公开(公告)号：US5851895A

公开(公告)日：1998-12-22

申请号：US721917

申请日：1996-09-27

申请人： Johannes W. Weekamp ,  Gerjan F. A. Van De Walle

发明人： Johannes W. Weekamp ,  Gerjan F. A. Van De Walle

IPC分类号： H01C13/00 ,  H01G4/40 ,  H01L21/20 ,  B05D5/12

CPC分类号： H01G4/40

摘要： The invention relates to a hybrid RC element and to a simple method of manufacturing such an element. The inventive hybrid RC element comprises a capacitor body and a resistor body. Said element is characterized in that it includes a block-shaped, ceramic capacitor body which is provided with a contact layer on two parallel surfaces, and in that a block-shaped, ceramic resistor body is provided on one of said contact layers, the surface of the resistor body facing away from the capacitor body also being provided with a contact layer. The resistor body is preferably made from doped Si. The inventive hybrid RC element is very suitable for applications in which the element is exposed to high voltage pulses (1 kV or more). Unlike the known hybrid RC elements, the element in accordance with the invention is not subject to short-circuits under these conditions.

摘要翻译： 本发明涉及混合RC元件和制造这种元件的简单方法。 本发明的混合RC元件包括电容器体和电阻体。 所述元件的特征在于，它包括一个块状的陶瓷电容器本体，其在两个平行的表面上设置有接触层，并且在一个所述接触层上设置块状的陶瓷电阻体， 与电容器本体相反的电阻体也设置有接触层。 电阻体优选由掺杂的Si制成。 本发明的混合RC元件非常适合于其中元件暴露于高电压脉冲（1kV或更高）的应用。 与已知的混合RC元件不同，根据本发明的元件在这些条件下不会发生短路。

公开(公告)号：US20090279575A1

公开(公告)日：2009-11-12

申请号：US12097610

申请日：2006-12-13

申请人： Eric C.E. van Grunsven ,  Willem Hoving ,  Anton P.M. van Arendonk ,  Johannes W. Weekamp ,  Olaf T.J. Vermeulen ,  Marc A. de Samber

发明人： Eric C.E. van Grunsven ,  Willem Hoving ,  Anton P.M. van Arendonk ,  Johannes W. Weekamp ,  Olaf T.J. Vermeulen ,  Marc A. de Samber

IPC分类号： H01S3/10 ,  H01L21/50 ,  H01S3/04 ,  H01S5/00

CPC分类号： H01S5/423 ,  G02F1/37 ,  H01S5/0092 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/141 ,  H01S5/183

摘要： A carrier substrate (100) with laser sources includes a transparent center substrate (20), an upper substrate (30) adhered to the center substrate having openings (40) formed therein to expose the center substrate on a first side, and a lower substrate (32) adhered to the center substrate on a second side opposite the first side and having openings (42) formed therein to expose the center substrate on the second side, the openings on the lower substrate corresponding to positions of the openings in the upper substrate. Frequency conversion elements (60) are disposed on the center substrate within the openings of the lower substrate. Laser dies (70) are aligned to the frequency conversion elements and coupled to the lower substrate to provide light though the frequency conversion elements and the center substrate during operation. Methods for fabrication are also disclosed.

摘要翻译： 具有激光源的载体衬底（100）包括透明中心衬底（20），粘附到具有形成在其中的开口（40）的中心衬底的上衬底（30），以在第一侧上露出中心衬底;以及下衬底 （32）在与所述第一侧相对的第二侧上粘附到所述中心基板并且具有形成在其中的开口（42）以暴露所述第二侧上的所述中心基板，所述下基板上的开口对应于所述上基板中的开口的位置 。 变频元件（60）设置在下基板的开口内的中心基板上。 激光管芯（70）与频率转换元件对准并且耦合到下基板，以在操作期间通过变频元件和中心基板提供光。 还公开了制造方法。

公开(公告)号：US20090159331A1

公开(公告)日：2009-06-25

申请号：US12297022

申请日：2007-04-11

申请人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

发明人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

IPC分类号： H05K7/02 ,  H05K1/11 ,  B23K1/00 ,  B23K37/00

CPC分类号： B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

摘要翻译： 本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以使所述第一和第二图案的所述基本上封闭的构造对准，同时所述基板支撑所述盖的顶表面（28）; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。 此外，本发明涉及电子组件（50），盖（18）和基板（30）。

公开(公告)号：US06181774B2

公开(公告)日：2001-01-30

申请号：US09316782

申请日：1999-05-21

申请人： Menno W. J. Prins ,  Jacobus B. Giesbers ,  Johannes W. Weekamp ,  Theodorus J. A. M. Jans ,  Wilhelmus J. J. Welters ,  Nicolaas P. Willard

发明人： Menno W. J. Prins ,  Jacobus B. Giesbers ,  Johannes W. Weekamp ,  Theodorus J. A. M. Jans ,  Wilhelmus J. J. Welters ,  Nicolaas P. Willard

IPC分类号： G21K300

CPC分类号： B29D99/0089 ,  B29C37/0075 ,  G21K1/10

摘要： An X-ray examination apparatus of this invention comprises an X-ray source, an X-ray detector and an X-ray filter which is located between the X-ray source and the X-ray detector. The X-ray filter includes filter elements, notably capillary tubes, and the X-ray absorption of separate filter elements can be controlled by controlling a quantity of X-ray absorbing liquid in the respective filter elements. The quantity of X-ray absorbing liquid in the individual filter elements is controlled by way of electric voltages applied to the individual filter elements. The filter elements are formed as spaces between deformed foils which are arranged in a stack which is expanded in the direction transversely of the foils. Adjacent foils are locally attached to one another along seams. The stack is arranged between rigid plates and buffer elements are provided between the rigid plates and the stack. The buffer elements are contractable in the direction transversely to the direction of expansion of the stack. The shape of the cross-section of the capillary tubes is dependent on the ratio of the width of the seams to the spacing of the seams.

摘要翻译： 本发明的X射线检查装置包括位于X射线源和X射线检测器之间的X射线源，X射线检测器和X射线滤波器。 X射线过滤器包括过滤元件，特别是毛细管，并且可以通过控制各个过滤器元件中的X射线吸收液体的量来控制单独的过滤器元件的X射线吸收。 各个过滤元件中的X射线吸收液体的量通过施加到各个过滤器元件的电压来控制。过滤元件形成为在横向方向上膨胀的堆叠中布置的变形箔之间的空间 的箔。 相邻的箔片沿着接缝局部附着在一起。 堆叠布置在刚性板之间，缓冲元件设置在刚性板和堆叠之间。 缓冲元件可沿横向于堆叠的膨胀方向收缩。 毛细管横截面的形状取决于接缝宽度与接缝间距的比例。

公开(公告)号：US07884289B2

公开(公告)日：2011-02-08

申请号：US12297022

申请日：2007-04-11

申请人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

发明人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

IPC分类号： H05K7/02

CPC分类号： B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

摘要翻译： 本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以使所述第一和第二图案的所述基本上封闭的构造对准，同时所述基板支撑所述盖的顶表面（28）; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。 此外，本发明涉及电子组件（50），盖（18）和基板（30）。

公开(公告)号：US20090315169A1

公开(公告)日：2009-12-24

申请号：US12373044

申请日：2007-07-10

申请人： Johannes W. Weekamp

发明人： Johannes W. Weekamp

IPC分类号： H01L23/48 ,  H05K7/02 ,  H01L21/50

CPC分类号： H03H9/1057 ,  B81B7/0051 ,  B81C2203/0109 ,  H01L2924/0002 ,  H01L2924/00

摘要： The frame (1) comprises an intermediate layer (5) sandwiched between a first layer (3) with a first pattern and a second layer (4) with a second pattern. Adhesion layers (2,12) are present on the first and second layer (3,4) respectively. The patterns are defined such that bumping portions (31) and a cap (21) are defined. The intermediate layer (5) is continuous and extends over spaces (25) between bumping portions (31) and the cap (21), so as to prevent disintegration. The frame is assembled to a device (50) with an electronic element (52), such as a MEMS element. The cap (21) then encapsulates a cavity (60) over the element (52).

摘要翻译： 框架（1）包括夹在具有第一图案的第一层（3）和具有第二图案的第二层（4）之间的中间层（5）。 粘合层（2,12）分别存在于第一层（3,4）上。 这些图形被限定为使得凸起部分（31）和盖子（21）被限定。 中间层（5）是连续的并且在凸起部分（31）和盖子（21）之间的空间（25）上延伸，以防止分解。 框架被组装到具有诸如MEMS元件的电子元件（52）的设备（50）。 盖（21）然后将空腔（60）封装在元件（52）上。

公开(公告)号：US06370228B1

公开(公告)日：2002-04-09

申请号：US09494669

申请日：2000-01-31

申请人： Alan J. Mockler ,  Menno W. Prins ,  Johannes W. Weekamp

发明人： Alan J. Mockler ,  Menno W. Prins ,  Johannes W. Weekamp

IPC分类号： G21K300

CPC分类号： G21K1/10

摘要： An X-ray filter comprises an array of filter elements (5) an control circuit, the control circuit comprising an array of switching devices (33) provided on a common substrate (52), a switching device (33) being provided for each filter element for switching a control signal to the respective filter element. An output terminal of each switching device is provided with an external connection portion (54) located at the respective switching device. An array of external connection portions (54) is thus provided over the array of switching devices (33). The connection portions are then bonded to a connection block of the array of filter elements. This avoids the need to use edge connections of the substrate (52), and provides a secure mechanical and electrical connection between the control circuit and the filter array.

摘要翻译： 一种X射线滤波器包括一组滤波器元件（5），一个控制电路，该控制电路包括设置在公共衬底（52）上的一组开关器件（33），为每个滤波器提供开关器件（33） 用于将控制信号切换到各个过滤元件的元件。 每个开关装置的输出端子设置有位于相应开关装置处的外部连接部分（54）。 因此，外部连接部分（54）的阵列设置在开关装置阵列33上。 然后将连接部分接合到过滤元件阵列的连接块。 这避免了需要使用衬底（52）的边缘连接，并且在控制电路和过滤器阵列之间提供安全的机械和电连接。

公开(公告)号：US08138596B2

公开(公告)日：2012-03-20

申请号：US12594600

申请日：2008-04-11

申请人： Johannes W. Weekamp

发明人： Johannes W. Weekamp

IPC分类号： H01L23/48

CPC分类号： H01L23/49861 ,  H01L21/4846 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48465 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/15747 ,  Y10T29/49194 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises at least two elongated members (11) comprising electrically conductive material and a filling material (12) comprising electrically insulating material, wherein the members (11) are partially embedded in the filling material (12). The lead frame element (15) is manufactured by providing elongated members (11), positioning the members (11) according to a predetermined configuration, providing filling material (12) to spaces (13) which are present between the members (11), and possibly removing portions of the filling material (12) and the members (11) in order to expose the electrically conductive material of the members (11). An important advantage of manufacturing the lead frame element (15) on the basis of elongated members (11) and a filling material (12) is that no waste or only a small quantity of waste is produced.

摘要翻译： 微电子封装（31）具有被封装在一定数量的材料（27）中的微电子器件，以及用于使微电子器件能够从封装（31）的外部电接触的引线框架元件（15）。 引线框架元件（15）包括至少两个包括导电材料的细长构件（11）和包括电绝缘材料的填充材料（12），其中构件（11）部分地嵌入填充材料（12）中。 通过提供细长构件（11）来制造引线框架元件（15），根据预定构造来定位构件（11），向构件（11）之间存在的间隙（13）提供填充材料（12） 并且可能去除填充材料（12）和构件（11）的部分，以暴露构件（11）的导电材料。 基于细长构件（11）和填充材料（12）制造引线框架元件（15）的重要优点是不产生浪费或仅产生少量的废物。

公开(公告)号：US20100156243A1

公开(公告)日：2010-06-24

申请号：US12446036

申请日：2007-07-20

申请人： Johannes W. Weekamp ,  Samuel R. Peters ,  Richard E. Davidsen ,  Wojtek Sudol

发明人： Johannes W. Weekamp ,  Samuel R. Peters ,  Richard E. Davidsen ,  Wojtek Sudol

IPC分类号： B06B1/06 ,  H01L41/053 ,  H01L41/22 ,  H04R31/00

CPC分类号： H01L25/16 ,  H01L2924/0002 ,  H04R1/06 ,  H04R2217/03 ,  Y10T29/42 ,  Y10T29/49005 ,  H01L2924/00

摘要： An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer 26 is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements 26 electrically couples a contact pad 16 of the ASIC 14 with a corresponding acoustic element 22 of the array 20 of acoustic elements.

摘要翻译： 超声波换能器10包括专用集成电路（ASIC）14，声学元件20阵列和音调独立插入器12. ASIC 14包括在ASIC的表面上的多个接触垫16，该接触垫16与相邻的 其中一个是第一个音调。 阵列20的声学元件22与其相邻的第二音调分离。 此外，音高独立插入器12具有多个导电元件26，其中多个导电元件26与其相邻的导电元件26分开与第一音调和第二音调不同的第三音高。 音调独立插入器26经由多个导电元件的第一子集在第一侧电耦合到ASIC，并且（ii）经由多个导电元件的第二子集在第二侧到声学元件阵列 导电元件，其中所述多个导电元件26中的一个或多个将ASIC 14的接触焊盘16与声学元件阵列20的对应声学元件22电耦合。

公开(公告)号：US20100127385A1

公开(公告)日：2010-05-27

申请号：US12594600

申请日：2008-04-11

申请人： Johannes W. Weekamp

发明人： Johannes W. Weekamp

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/78 ,  H01B5/00 ,  H01R43/00

CPC分类号： H01L23/49861 ,  H01L21/4846 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48465 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/15747 ,  Y10T29/49194 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises at least two elongated members (11) comprising electrically conductive material and a filling material (12) comprising electrically insulating material, wherein the members (11) are partially embedded in the filling material (12). The lead frame element (15) is manufactured by providing elongated members (11), positioning the members (11) according to a predetermined configuration, providing filling material (12) to spaces (13) which are present between the members (11), and possibly removing portions of the filling material (12) and the members (11) in order to expose the electrically conductive material of the members (11). An important advantage of manufacturing the lead frame element (15) on the basis of elongated members (11) and a filling material (12) is that no waste or only a small quantity of waste is produced.

摘要翻译： 微电子封装（31）具有被封装在一定数量的材料（27）中的微电子器件，以及用于使微电子器件能够从封装（31）的外部电接触的引线框架元件（15）。 引线框架元件（15）包括至少两个包括导电材料的细长构件（11）和包括电绝缘材料的填充材料（12），其中构件（11）部分地嵌入填充材料（12）中。 通过提供细长构件（11）来制造引线框架元件（15），根据预定构造来定位构件（11），向构件（11）之间存在的间隙（13）提供填充材料（12） 并且可能去除填充材料（12）和构件（11）的部分，以暴露构件（11）的导电材料。 基于细长构件（11）和填充材料（12）制造引线框架元件（15）的重要优点是不产生浪费或仅产生少量的废物。