Memory BIST and repair
    1.
    发明授权
    Memory BIST and repair 有权
    记忆BIST和修复

    公开(公告)号:US06766468B2

    公开(公告)日:2004-07-20

    申请号:US09682023

    申请日:2001-07-11

    IPC分类号: H02H305

    摘要: A method of memory BIST (Built-In Self Test) and memory repair that stores a redundancy calculation on-chip, as opposed to scanning this data off-chip for later use. This method no longer requires level-sensitive scan design (LSSD) scanning of memory redundancy data off-chip to the tester, and therefore does not require re-contacting of the chip for electrical fuse blow.

    摘要翻译: 内存BIST(内置自检)和内存修复方法,用于存储片上冗余计算,而不是将数据片外扫描以备以后使用。 该方法不再需要对测试仪进行片外存储器冗余数据的电平敏感扫描设计(LSSD)扫描,因此不需要再次接触芯片进行电熔丝熔断。

    Self timing interlock circuit for embedded DRAM
    2.
    发明授权
    Self timing interlock circuit for embedded DRAM 有权
    嵌入式DRAM的自定时互锁电路

    公开(公告)号:US06577548B1

    公开(公告)日:2003-06-10

    申请号:US10065223

    申请日:2002-09-26

    IPC分类号: G11C702

    摘要: A method and circuit for a self timed DRAM. The circuit includes interlock circuits coupled to an extension of the DRAM. The extension does not store “real” data but mimics the operations of the DRAM. The interlock circuits, in conjunction with the extension monitor and control read and write timings of the DRAM and self adjust these timings via feedback. To properly track DRAM cell timings, the interlock circuits and extension use the same cell design and load conditions as the DRAM. The method includes: activating a wordline and reference wordline, interlocking the sense amplifiers, column select and write back functions of the primary DRAM array by monitoring the identical reference cells and the state of the bitline in the extension DRAM array.

    摘要翻译: 一种自定时DRAM的方法和电路。 该电路包括耦合到DRAM延伸部的互锁电路。 扩展不存储“真实”数据,但模拟DRAM的操作。 互锁电路结合扩展监视器和控制DRAM的读写定时,并通过反馈自行调整这些定时。 为了正确跟踪DRAM单元定时,互锁电路和扩展使用与DRAM相同的单元设计和负载条件。 该方法包括:通过监视相同的参考单元和扩展DRAM阵列中的位线的状态来激活字线和参考字线,使读出放大器互锁,主DRAM阵列的列选择和回写功能。

    Remote BIST high speed test and redundancy calculation
    3.
    发明授权
    Remote BIST high speed test and redundancy calculation 有权
    远程BIST高速测试和冗余计算

    公开(公告)号:US07401281B2

    公开(公告)日:2008-07-15

    申请号:US10707971

    申请日:2004-01-29

    IPC分类号: G01R31/28 G11C29/00 G11C7/00

    摘要: Disclosed is a hybrid built-in self test (BIST) architecture for embedded memory arrays that segments BIST functionality into remote lower-speed executable instructions and local higher-speed executable instructions. A standalone BIST logic controller operates at a lower frequency and communicates with a plurality of embedded memory arrays using a BIST instruction set. A block of higher-speed test logic is incorporated into each embedded memory array under test and locally processes BIST instructions received from the standalone BIST logic controller at a higher frequency. The higher-speed test logic includes a multiplier for increasing the frequency of the BIST instructions from the lower frequency to the higher frequency. The standalone BIST logic controller enables a plurality of higher-speed test logic structures in a plurality of embedded memory arrays.

    摘要翻译: 公开了一种用于嵌入式存储器阵列的混合内置自测(BIST)架构,其将BIST功能分段成远程低速可执行指令和本地较高速可执行指令。 独立的BIST逻辑控制器以较低的频率工作,并使用BIST指令集与多个嵌入式存储器阵列进行通信。 一个高速测试逻辑块被并入被测试的每个嵌入式存储器阵列中,并以更高的频率在本地处理从独立BIST逻辑控制器接收的BIST指令。 高速测试逻辑包括用于将BIST指令的频率从较低频率增加到较高频率的乘法器。 独立的BIST逻辑控制器使多个嵌入式存储器阵列中的多个更高速的测试逻辑结构能够实现。

    Structures for wafer level test and burn-in
    4.
    发明授权
    Structures for wafer level test and burn-in 失效
    晶圆级测试和老化的结构

    公开(公告)号:US06233184B1

    公开(公告)日:2001-05-15

    申请号:US09191954

    申请日:1998-11-13

    IPC分类号: G11C2900

    摘要: Wafer test and burn-in is accomplished with state machine or programmable test engines located on the wafer being tested. Each test engine requires less than 10 connections and each test engine can be connected to a plurality of chips, such as a row or a column of chips on the wafer. Thus, the number of pads of the wafer that must be connected for test is substantially reduced while a large degree of parallel testing is still provided. The test engines also permit on-wafer allocation of redundancy in parallel so that failing chips can be repaired after burn-in is complete. In addition, the programmable test engines can have their code altered so test programs can be modified to account for new information after the wafer has been fabricated. The test engines are used during burn-in to provide high frequency write signals to DRAM arrays that provide a higher effective voltage to the arrays, lowering the time required for burn-in. Connections to the wafer and between test engines and chips are provided along a membrane attached to the wafer. Membrane connectors can be formed or opened after the membrane is connected to the wafer so shorted chips can be disconnected. Preferably the membrane remains on the wafer after test, burn-in and dicing to provide a chip scale package. Thus, the very high cost of TCE matched materials, such as glass ceramic contactors, for wafer burn-in is avoided while providing benefit beyond test and burn-in for packaging.

    摘要翻译: 晶圆测试和老化是通过位于被测晶片上的状态机或可编程测试引擎完成的。 每个测试引擎需要少于10个连接,并且每个测试引擎可以连接到多个芯片,例如晶片上的行或一列芯片。 因此,仍然提供必须连接用于测试的晶片的焊盘数量,同时还提供大量的并行测试。 测试引擎还允许并行的片上分配冗余,以便在老化完成后可以修复故障的芯片。 此外,可编程测试引擎可以对其代码进行更改,因此可以修改测试程序以在晶圆制造之后考虑新的信息。 在老化期间使用测试引擎向DRAM阵列提供高频写入信号,为阵列提供更高的有效电压,从而降低老化所需的时间。 沿着连接到晶片的膜提供与晶片和测试引擎与芯片之间的连接。 膜连接器可以在膜连接到晶片之后形成或打开,因此短路芯片可以断开。 优选地,膜在测试之后保留在晶片上,老化和切割以提供芯片级封装。 因此,避免了TCE匹配材料(例如玻璃陶瓷接触器)用于晶片老化的非常高的成本,同时提供超出测试和包装封装的优点。

    Method for testing embedded DRAM arrays
    5.
    发明授权
    Method for testing embedded DRAM arrays 失效
    嵌入式DRAM阵列测试方法

    公开(公告)号:US07237165B2

    公开(公告)日:2007-06-26

    申请号:US10994496

    申请日:2004-11-22

    IPC分类号: G01R31/28 G11C29/00

    摘要: A system for testing a DRAM includes DRAM blocks, the system further includes a processor based built-in self test system for generating a test data pattern, for each DRAM block, performing a write of the test data pattern into the DRAM block, performing a pause for a predetermined period of time, and performing a read of a resulting data pattern from the DRAM block. For each DRAM block, the performing the write of the test pattern into the DRAM block is performed before the performing the pause for the predetermined period of time, and the performing the read of the resulting data pattern from the DRAM block is performed after the performing the pause for the predetermined period of time, and at least a portion of the pause for the predetermined period of time of two or more the DRAM blocks overlap in time.

    摘要翻译: 用于测试DRAM的系统包括DRAM块,该系统还包括用于为每个DRAM块生成测试数据模式的基于处理器的内置自测试系统,将测试数据模式写入DRAM块,执行 暂停预定时间段,并且从DRAM块执行所得数据模式的读取。 对于每个DRAM块,在执行暂停预定时间段之前执行将测试图案写入DRAM块的执行,并且在执行结果之后执行从DRAM块读取得到的数据模式 在预定时间段中的暂停,以及两个或更多个DRAM块的预定时间段的暂停的至少一部分在时间上重叠。

    Power up detection circuits
    6.
    发明授权
    Power up detection circuits 失效
    上电检测电路

    公开(公告)号:US5463335A

    公开(公告)日:1995-10-31

    申请号:US969594

    申请日:1992-10-30

    IPC分类号: H01L27/00 H03K17/22

    CPC分类号: H03K17/223

    摘要: A power up detection circuit is provided which includes a power supply terminal, an output terminal, an impedance device coupling the output terminal to the power supply terminal and a latch including a first inverter having a first device connected between the output terminal and a point of reference potential and a second device connected between the output terminal and the power supply terminal, the devices are designed so that subthreshold current passing through the first device is greater than the effective subthreshold current passing through the impedance device and the second device, and a second inverter including third and fourth devices which are designed so that a smaller subthreshold current passes through the third device than the subthreshold current passing through the fourth device. The power up circuit may further include a capacitor connected between the power supply terminal and gate electrodes of the first and second devices.

    摘要翻译: 提供了一种上电检测电路,其包括电源端子,输出端子,将输出端子耦合到电源端子的阻抗装置和包括第一反相器的锁存器,第一反相器具有连接在输出端子与点 参考电位和连接在输出端子和电源端子之间的第二器件,器件被设计成使得通过第一器件的亚阈值电流大于通过阻抗器件和第二器件的有效亚阈值电流,并且第二器件 逆变器包括第三和第四器件,其被设计为使得比通过第四器件的亚阈值电流更小的亚阈值电流通过第三器件。 上电电路还可以包括连接在第一和第二器件的电源端子和栅电极之间的电容器。

    Off-chip driver circuits
    8.
    发明授权
    Off-chip driver circuits 失效
    片外驱动电路

    公开(公告)号:US4709162A

    公开(公告)日:1987-11-24

    申请号:US908849

    申请日:1986-09-18

    摘要: An off-chip driver circuit is provided which includes a pull-up device disposed between an output terminal and a first voltage dropping diode which is connected to a first voltage supply source and a first voltage limiting circuit connected to the common point between the pull-up device and the voltage dropping diode. The off-chip driver circuit further includes an input inverter circuit having an output connected to the control element of the pull-up device. The inverter circuit has a P-channel field effect transistor and an N-channel field effect transistor serially connected with a second voltage dropping diode which is connected to the first voltage supply source and a second voltage limiting circuit connected to the common point between the second voltage dropping diode and the P-channel field effect transistor of the input inverter. First and second switches are also provided to short out the first and second voltage dropping diodes, respectively, when all circuits connected to the output terminal use a common voltage supply. A pull-down device serially connected to a pass device is provided between the output terminal and a point of reference potential. A buffer circuit having an output connected to the pull-down device is coupled to a second voltage supply source having a voltage significantly lower than the voltage of the first voltage supply source.

    摘要翻译: 提供了一种片外驱动电路,其包括设置在输出端和第一降压二极管之间的上拉装置,第一降压二极管连接到第一电压源和连接到第一电压限制电路之间的公共点的第一电压限制电路, 升压器件和降压二极管。 片外驱动电路还包括具有与上拉装置的控制元件连接的输出的输入反相器电路。 逆变器电路具有P沟道场效应晶体管和与第一电压源连接的第二降压二极管串联连接的N沟道场效应晶体管,以及与第二电压限制电路连接的第二电压限制电路 降压二极管和输入逆变器的P沟道场效应晶体管。 当连接到输出端子的所有电路都使用公共电压源时,也提供第一和第二开关来短路第一和第二降压二极管。 串联连接到通过装置的下拉装置设置在输出端子和参考点之间。 具有连接到下拉装置的输出的缓冲电路被耦合到具有显着低于第一电压源的电压的电压的第二电压源。

    Voltage boost system, IC and design structure
    10.
    发明授权
    Voltage boost system, IC and design structure 失效
    电压升压系统,集成电路和设计结构

    公开(公告)号:US07733161B2

    公开(公告)日:2010-06-08

    申请号:US12031729

    申请日:2008-02-15

    IPC分类号: H02M3/18 G05F3/16

    CPC分类号: H02M3/07

    摘要: A voltage boost system, IC and design structure are disclosed for boosting a supply voltage while preventing forward biasing of n-well structures. The voltage boost system may include a first voltage boost circuit producing a first boosted voltage using at least one voltage boost sub-circuit, each of the at least one voltage boost sub-circuit having an output passgate in an n-well; a second voltage boost circuit producing a second boosted voltage, the n-well of each output passgate being biased using the second boosted voltage, wherein the second boosted voltage is greater than the first boosted voltage. Voltage boost sub-circuits may use gate control circuitry to reduce gate oxide stress, thus allowing lower voltage level FETs to be used.

    摘要翻译: 公开了升压系统,IC和设计结构,用于提高电源电压,同时防止n阱结构的向前偏置。 升压系统可以包括使用至少一个升压子电路产生第一升压电压的第一升压电路,所述至少一个升压子电路中的每一个在n阱中具有输出通路; 产生第二升压电压的第二升压电路,使用第二升压电压对每个输出通道的n阱进行偏置,其中第二升压电压大于第一升压电压。 电压升压子电路可以使用栅极控制电路来减小栅极氧化物应力,从而允许使用较低电压电平的FET。