Flash memory device and programming/erasing method of the same
    3.
    发明授权
    Flash memory device and programming/erasing method of the same 有权
    闪存设备和编程/擦除方法相同

    公开(公告)号:US08134873B2

    公开(公告)日:2012-03-13

    申请号:US12591428

    申请日:2009-11-19

    IPC分类号: G11C16/06

    摘要: A flash memory device includes a bulk region, first through nth memory cell transistors arranged in a row on the bulk region, first through nth word lines respectively connected to gates of the first through nth memory cell transistors, a first dummy cell transistor connected to the first memory cell transistor, a first dummy word line connected to a gate of the first dummy cell transistor, a first selection transistor connected to the first dummy cell transistor, a first selection line connected to a gate of the first selection transistor, and a voltage control unit connected to the first selection line, the voltage control unit being adapted to output to the first selection line a voltage lower than a voltage applied to the bulk region, in an erasing mode for erasing the first through nth memory cell transistors.

    摘要翻译: 闪速存储器件包括体区域,在体区域上排列成行的第一至第n个存储单元晶体管,分别连接到第一至第n存储单元晶体管的栅极的第一至第n字线,连接到 第一存储单元晶体管,连接到第一虚设单元晶体管的栅极的第一虚拟字线,连接到第一虚设单元晶体管的第一选择晶体管,连接到第一选择晶体管的栅极的第一选择线, 控制单元连接到第一选择线,电压控制单元适于在以擦除第一至第n个存储单元晶体管的擦除模式中向第一选择线输出低于施加到体区的电压的电压。

    Non-volatile memory device and method of fabricating the same
    4.
    发明申请
    Non-volatile memory device and method of fabricating the same 审中-公开
    非易失性存储器件及其制造方法

    公开(公告)号:US20090321815A1

    公开(公告)日:2009-12-31

    申请号:US12453035

    申请日:2009-04-28

    IPC分类号: H01L29/792 H01L27/092

    摘要: A non-volatile memory device, including a substrate of a first conductivity type, the substrate including a plurality of wells of a second conductivity type, a plurality of memory cells in one of the plurality of wells of the second conductivity type, and a peripheral circuit including at least one first transistor of the second conductivity type on the substrate, and at least one second transistor of the first conductivity type in another one of the plurality of wells of the second conductivity type.

    摘要翻译: 一种非易失性存储器件,包括第一导电类型的衬底,所述衬底包括多个第二导电类型的阱,多个第二导电类型的阱之一中的多个存储单元,以及周边 包括至少一个第一导电类型的第一晶体管和第二导电类型的另一个第二导电类型的第二导体类型的第二晶体管。

    Nonvolatile Memory Devices Having Memory Cell Transistors Therein with Lower Bandgap Source/Drain Regions
    5.
    发明申请
    Nonvolatile Memory Devices Having Memory Cell Transistors Therein with Lower Bandgap Source/Drain Regions 有权
    具有存储单元晶体管的非易失性存储器件具有较低的带隙源/漏区

    公开(公告)号:US20110233610A1

    公开(公告)日:2011-09-29

    申请号:US12974542

    申请日:2010-12-21

    IPC分类号: H01L29/772

    CPC分类号: H01L27/11521 H01L27/11524

    摘要: Nonvolatile memory devices include a plurality of nonvolatile memory cell transistors having respective channel regions within a semiconductor layer formed of a first semiconductor material and respective source/drain regions formed of a second semiconductor material, which has a smaller bandgap relative to the first semiconductor material. The source/drain regions can form non-rectifying junctions with the channel regions. The source/drain regions may include germanium (e.g., Ge or SiGe regions), the semiconductor layer may be a P-type silicon layer and the source/drain regions of the plurality of nonvolatile memory cell transistors may be P-type germanium or P-type silicon germanium.

    摘要翻译: 非易失性存储器件包括多个非易失性存储单元晶体管,其在由第一半导体材料形成的半导体层内的相应沟道区和由第二半导体材料形成的相应的源极/漏极区相互相对于第一半导体材料具有较小的带隙。 源极/漏极区域可以与沟道区域形成非整流结。 源极/漏极区域可以包括锗(例如Ge或SiGe区域),半导体层可以是P型硅层,并且多个非易失性存储单元晶体管的源极/漏极区域可以是P型锗或P 型硅锗。

    Flash memory device and programming/erasing method of the same
    6.
    发明申请
    Flash memory device and programming/erasing method of the same 有权
    闪存设备和编程/擦除方法相同

    公开(公告)号:US20100128522A1

    公开(公告)日:2010-05-27

    申请号:US12591428

    申请日:2009-11-19

    IPC分类号: G11C16/16 G11C16/04 G11C16/12

    摘要: A flash memory device includes a bulk region, first through nth memory cell transistors arranged in a row on the bulk region, first through nth word lines respectively connected to gates of the first through nth memory cell transistors, a first dummy cell transistor connected to the first memory cell transistor, a first dummy word line connected to a gate of the first dummy cell transistor, a first selection transistor connected to the first dummy cell transistor, a first selection line connected to a gate of the first selection transistor, and a voltage control unit connected to the first selection line, the voltage control unit being adapted to output to the first selection line a voltage lower than a voltage applied to the bulk region, in an erasing mode for erasing the first through nth memory cell transistors.

    摘要翻译: 闪速存储器件包括体区域,在体区域上排列成行的第一至第n个存储单元晶体管,分别连接到第一至第n存储单元晶体管的栅极的第一至第n字线,连接到 第一存储单元晶体管,连接到第一虚设单元晶体管的栅极的第一虚拟字线,连接到第一虚设单元晶体管的第一选择晶体管,连接到第一选择晶体管的栅极的第一选择线, 控制单元连接到第一选择线,电压控制单元适于在以擦除第一至第n个存储单元晶体管的擦除模式中向第一选择线输出低于施加到体区的电压的电压。

    Nonvolatile memory devices having memory cell transistors therein with lower bandgap source/drain regions
    7.
    发明授权
    Nonvolatile memory devices having memory cell transistors therein with lower bandgap source/drain regions 有权
    具有其中具有较低带隙源极/漏极区域的存储单元晶体管的非易失性存储器件

    公开(公告)号:US08441062B2

    公开(公告)日:2013-05-14

    申请号:US12974542

    申请日:2010-12-21

    IPC分类号: H01L29/772

    CPC分类号: H01L27/11521 H01L27/11524

    摘要: Nonvolatile memory devices include a plurality of nonvolatile memory cell transistors having respective channel regions within a semiconductor layer formed of a first semiconductor material and respective source/drain regions formed of a second semiconductor material, which has a smaller bandgap relative to the first semiconductor material. The source/drain regions can form non-rectifying junctions with the channel regions. The source/drain regions may include germanium (e.g., Ge or SiGe regions), the semiconductor layer may be a P-type silicon layer and the source/drain regions of the plurality of nonvolatile memory cell transistors may be P-type germanium or P-type silicon germanium.

    摘要翻译: 非易失性存储器件包括多个非易失性存储单元晶体管,其在由第一半导体材料形成的半导体层内的相应沟道区和由第二半导体材料形成的相应的源极/漏极区相互相对于第一半导体材料具有较小的带隙。 源极/漏极区域可以与沟道区域形成非整流结。 源极/漏极区域可以包括锗(例如Ge或SiGe区域),半导体层可以是P型硅层,并且多个非易失性存储单元晶体管的源极/漏极区域可以是P型锗或P 型硅锗。

    NON-VOLATILE MEMORY DEVICE
    8.
    发明申请
    NON-VOLATILE MEMORY DEVICE 失效
    非易失性存储器件

    公开(公告)号:US20110084329A1

    公开(公告)日:2011-04-14

    申请号:US12713736

    申请日:2010-02-26

    IPC分类号: H01L29/792

    摘要: A non-volatile memory device includes a semiconductor layer including a cell region and a peripheral region, a cell region gate structure disposed in the cell region of the semiconductor layer, and wherein the cell region gate structure includes a tunneling insulating layer and a first blocking insulating layer, a second blocking insulating layer, and a third blocking insulating layer. The non-volatile memory device further includes a peripheral region gate structure formed in the peripheral region of the semiconductor layer. The peripheral region gate structure includes a first peripheral region insulating layer including a same material as a material included in the tunneling insulating layer and a second peripheral region insulating layer including a same material as a material included in the third blocking insulating layer.

    摘要翻译: 非易失性存储器件包括包括单元区域和外围区域的半导体层,设置在半导体层的单元区域中的单元区域栅极结构,并且其中单元区域栅极结构包括隧道绝缘层和第一阻挡层 绝缘层,第二阻挡绝缘层和第三阻挡绝缘层。 非易失性存储器件还包括形成在半导体层的周边区域中的外围区域栅极结构。 周边区域栅极结构包括:第一周边区域绝缘层,其包括与包含在隧道绝缘层中的材料相同的材料;以及第二周边区域绝缘层,其包括与包含在第三阻挡绝缘层中的材料相同的材料。

    Non-volatile memory device
    9.
    发明授权
    Non-volatile memory device 失效
    非易失性存储器件

    公开(公告)号:US08169018B2

    公开(公告)日:2012-05-01

    申请号:US12713736

    申请日:2010-02-26

    IPC分类号: H01L29/792

    摘要: A non-volatile memory device includes a semiconductor layer including a cell region and a peripheral region, a cell region gate structure disposed in the cell region of the semiconductor layer, and wherein the cell region gate structure includes a tunneling insulating layer and a first blocking insulating layer, a second blocking insulating layer, and a third blocking insulating layer. The no-volatile memory device further includes a peripheral region gate structure formed in the peripheral region of the semiconductor layer. The peripheral region gate structure includes a first peripheral region insulating layer including a same material as a material included in the tunneling insulating layer and a second peripheral region insulating layer including a same material as a material included in the third blocking insulating layer.

    摘要翻译: 非易失性存储器件包括包括单元区域和外围区域的半导体层,设置在半导体层的单元区域中的单元区域栅极结构,并且其中单元区域栅极结构包括隧道绝缘层和第一阻挡层 绝缘层,第二阻挡绝缘层和第三阻挡绝缘层。 非易失性存储器件还包括形成在半导体层的周边区域中的外围区域栅极结构。 周边区域栅极结构包括:第一周边区域绝缘层,其包括与包含在隧道绝缘层中的材料相同的材料;以及第二周边区域绝缘层,其包括与包含在第三阻挡绝缘层中的材料相同的材料。

    Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device
    10.
    发明授权
    Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device 有权
    包括具有不同栅极结构的FinFET和半导体器件的制造方法的半导体器件

    公开(公告)号:US09564435B2

    公开(公告)日:2017-02-07

    申请号:US14754400

    申请日:2015-06-29

    摘要: A semiconductor device includes a substrate having a logic device region including logic devices thereon, and an input/output (I/O) device region including I/O devices thereon adjacent the logic device region. A first fin field-effect transistor (FinFET) on the logic device region includes a first semiconductor fin protruding from the substrate, and a triple-gate structure having a first gate dielectric layer and a first gate electrode thereon. A second FinFET on the I/O device region includes a second semiconductor fin protruding from the substrate, and a double-gate structure having a second gate dielectric layer and a second gate electrode thereon. The first and second gate dielectric layers have different thicknesses. Related devices and fabrication methods are also discussed.

    摘要翻译: 半导体器件包括具有其上包括逻辑器件的逻辑器件区域的衬底,以及在其上邻近逻辑器件区域的包括I / O器件的输入/输出(I / O)器件区域。 逻辑器件区域上的第一鳍状场效应晶体管(FinFET)包括从衬底突出的第一半导体鳍片,以及在其上具有第一栅极电介质层和第一栅极电极的三栅极结构。 I / O器件区域上的第二FinFET包括从衬底突出的第二半导体鳍片,以及在其上具有第二栅极介电层和第二栅电极的双栅极结构。 第一和第二栅极电介质层具有不同的厚度。 还讨论了相关设备和制造方法。