公开(公告)号：US5300057A

公开(公告)日：1994-04-05

申请号：US950204

申请日：1992-09-24

申请人： John A. Miller ,  Earl Tate, Jr. ,  Ruben E. Velasquez Urey ,  Yasuhiro Kono ,  Yoshihiro Akiyama ,  Robert S. Mulder

发明人： John A. Miller ,  Earl Tate, Jr. ,  Ruben E. Velasquez Urey ,  Yasuhiro Kono ,  Yoshihiro Akiyama ,  Robert S. Mulder

IPC分类号： A61F13/58 ,  C09J7/02 ,  C09J153/02 ,  A61F13/15

CPC分类号： C09J7/0221 ,  A61F13/58 ,  C09J153/02

摘要： A tape closure system exhibiting high shear and high non-shocky peel to a low adhesion backsize coated substrate is disclosed. The adhesive used on the fastening tape used in the closure system comprises a high diblock (.gtoreq.25 percent) styrene-isoprene-styrene elastomer component with a composite midblock glass transition temperature of 244 to 264 Kelvin with 30 to 60 percent elastomer.

摘要翻译： 公开了一种表现出高剪切和高不可剥离剥离到低粘度背胶涂覆基材的胶带封闭系统。 在闭合系统中使用的紧固带上使用的粘合剂包含具有244至264开口的复合中间块玻璃化转变温度的高二嵌段（> = 25％）苯乙烯 - 异戊二烯 - 苯乙烯弹性体组分，具有30至60％的弹性体。

公开(公告)号：US5468237A

公开(公告)日：1995-11-21

申请号：US896415

申请日：1992-06-10

申请人： John A. Miller ,  Ruben E. Velasquez Urey ,  Earl Tate, Jr.

发明人： John A. Miller ,  Ruben E. Velasquez Urey ,  Earl Tate, Jr.

IPC分类号： A61F13/58 ,  C09J7/02 ,  C09J109/06 ,  C09J121/00 ,  C09J153/00 ,  C09J153/02 ,  A61F13/15 ,  B32B7/12 ,  C08L9/00

CPC分类号： C09J7/0221 ,  A61F13/58 ,  C09J153/02 ,  Y10T428/2852

摘要： A pressure-sensitive adhesive and tape are provided having a rubber component (30-60 weight percent) of polyisoprene (4-55 weight percent) blended with a styrene-isoprene-styrene block copolymer (96-45 weight percent) and a tackifying component (70-40 weight percent) to provide an adhesive that exhibits superior adhesion performance to low surface energy substrates.

摘要翻译： 提供了一种压敏粘合剂和胶带，其具有与苯乙烯 - 异戊二烯 - 苯乙烯嵌段共聚物（96-45重量％）共混的聚异戊二烯（4-55重量％）的橡胶组分（30-60重量％）和增粘组分 （70-40重量％）以提供对低表面能基材表现出优异的粘合性能的粘合剂。

公开(公告)号：US10004175B1

公开(公告)日：2018-06-26

申请号：US15470990

申请日：2017-03-28

申请人： John A. Miller

发明人： John A. Miller

IPC分类号： A01C21/00 ,  A01C13/00 ,  A01C23/02

CPC分类号： A01C21/002 ,  A01C5/066 ,  A01C13/00 ,  A01C23/024

摘要： Fertilizer is applied between the rows of growing plants or to the bases of growing plants in adjacent rows. A dirt moving member then moves dirt and any applied fertilizer from between the rows onto the bases of the growing plants in the adjacent rows. The dirt acts to seal the fertilizer and to significantly reduce fertilizer losses.

公开(公告)号：US20120197279A1

公开(公告)日：2012-08-02

申请号：US13015257

申请日：2011-01-27

申请人： Miguelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

发明人： Miguelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

IPC分类号： A61B17/32

CPC分类号： A61B17/3211 ,  A61B17/1671 ,  A61B2217/005

摘要： An up-cutting knife that has particular application for minimally invasive spinal surgical procedures. The knife includes an elongated tube that is operable to be inserted through a tubular retractor used in minimally invasive surgical procedures. One end of the elongated tube includes a curved head portion having a cutting blade formed on a top surface thereof and a suction port, and an opposite end of the tube is coupled to a handle having a chamber. A suction device can be coupled to an outlet port in the handle that causes blood and other surgical material to be drawn through the tube and out of the handle.

摘要翻译： 一种特殊应用于微创脊柱外科手术的切割刀。 刀包括细长管，其可操作地插入通过用于微创外科手术的管状牵缩器。 细长管的一端包括弯曲头部，其具有形成在其顶表面上的切割刀片和吸入口，并且该管的相对端连接到具有腔室的手柄。 抽吸装置可以联接到手柄中的出口端口，其使得血液和其它手术材料通过管被拉出并从手柄中移出。

公开(公告)号：US20110142067A1

公开(公告)日：2011-06-16

申请号：US12639556

申请日：2009-12-16

申请人： Timothy J. JEHL ,  Pradeepsunder Ganesh ,  Aimee Wood ,  Robert Safranek ,  John A. Miller ,  Selim Bilgin ,  Osama Neiroukh

发明人： Timothy J. JEHL ,  Pradeepsunder Ganesh ,  Aimee Wood ,  Robert Safranek ,  John A. Miller ,  Selim Bilgin ,  Osama Neiroukh

IPC分类号： H04J3/02

CPC分类号： H04L47/2441 ,  H04L47/263 ,  H04L47/39

摘要： A method and system for dynamic credit sharing in a quick path interconnect link. The method including dividing incoming credit into a first credit pool and a second credit pool; and allocating the first credit pool for a first data traffic queue and allocating the second credit pool for a second data traffic queue in a manner so as to preferentially transmit the first data traffic queue or the second data traffic queue through a link.

摘要翻译： 一种快速路径互联链路中动态信用共享的方法和系统。 该方法包括将入款信用分为第一信用卡和第二信用卡; 以及为第一数据业务队列分配所述第一信用卡并且以使得通过链路优先地发送所述第一数据业务队列或所述第二数据业务队列的方式为所述第二数据业务队列分配所述第二信用卡。

公开(公告)号：US20110131373A1

公开(公告)日：2011-06-02

申请号：US12627440

申请日：2009-11-30

申请人： Pankaj Kumar ,  Hang T. Nguyen ,  Mark Yarch ,  Timothy J. Jehl ,  John A. Miller

发明人： Pankaj Kumar ,  Hang T. Nguyen ,  Mark Yarch ,  Timothy J. Jehl ,  John A. Miller

IPC分类号： G06F12/08 ,  G06F12/00 ,  G06F12/16

CPC分类号： G06F11/2089 ,  G06F11/2097

摘要： In one embodiment, the present invention includes canisters to control storage of data in a storage system including a plurality of disks. Each of multiple canisters may have a processor configured for uniprocessor mode and having an internal node identifier to identify the processor and an external node identifier to identify another processor with which it is to mirror cached data. The mirroring of cached data may be performed by communication of non-coherent transactions via the PtP interconnect, wherein the PtP interconnect is according to a cache coherent protocol. Other embodiments are described and claimed.

摘要翻译： 在一个实施例中，本发明包括用于控制包括多个盘的存储系统中的数据存储的罐。 多个罐中的每一个可以具有配置成用于单处理器模式并具有内部节点标识符以识别处理器和外部节点标识符的处理器，以识别用于镜像缓存数据的另一个处理器。 缓存数据的镜像可以通过经由PtP互连的非相干事务的通信来执行，其中PtP互连是根据高速缓存一致性协议。 描述和要求保护其他实施例。

公开(公告)号：US20110046743A1

公开(公告)日：2011-02-24

申请号：US12917089

申请日：2010-11-01

申请人： Miquelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

发明人： Miquelangelo J. Perez-Cruet ,  John R. Pepper ,  John A. Miller

IPC分类号： A61F2/44

CPC分类号： A61F2/4455 ,  A61B2017/0256 ,  A61F2/447 ,  A61F2/4601 ,  A61F2/4611 ,  A61F2002/3008 ,  A61F2002/30166 ,  A61F2002/30235 ,  A61F2002/30367 ,  A61F2002/30426 ,  A61F2002/3082 ,  A61F2002/4627 ,  A61F2002/4629 ,  A61F2220/0025 ,  A61F2220/0033 ,  A61F2230/0028 ,  A61F2230/0069 ,  A61F2250/0098 ,  A61F2310/00023

摘要： An interbody device that restores the disc space height between two vertebrae during spinal fusion surgery. The device includes a center plate surrounded by a perimeter portion that combine to have a relatively flat configuration in one dimension and relatively wide configuration in a perpendicular dimension. After the disc space has been cleared, the device is inserted into the disc space in a direction so that the wide dimension of the device is substantially parallel to the body of the vertebrae. The device is then rotated so that the wide dimension of the device becomes perpendicular to the vertebral body so as to cause the disc space height to be restored. Bone graft material is then introduced through a fill tube coupled to the device so that the bone graft material is distributed on both sides of the center plate and into the disc space.

摘要翻译： 一种椎体内装置，可恢复脊柱融合手术期间椎间盘高度。 该装置包括由周边部分围绕的中心板，该中心板在一个维度上组合成具有相对平坦的构造，在垂直方向上具有相对宽的构造。 在盘空间已经被清除之后，装置沿着一个方向插入到盘片空间中，使得装置的宽尺寸基本上平行于椎骨的主体。 然后使装置旋转，使得装置的宽尺寸变得垂直于椎体，以便使椎间盘空间高度恢复。 骨移植材料然后通过连接到该装置的填充管引入，使得骨移植材料分布在中心板的两侧并进入椎间盘空间。

公开(公告)号：US20080233751A1

公开(公告)日：2008-09-25

申请号：US11690432

申请日：2007-03-23

申请人： Keith E. Barton ,  Thomas A. Bauer ,  Stanley J. Klepeis ,  John A. Miller ,  Yun-Yu Wang

发明人： Keith E. Barton ,  Thomas A. Bauer ,  Stanley J. Klepeis ,  John A. Miller ,  Yun-Yu Wang

IPC分类号： H01L21/461

CPC分类号： G01N1/32 ,  H01L22/24

摘要： Methods of uniformly delayering an IC chip are disclosed. One embodiment includes: performing an ash on the wafer including an Al layer thereof and etching the Al layer; polishing an edge of the wafer using a slurry including an approximately 30 μm polishing particles; removing the aluminum layer and at least one metal layer by polishing using a slurry including approximately 9 μm diamond polishing particles and a non-abrasive backside of a polishing sheet; removing any remaining metal layers to a first metal layer by polishing using a slurry including approximately 3 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; removing any scratches by polishing using a slurry including approximately 1 μm diamond polishing particles and the non-abrasive backside of a polishing sheet; and removing the first metal layer to a polyconductor layer by polishing using a colloidal slurry including approximately 0.25 μm diamond polishing particles.

摘要翻译： 公开了均匀地延迟IC芯片的方法。 一个实施例包括：在包括其Al层的晶片上执行灰分并蚀刻Al层; 使用包含约30μm的抛光颗粒的浆料抛光晶片的边缘; 通过使用包含大约9μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来去除铝层和至少一个金属层; 通过使用包含大约3μm的金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光，将任何剩余的金属层除去到第一金属层; 通过使用包括大约1毫米金刚石抛光颗粒和抛光片的非研磨背面的浆料进行抛光来除去任何划痕; 并且通过使用包含大约0.25μm金刚石抛光颗粒的胶体浆料进行抛光将第一金属层去除到多导体层。

公开(公告)号：US06539625B2

公开(公告)日：2003-04-01

申请号：US09759017

申请日：2001-01-11

申请人： Brett H. Engel ,  Mark Hoinkis ,  John A. Miller ,  Soon-Cheon Seo ,  Yun-Yu Wang ,  Kwong Hon Wong

发明人： Brett H. Engel ,  Mark Hoinkis ,  John A. Miller ,  Soon-Cheon Seo ,  Yun-Yu Wang ,  Kwong Hon Wong

IPC分类号： H05K302

CPC分类号： H01L21/76843 ,  H01L21/76846 ,  H01L23/53238 ,  H01L2924/0002 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

摘要： In integrated circuits having copper interconnect and low-k interlayer dielectrics, a problem of open circuits after heat treatment was discovered and solved by the use of a first liner layer of Cr, followed by a conformal liner layer of CVD TiN, followed in turn by a final liner layer of Ta or TaN, thus improving adhesion between the via and the underlying copper layer while maintaining low resistance.

公开(公告)号：US06417567B1

公开(公告)日：2002-07-09

申请号：US09482547

申请日：2000-01-13

申请人： Anthony G. Domenicucci ,  Lynne M. Gignac ,  Yun-Yu Wang ,  Horatio S. Wildman ,  Kwong Hon Wong ,  Roy A. Carruthers ,  Christian Lavoie ,  John A. Miller

发明人： Anthony G. Domenicucci ,  Lynne M. Gignac ,  Yun-Yu Wang ,  Horatio S. Wildman ,  Kwong Hon Wong ,  Roy A. Carruthers ,  Christian Lavoie ,  John A. Miller

IPC分类号： H01L2348

CPC分类号： H01L21/76855 ,  H01L21/28518 ,  H01L21/28568 ,  H01L21/3212 ,  H01L21/76856 ,  H01L2221/1078

摘要： A conductive contact having an atomically flat interface. The contact includes, in order, a silicon substrate, a highly disordered silicide layer, and a titanium oxynitride layer. The silicide layer is formed of titanium, silicon, and one of the elements tungsten, tantalum, and molybdenum. The interface between the silicon substrate and the silicide layer is atomically flat. The flat interface prevents diffusion of conductive materials into the underlying silicon substrate. The contact is useful especially for very small devices and shallow junctions, such as are required for ULSI shallow junctions.

摘要翻译： 具有原子平坦界面的导电接触。 接触依次包括硅衬底，高度无序的硅化物层和氮氧化钛层。 硅化物层由钛，硅和元素钨，钽和钼之一形成。 硅衬底和硅化物层之间的界面是原子平坦的。 平面界面防止导电材料扩散到下面的硅衬底中。 该接触对于非常小的器件和浅接头是有用的，例如ULSI浅结点所需的。