开(公告)日：2009-06-25

申请号：US12300544

申请日：2007-04-03

申请人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

发明人： Roman Schlosser ,  Heribert Weber ,  Christoph Schelling

IPC分类号： B32B5/02 ,  B44C1/22

CPC分类号： B81C1/00158 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  H04R19/04 ,  Y10T428/24802

摘要： A method is provided for producing a micromechanical component and a micromechanical component is provided, particularly a microphone, a micro-loudspeaker or a pressure sensor (an absolute pressure sensor or a relative pressure sensor) having a substrate and having a diaphragm pattern, for the production of the diaphragm pattern, process steps being provided that are compatible only with a circuit that is monolithically integrated into or on the substrate, a sacrificial pattern applied onto the substrate being removed for the production of the diaphragm pattern.

摘要翻译： 提供了一种用于制造微机械部件并提供微机械部件的方法，特别是麦克风，具有基板并具有光阑图案的微型扬声器或压力传感器（绝对压力传感器或相对压力传感器），用于 膜片图案的生产，仅提供与单片集成到基板中或基板上的电路相兼容的工艺步骤，施加到基板上的牺牲图案被去除以用于生产隔膜图案。