公开(公告)号：US20050007219A1

公开(公告)日：2005-01-13

申请号：US10912413

申请日：2004-08-04

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC分类号： H01H59/00 ,  H01H51/22

CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。

公开(公告)号：US06967548B2

公开(公告)日：2005-11-22

申请号：US10912413

申请日：2004-08-04

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC分类号： H01H59/00 ,  H01P1/10

CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

公开(公告)号：US06686820B1

公开(公告)日：2004-02-03

申请号：US10194096

申请日：2002-07-11

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC分类号： H01P110

CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

摘要翻译： 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。

公开(公告)号：US06673697B2

公开(公告)日：2004-01-06

申请号：US10114694

申请日：2002-04-03

申请人： Qing Ma ,  Valluri Rao ,  Li-Peng Wang ,  John Heck ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  Li-Peng Wang ,  John Heck ,  Quan Tran

IPC分类号： H01L2130

CPC分类号： B81B7/0006 ,  B81C2203/0118 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.

公开(公告)号：US20060176126A1

公开(公告)日：2006-08-10

申请号：US11335920

申请日：2006-01-19

申请人： Li-Peng Wang ,  Eyal Bar-Sadeh ,  Valluri Rao ,  John Heck ,  Qing Ma ,  Quan Tran ,  Alexander Talalyevsky ,  Eyal Ginsburg

发明人： Li-Peng Wang ,  Eyal Bar-Sadeh ,  Valluri Rao ,  John Heck ,  Qing Ma ,  Quan Tran ,  Alexander Talalyevsky ,  Eyal Ginsburg

IPC分类号： H04R17/00

CPC分类号： H03H9/564 ,  H03H3/02 ,  Y10T29/42

摘要： A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lower conductive layer which is defined to form the bottom electrode of each film bulk acoustic resonator. A common top conductive layer may be defined to form each top electrode of each film bulk acoustic resonator. A common piezoelectric film layer, that may or may not be patterned, forms a continuous or discontinuous film.

摘要翻译： 薄膜体声波谐振器滤波器可以形成有形成在同一膜上的多个互连串联和分流膜体声波谐振器。 膜体积声谐振器中的每一个可以由限定为形成每个膜体声波谐振器的底部电极的公共下导电层形成。 可以限定共同的顶部导电层以形成每个膜体声波谐振器的每个顶部电极。 可以或可以不被图案化的公共压电膜层形成连续或不连续的膜。

公开(公告)号：US06903452B2

公开(公告)日：2005-06-07

申请号：US10643427

申请日：2003-08-19

申请人： Qing Ma ,  Valluri Rao ,  Li-Peng Wang ,  John Heck ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  Li-Peng Wang ,  John Heck ,  Quan Tran

IPC分类号： B81B7/00 ,  H01L23/02 ,  H01L23/34 ,  H01L23/48

CPC分类号： B81B7/0006 ,  B81C2203/0118 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.

摘要翻译： 微机电系统可封闭在由连接的第一和第二半导体结构限定的密封腔中。 接合结构可以通过完全围绕空腔延伸的焊料密封环密封。 半导体结构中的一个可以具有形成在其上的系统，并且可以在所述系统下方形成开放区域。 该开放区域可以由结构的下侧形成，并且在一个实施例中可以通过用适当的膜覆盖来封闭。

公开(公告)号：US06812814B2

公开(公告)日：2004-11-02

申请号：US10681550

申请日：2003-10-07

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC分类号： H01P110

CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

公开(公告)号：US20060001329A1

公开(公告)日：2006-01-05

申请号：US10882510

申请日：2004-06-30

申请人： Valluri Rao ,  Qing Ma ,  Quan Tran ,  Dong Shim ,  Li-Peng Wang

发明人： Valluri Rao ,  Qing Ma ,  Quan Tran ,  Dong Shim ,  Li-Peng Wang

IPC分类号： H01L41/08

CPC分类号： H03H9/02102 ,  H03H2009/02196

摘要： A film bulk acoustic resonator (FBAR) comprises a piezoelectric film sandwiched between a top electrode and a bottom electrode. A temperature sensor is provided to sense a temperature to determine a temperature induced frequency drift for the FBAR. A voltage controller operatively connected to the temperature sensor supplies a direct current (DC) bias voltage to the FBAR to induce an opposite voltage induced frequency drift to compensate for the temperature induced frequency drift.

摘要翻译： 薄膜体声波谐振器（FBAR）包括夹在顶部电极和底部电极之间的压电薄膜。 提供温度传感器以感测温度以确定FBAR的温度感应频率漂移。 可操作地连接到温度传感器的电压控制器向FBAR提供直流（DC）偏置电压以引起相反的电压感应频率漂移以补偿温度引起的频率漂移。

公开(公告)号：US08940234B2

公开(公告)日：2015-01-27

申请号：US13444045

申请日：2012-04-11

申请人： Yuegang Zhang ,  Andrew A. Berlin ,  Qing Ma ,  Li-Peng Wang ,  Valluri Rao ,  Mineo Yamakawa

发明人： Yuegang Zhang ,  Andrew A. Berlin ,  Qing Ma ,  Li-Peng Wang ,  Valluri Rao ,  Mineo Yamakawa

IPC分类号： G01N15/06 ,  G01N33/543 ,  B82Y15/00 ,  B82Y30/00 ,  G01N29/02 ,  G01N29/036 ,  G01N29/34 ,  G01N33/00 ,  G01N29/24 ,  G01N27/12

CPC分类号： G01N33/54373 ,  B82Y15/00 ,  B82Y30/00 ,  G01N27/126 ,  G01N29/022 ,  G01N29/036 ,  G01N29/2437 ,  G01N29/348 ,  G01N33/0031 ,  G01N2291/02466 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  Y10T436/11 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/25375

摘要： Systems and methods for detecting the presence of biomolecules in a sample using biosensors that incorporate resonators which have functionalized surfaces for reacting with target biomolecules. In one embodiment, a device includes a piezoelectric resonator having a functionalized surface configured to react with target molecules, thereby changing the mass and/or charge of the resonator which consequently changes the frequency response of the resonator. The resonator's frequency response after exposure to a sample is compared to a reference, such as the frequency response before exposure to the sample, a stored baseline frequency response or a control resonator's frequency response.

摘要翻译： 使用包含具有功能化表面以与靶生物分子反应的共振器的生物传感器来检测样品中存在生物分子的系统和方法。 在一个实施例中，器件包括压电谐振器，其具有被配置为与靶分子反应的官能化表面，从而改变谐振器的质量和/或电荷，从而改变谐振器的频率响应。 将曝光后的谐振器频率响应与参考值进行比较，例如在暴露于采样之前的频率响应，存储的基准频率响应或控制谐振器的频率响应。

公开(公告)号：US20090152684A1

公开(公告)日：2009-06-18

申请号：US11958773

申请日：2007-12-18

申请人： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

发明人： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

IPC分类号： H01L29/04 ,  H01L21/02

CPC分类号： H01L21/02304 ,  H01L21/02189 ,  H01L21/02192 ,  H01L21/02266 ,  H01L21/02274 ,  H01L21/02277 ,  H01L21/02293 ,  H01L21/31691 ,  H01L27/11502 ,  H01L27/11585 ,  H01L28/40 ,  H01L28/55 ,  H01L29/40111

摘要： The present invention describes a method including: providing a substrate; forming a buffer layer epitaxially over the substrate with a manufacture-friendly process; forming a bottom electrode epitaxially over the buffer layer; and forming a ferroelectric layer epitaxially over the bottom electrode.

摘要翻译： 本发明描述了一种方法，包括：提供衬底; 以制造友好的方法在衬底上外延形成缓冲层; 在所述缓冲层上外延地形成底部电极; 以及在所述底部电极上外延地形成铁电层。