Hybrid integrated component
    1.
    发明授权
    Hybrid integrated component 有权
    混合集成组件

    公开(公告)号:US09266720B2

    公开(公告)日:2016-02-23

    申请号:US14059202

    申请日:2013-10-21

    IPC分类号: B81C1/00

    摘要: A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

    摘要翻译: 元件具有至少一个MEMS元件和由半导体材料制成的至少一个盖。 盖子除了作为空腔的终端的机械功能以及微机械结构的保护之外,还具有电功能。 元件的MEMS元件的微机械结构位于载体和盖之间的空腔中,并且包括至少一个结构元件,其可在空腔内偏离组件平面。 该帽包括至少一个在盖的整个厚度上延伸的部分,其与相邻的半导体材料电绝缘,使得其可以独立于帽的其余部分电接触。

    Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap
    2.
    发明授权
    Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap 有权
    用于制造用于MEMS部件的盖的方法和具有这种盖的混合集成部件

    公开(公告)号:US09040336B2

    公开(公告)日:2015-05-26

    申请号:US14058806

    申请日:2013-10-21

    摘要: A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

    摘要翻译: 一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法,具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。 在多步骤各向异性蚀刻中,在平盖基板中制造盖结构,并且包括至少一个安装框架,该安装框架具有至少一个安装表面和止动结构,在盖内侧具有至少一个止动表面, 掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻,并且选择掩模层的布局以及蚀刻步骤的数量和持续时间,使得安装表面,止动表面和 帽内侧位于帽结构的不同表面水平处。

    Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap
    3.
    发明申请
    Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap 有权
    用于制造用于mems组件的盖的方法,以及具有这种盖的混合集成部件

    公开(公告)号:US20140110800A1

    公开(公告)日:2014-04-24

    申请号:US14058806

    申请日:2013-10-21

    IPC分类号: B81C1/00 B81B3/00

    摘要: A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

    摘要翻译: 一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法,具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。 在多步骤各向异性蚀刻中,在平盖基板中制造盖结构,并且包括至少一个安装框架,该安装框架具有至少一个安装表面和止动结构,在盖内侧具有至少一个止动表面, 掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻,并且选择掩模层的布局以及蚀刻步骤的数量和持续时间,使得安装表面,止动表面和 帽内侧位于帽结构的不同表面水平处。

    Method for operating and/or for measuring a micromechanical device, and micromechanical device
    5.
    发明授权
    Method for operating and/or for measuring a micromechanical device, and micromechanical device 有权
    用于操作和/或测量微机械装置的方法和微机械装置

    公开(公告)号:US09291455B2

    公开(公告)日:2016-03-22

    申请号:US13918556

    申请日:2013-06-14

    摘要: A method for operating and/or measuring a micromechanical device. The device has a first and second seismic mass which are movable by oscillation relative to a substrate; a first drive device for deflecting the first seismic mass and a second drive device for deflecting the second seismic mass, parallel to a drive direction in a first orientation; a third drive device for deflecting the first seismic mass, and a fourth drive device for deflecting the second seismic mass in parallel to the drive direction and according to a second orientation opposite from the first orientation; a first detection device for detecting drive motion of the first seismic mass; and a second detection device for detecting drive motion of the second seismic mass. A first and a second detection signal are generated by the first and second detection devices, the first detection signal being evaluated separately from the second detection signal.

    摘要翻译: 一种用于操作和/或测量微机械装置的方法。 该装置具有第一和第二震动块,它们通过相对于基底振动而移动; 第一驱动装置,用于偏转第一抗震块;以及第二驱动装置,用于使第二抗震块平行于第一取向的驱动方向; 第三驱动装置,用于偏转所述第一抗震块;以及第四驱动装置,用于使所述第二抗震块平行于所述驱动方向并且根据与所述第一方向相反的第二方位偏转; 第一检测装置,用于检测第一抗震块的驱动运动; 以及用于检测第二地震块的驱动运动的第二检测装置。 第一和第二检测信号由第一和第二检测装置产生,第一检测信号与第二检测信号分开评估。

    Acceleration sensor and method for its manufacture
    6.
    发明授权
    Acceleration sensor and method for its manufacture 有权
    加速度传感器及其制造方法

    公开(公告)号:US08336382B2

    公开(公告)日:2012-12-25

    申请号:US12610961

    申请日:2009-11-02

    IPC分类号: G01P15/125

    摘要: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

    摘要翻译: 描述了一种加速度传感器,其具有基底基板,相对于基底基板以固定方式设置的第一电极结构,具有第一电极区域的传感器元件和具有至少一个弹簧元件的弹簧装置。 通过弹簧元件,传感器元件联接到基底基板,使得由于作用在传感器元件上的加速度,传感器元件相对于基底基板偏转,从而改变第一电极结构与第一电极结构之间的距离 电极区域。 传感器元件和第一电极结构至少部分地位于另一个之上,并且由公共功能层形成。

    ACCELERATION SENSOR AND METHOD FOR ITS MANUFACTURE
    8.
    发明申请
    ACCELERATION SENSOR AND METHOD FOR ITS MANUFACTURE 有权
    加速度传感器及其制造方法

    公开(公告)号:US20100107762A1

    公开(公告)日:2010-05-06

    申请号:US12610961

    申请日:2009-11-02

    IPC分类号: G01P15/13 H05K3/00

    摘要: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

    摘要翻译: 描述了一种加速度传感器,其具有基底基板,相对于基底基板以固定方式设置的第一电极结构,具有第一电极区域的传感器元件和具有至少一个弹簧元件的弹簧装置。 通过弹簧元件,传感器元件联接到基底基板,使得由于作用在传感器元件上的加速度,传感器元件相对于基底基板偏转,从而改变第一电极结构与第一电极结构之间的距离 电极区域。 传感器元件和第一电极结构至少部分地位于另一个之上,并且由公共功能层形成。

    Hybrid intergrated component and method for the manufacture thereof
    9.
    发明授权
    Hybrid intergrated component and method for the manufacture thereof 有权
    混合组合成分及其制造方法

    公开(公告)号:US08796791B2

    公开(公告)日:2014-08-05

    申请号:US13888920

    申请日:2013-05-07

    IPC分类号: G01P15/08

    摘要: Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

    摘要翻译: 提出的措施是,在实现元件的MEMS元件的微机械结构的情况下,设计自由度显着增加,其包括用于MEMS元件的载体和用于MEMS元件的微机械结构的盖, MEMS元件通过支架结构安装在载体上。 MEMS元件以分层结构实现,并且MEMS元件的微机械结构在该分层结构的至少两个功能层上延伸,所述功能层通过至少一个中间层彼此分离。

    HYBRID INTERGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
    10.
    发明申请
    HYBRID INTERGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF 有权
    混合互联组件及其制造方法

    公开(公告)号:US20130299927A1

    公开(公告)日:2013-11-14

    申请号:US13888920

    申请日:2013-05-07

    IPC分类号: B81B3/00 B81C1/00

    摘要: Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

    摘要翻译: 提出的措施是,在实现元件的MEMS元件的微机械结构的情况下,设计自由度显着增加,其包括用于MEMS元件的载体和用于MEMS元件的微机械结构的盖, MEMS元件通过支架结构安装在载体上。 MEMS元件以分层结构实现,并且MEMS元件的微机械结构在该分层结构的至少两个功能层上延伸,所述功能层通过至少一个中间层彼此分离。