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    Abrasive article and method of making same
    1.
    发明授权
    Abrasive article and method of making same 失效
    磨料制品及其制造方法

    公开(公告)号：US5489235A

    公开(公告)日：1996-02-06

    申请号：US120297

    申请日：1993-09-13

    申请人： John J. Gagliardi ,  Roger C. Lokken

    发明人： John J. Gagliardi ,  Roger C. Lokken

    IPC分类号： B24B21/00 ,  B24D3/00 ,  B24D11/00 ,  B24D11/06

    CPC分类号： B24D11/00

    摘要： The invention provides an abrasive article having a surface having a machine direction axis and opposite side edges, each side edge being parallel to the machine direction axis and a plurality of parallel rows of abrasive composites in fixed position on the surface, each row being aligned at an angle with a side edge which is neither 0.degree. nor 90.degree., and methods for making such an abrasive article. The abrasive article of this invention also can be used in any convenient form including an endless belt. The resulting abrasive article provides a high rate of cut, long belt life, and a relatively fine surface finish on the workpiece being abraded.

    摘要翻译： 本发明提供了一种磨料制品，其具有具有机器方向轴线和相对侧边缘的表面，每个侧边缘平行于纵向轴线，并且多个平行的研磨复合体行在表面上处于固定位置，每排排列在 与0°和90°的侧边缘成角度，以及制造这种磨料制品的方法。 本发明的磨料制品也可以以任何方便的形式使用，包括环形带。 所得到的磨料制品提供高的切割速度，长的皮带寿命，并且在被磨损的工件上具有相对精细的表面光洁度。

    Structured abrasive article, method of making the same, and use in wafer planarization
    2.
    发明授权
    Structured abrasive article, method of making the same, and use in wafer planarization 有权
    结构化磨料制品，其制造方法，并用于晶片平面化

    公开(公告)号：US08251774B2

    公开(公告)日：2012-08-28

    申请号：US12539798

    申请日：2009-08-12

    申请人： William D. Joseph ,  Julie Y. Qian ,  Jimmie R. Baran, Jr. ,  John J. Gagliardi

    发明人： William D. Joseph ,  Julie Y. Qian ,  Jimmie R. Baran, Jr. ,  John J. Gagliardi

    IPC分类号： B24B49/00

    CPC分类号： B24B37/245 ,  B24B37/205 ,  B24D18/00

    摘要： A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.

    摘要翻译： 结构化磨料制品包括至少半透明的膜背衬和设置在背衬上的研磨层。 研磨层包括多个成形的磨料复合材料。 成形磨料复合材料包括分散在粘合剂中的磨料颗粒。 研磨颗粒主要由平均初级粒径小于100纳米的二氧化铈颗粒组成。 粘合剂包括聚醚酸和包含羧酸（甲基）丙烯酸酯和聚（甲基）丙烯酸酯的组分的反应产物，并且基于研磨层的总重量，磨料颗粒的量至少为 70重量％。 还公开了制造和使用结构化磨料制品的方法。

    Method of using a soft subpad for chemical mechanical polishing
    3.
    发明授权
    Method of using a soft subpad for chemical mechanical polishing 有权
    使用软垫子进行化学机械抛光的方法

    公开(公告)号：US06908366B2

    公开(公告)日：2005-06-21

    申请号：US10339963

    申请日：2003-01-10

    申请人： John J. Gagliardi

    发明人： John J. Gagliardi

    IPC分类号： B24B37/04 ,  B24D13/12 ,  B24D13/14 ,  B24B1/00

    CPC分类号： B24B37/245 ,  B24B37/042 ,  B24B37/22

    摘要： The present invention is directed to a method of modifying a wafer surface comprising providing a first abrasive article comprising a first three-dimensional fixed abrasive element and a first subpad generally coextensive with the first fixed abrasive element, contacting a surface of the first three-dimensional fixed abrasive element with a wafer surface, and relatively moving the first abrasive article and the wafer. The method additionally provides providing a second abrasive article comprising a second three-dimensional fixed abrasive element and a second subpad generally coextensive with the second fixed abrasive element, contacting a surface of the second three-dimensional fixed abrasive element with the wafer surface, and relatively moving the second abrasive article and the wafer. Wherein the first subpad has a deflection less than the deflection of the second subpad when measured 1.5 cm from the edge of a 1 kg weight, the weight having a contact area of 1.9 cm diameter.

    摘要翻译： 本发明涉及一种修改晶片表面的方法，包括提供包括第一三维固定研磨元件的第一磨料制品和与第一固定研磨元件共同延伸的第一子垫，与第一三维固定研磨元件的表面接触 具有晶片表面的固定研磨元件，以及相对移动第一磨料制品和晶片。 该方法另外提供了提供包括第二三维固定研磨元件的第二磨料制品和与第二固定研磨元件大体共同延伸的第二子垫，使第二三维固定研磨元件的表面与晶片表面接触， 移动第二磨料制品和晶片。 其中，当距离1kg重量的边缘测量1.5cm时，第一子垫具有小于第二子垫的挠曲的偏转，该重量具有1.9cm直径的接触面积。

    Abrasive article with embossed isolation layer and methods of making and using
    5.
    发明授权
    Abrasive article with embossed isolation layer and methods of making and using 有权
    具有浮雕隔离层的磨料制品和制造和使用方法

    公开(公告)号：US06364747B1

    公开(公告)日：2002-04-02

    申请号：US09697201

    申请日：2000-10-26

    申请人： John J. Gagliardi

    发明人： John J. Gagliardi

    IPC分类号： B24D300

    CPC分类号： B24D3/34 ,  B24D11/00

    摘要： An abrasive article including (i) an embossed isolation layer defining inversely contoured first and second surfaces with a plurality of peaks on the first surface producing a plurality of pockets on the second surface, (ii) grinding aid-containing protrusions positioned within the pockets, and (iii) a coating of abrasive particles adhered to the contoured first surface of the isolation layer.

    摘要翻译： 一种磨料制品，包括（i）压花隔离层，其形成相反的轮廓的第一和第二表面，在第一表面上具有多个峰，在第二表面上产生多个袋，（ii）位于袋内的研磨助剂的突起， 和（iii）粘附到隔离层的轮廓第一表面上的磨料颗粒的涂层。

    Splicing technique for fixed abrasives used in chemical mechanical planarization
    6.
    发明授权
    Splicing technique for fixed abrasives used in chemical mechanical planarization 有权
    用于化学机械平面化的固定磨料的拼接技术

    公开(公告)号：US08360823B2

    公开(公告)日：2013-01-29

    申请号：US12815764

    申请日：2010-06-15

    申请人： John J. Gagliardi

    发明人： John J. Gagliardi

    IPC分类号： B24B1/00 ,  B24B33/00

    CPC分类号： B24D7/14 ,  B24B37/245

    摘要： An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad.

    摘要翻译： 研磨制品包括支撑垫，第一研磨元件，第二研磨元件和固定机构。 支撑垫具有第一主表面，第二主表面，第一边缘，第二边缘和通道。 通道形成在第一主表面内并且从第一边缘延伸到第二边缘。 第一和第二研磨元件各自位于支撑垫的一部分上。 固定机构定位在通道内，将第一研磨元件的边缘和第二研磨元件的边缘固定到支撑垫。

    Compositions and methods for modifying a surface suited for semiconductor fabrication
    7.
    发明授权
    Compositions and methods for modifying a surface suited for semiconductor fabrication 有权
    用于修改适合于半导体制造的表面的组合物和方法

    公开(公告)号：US08092707B2

    公开(公告)日：2012-01-10

    申请号：US11839329

    申请日：2007-08-15

    申请人： L. Charles Hardy ,  Heather K. Kranz ,  Thomas E. Wood ,  David A. Kaisaki ,  John J. Gagliardi ,  John C. Clark ,  Patricia M. Savu ,  Philip G. Clark

    发明人： L. Charles Hardy ,  Heather K. Kranz ,  Thomas E. Wood ,  David A. Kaisaki ,  John J. Gagliardi ,  John C. Clark ,  Patricia M. Savu ,  Philip G. Clark

    IPC分类号： C09K13/00

    CPC分类号： H01L21/31053 ,  B24B37/044 ,  B24B37/245 ,  C09G1/02 ,  H01L21/3212

    摘要： The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKa greater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

    摘要翻译： 本公开涉及用于改性或精制适于半导体制造的晶片表面的组合物和方法。 组合物包括可用于改性适于制造半导体器件的晶片表面的工作液体。 在一些实施方案中，工作液体是基本上不含松散磨料颗粒的初始组分的水溶液，组分包括水，表面活性剂和显示出至少一个pKa大于7的pH缓冲液。在某些实施方案中，pH缓冲剂包括 碱性pH调节剂和酸性络合剂，并且工作液体的pH为约7至约12.在另外的实施方案中，本公开提供了包含适于改性晶片表面的表面活性剂的固定磨料制品，以及方法 制造固定的磨料制品。 另外的实施例描述了可用于修改晶片表面的方法。

    Abrasive article containing an inorganic metal orthophosphate
    9.
    发明授权
    Abrasive article containing an inorganic metal orthophosphate 失效
    含有无机金属正磷酸盐的研磨制品

    公开(公告)号：US06270543B1

    公开(公告)日：2001-08-07

    申请号：US09344760

    申请日：1999-06-25

    申请人： John J. Gagliardi ,  Charles H. Houck

    发明人： John J. Gagliardi ,  Charles H. Houck

    IPC分类号： B24D300

    CPC分类号： B24D3/004 ,  B24D11/001 ,  Y10T428/258

    摘要： An abrasive article, and methods of making and using same, containing an inorganic metal orthophosphate salt. The abrasive article including a coated abrasive article having a size or supersize coating layer containing an alkali metal or alkaline earth metal orthophosphate salt devoid of hydrogen. The inventive abrasive article reduces the grinding energy required while improving abrading efficiency in some cases.

    摘要翻译： 含有无机金属正磷酸盐的磨料制品及其制造和使用方法。 磨料制品包括具有尺寸或超大涂层的涂覆的磨料制品，其含有不含氢的碱金属或碱土金属正磷酸盐。 在一些情况下，本发明的磨料制品降低了所需的磨削能量，同时提高了研磨效率。

    Abrasive article with separately formed front surface protrusions containing a grinding aid and methods of making and using
    10.
    发明授权
    Abrasive article with separately formed front surface protrusions containing a grinding aid and methods of making and using 有权
    具有单独形成的包含研磨助剂的前表面突起的制品和制造和使用方法

    公开(公告)号：US06186866B1

    公开(公告)日：2001-02-13

    申请号：US09128692

    申请日：1998-08-05

    申请人： John J. Gagliardi

    发明人： John J. Gagliardi

    IPC分类号： B24B100

    CPC分类号： B24D3/34 ,  B24D11/00

    摘要： An abrasive article including (i) a first backing, (ii) a plurality of protrusions attached to the first surface of the first backing and including a grinding aid, wherein the first surface of the first backing is contoured by the protrusions so as to define a plurality of peaks and valleys, and (iii) a coating of abrasive particles adhered to the contoured first surface of the first backing so as to cover at least a portion of both the peaks and the valleys.

    摘要翻译： 一种磨料制品，包括（i）第一背衬，（ii）附接到第一背衬的第一表面上并包括研磨助剂的多个突起，其中第一背衬的第一表面由凸起构成，以便限定 多个峰和谷，以及（iii）粘附到第一背衬的轮廓的第一表面上的磨料颗粒的涂层，以便覆盖两个峰和谷的至少一部分。