公开(公告)号：US08423328B2

公开(公告)日：2013-04-16

申请号：US12570195

申请日：2009-09-30

申请人： John M. Cohn ,  Ulrich A. Finkler ,  David J. Hathaway ,  Jeffrey G. Hemmett ,  Fook-Luen Heng ,  Jason D Hibbeler ,  Gie Lee ,  Wayne H. Woods, Jr. ,  Cole E. Zemke

发明人： John M. Cohn ,  Ulrich A. Finkler ,  David J. Hathaway ,  Jeffrey G. Hemmett ,  Fook-Luen Heng ,  Jason D Hibbeler ,  Gie Lee ,  Wayne H. Woods, Jr. ,  Cole E. Zemke

IPC分类号： G06F17/17

CPC分类号： G06F17/175

摘要： Methods for modeling a random variable with spatially inhomogenous statistical correlation versus distance, standard deviation, and mean by spatial interpolation with statistical corrections. The method includes assigning statistically independent random variable to a set of seed points in a coordinate frame and defining a plurality of test points at respective spatial locations in the coordinate frame. A equation for a random variable is determined for each of the test points by spatial interpolation from one or more of the random variable assigned to the seed points. The method further includes adjusting the equation of the random variable at each of the test point with respective correction factor equations.

摘要翻译： 用空间不均匀的统计学相关性与距离，标准偏差和通过统计学校正的空间插值的平均值来建模随机变量的方法。 该方法包括将统计独立的随机变量分配给坐标系中的一组种子点并在坐标系中的相应空间位置定义多个测试点。 通过从分配给种子点的一个或多个随机变量的空间插值，为每个测试点确定随机变量的等式。 该方法还包括利用相应的校正因子方程来调整每个测试点处的随机变量的方程。

公开(公告)号：US07844418B2

公开(公告)日：2010-11-30

申请号：US12030462

申请日：2008-02-13

申请人： Jeffrey G. Hemmett ,  Mukesh Kumar ,  Wayne H. Woods, Jr. ,  Cole E. Zemke

发明人： Jeffrey G. Hemmett ,  Mukesh Kumar ,  Wayne H. Woods, Jr. ,  Cole E. Zemke

IPC分类号： G06F17/18 ,  G21C17/00

CPC分类号： G06F17/18

摘要： Methods for distributing a random variable by spatial interpolation with statistical corrections. The method includes assigning a numerical value of the random variable at each vertex of an array of equilateral triangles formed in a planar coordinate frame and defining a plurality of test points at respective spatial locations in the planar coordinate frame that are bounded by the array of equilateral triangles. A numerical value of the random variable is distributed at each of the test points by spatial interpolation from one or more of the numerical values of the random variable assigned at each vertex of the array of equilateral triangles. The method further includes adjusting the numerical value of the random variable distributed at each of the test points with a respective correction factor.

摘要翻译： 通过统计校正的空间插值分布随机变量的方法。 该方法包括在平面坐标系中形成的等边三角形阵列的每个顶点处分配随机变量的数值，并且在平面坐标系中的由等边阵列限定的相应空间位置处限定多个测试点 三角形。 随机变量的数值通过从等边三角形阵列的每个顶点处分配的随机变量的一个或多个数值中的空间插值分布在每个测试点。 该方法还包括用相应的校正因子来调整在每个测试点分布的随机变量的数值。

公开(公告)号：US08766748B2

公开(公告)日：2014-07-01

申请号：US12960009

申请日：2010-12-03

申请人： Essam Mina ,  Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Essam Mina ,  Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： H01P3/08 ,  H01P9/00

CPC分类号： H01P3/081 ,  H01P3/003 ,  H01P9/00

摘要： On-chip high performance slow-wave microstrip line structures, methods of manufacture and design structures for integrated circuits are provided herein. The structure includes at least one ground and a signal layer provided in a different plane than the at least one ground. The signal layer has at least one alternating wide portion and narrow portion with an alternating thickness such that a height of the wide portion is different than a height of the narrow portion with respect to the at least one ground.

摘要翻译： 本文提供片上高性能慢波微带线结构，集成电路的制造方法和设计结构。 该结构包括设置在与至少一个地面不同的平面中的至少一个地面和信号层。 信号层具有至少一个交替宽的部分和具有交替厚度的窄部分，使得宽部分的高度不同于窄部分相对于至少一个地面的高度。

公开(公告)号：US08436446B2

公开(公告)日：2013-05-07

申请号：US13455725

申请日：2012-04-25

申请人： Hanyi Ding ,  Alvin J. Joseph ,  Wayne H. Woods, Jr.

发明人： Hanyi Ding ,  Alvin J. Joseph ,  Wayne H. Woods, Jr.

IPC分类号： H01L27/08

CPC分类号： G06F17/5077 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P5/16 ,  H01P11/007 ,  H01L2924/00

摘要： A method, structure, and design structure for a through-silicon-via Wilkinson power divider. A method includes: forming an input on a first side of a substrate; forming a first leg comprising a first through-silicon-via formed in the substrate, wherein the first leg electrically connects the input and a first output; forming a second leg comprising a second through-silicon-via formed in the substrate, wherein the second leg electrically connects the input and a second output, and forming a resistor electrically connected between the first output and the second output.

公开(公告)号：US08130059B2

公开(公告)日：2012-03-06

申请号：US12423835

申请日：2009-04-15

申请人： Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： H01P1/18

CPC分类号： H01P9/00

摘要： An on-chip slow-wave structure that uses multiple parallel signal paths with grounded capacitance structures, method of manufacturing and design structure thereof is provided. The slow wave structure includes a plurality of conductor signal paths arranged in a substantial parallel arrangement. The structure further includes a first grounded capacitance line or lines positioned below the plurality of conductor signal paths and arranged substantially orthogonal to the plurality of conductor signal paths. A second grounded capacitance line or lines is positioned above the plurality of conductor signal paths and arranged substantially orthogonal to the plurality of conductor signal paths. A grounded plane grounds the first and second grounded capacitance line or lines.

摘要翻译： 提供了采用具有接地电容结构的多个并行信号路径的片上慢波结构，其制造方法和设计结构。 慢波结构包括以大致平行布置布置的多个导体信号路径。 该结构还包括位于多个导体信号路径下方并且基本上正交于多个导体信号路径布置的第一接地电容线或线。 第二接地电容线或线路位于多个导体信号路径上方并且基本上正交于多个导体信号路径布置。 接地平面接地第一和第二接地电容线或线路。

公开(公告)号：US08106728B2

公开(公告)日：2012-01-31

申请号：US12424110

申请日：2009-04-15

申请人： Hanyi Ding ,  Kwan H. Lam ,  Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Hanyi Ding ,  Kwan H. Lam ,  Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： H01P3/08 ,  H01P1/203

CPC分类号： H01P1/203 ,  Y10T29/49155

摘要： The present invention generally relates to a circuit structure, design structure and method of manufacturing a circuit, and more specifically to a circuit structure and design structure for an on-chip slow wave transmission line band-stop filter and a method of manufacture. A structure includes an on-chip transmission line stub comprising a conditionally floating structure structured to provide increased capacitance to the on-chip transmission line stub when the conditionally floating structure is connected to ground.

摘要翻译： 本发明一般涉及一种电路结构，电路制造的设计结构和方法，更具体地涉及用于片上慢波传输线带阻滤波器的电路结构和设计结构以及制造方法。 一种结构包括片上传输线短截线，其包括有条件浮动结构，其被构造为当有条件浮动结构连接到地时为片上传输线短截线提供增加的电容。

公开(公告)号：US08963657B2

公开(公告)日：2015-02-24

申请号：US13156935

申请日：2011-06-09

申请人： Essam Mina ,  Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Essam Mina ,  Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： H01P3/08 ,  G06F17/50 ,  H01L21/768 ,  H01L23/48 ,  H01P3/00

CPC分类号： H01L23/481 ,  H01L2924/0002 ,  H01P3/003 ,  H01L2924/00

摘要： On-chip, high performance, slow-wave coplanar waveguide with through-silicon via structures, method of manufacture and design structures for integrated circuits are provided herein. The method includes forming at least one ground plane layer in a substrate and forming a signal layer in the substrate, in a same plane layer as the at least one ground. The method further includes forming at least one metal filled through-silicon via between the at least one ground plane layer and the signal layer.

摘要翻译： 本文提供具有贯穿硅通孔结构的片上，高性能，慢波共面波导，其制造方法和集成电路的设计结构。 该方法包括在衬底中形成至少一个接地平面层，并在与该至少一个接地相同的平面层中在衬底中形成信号层。 该方法还包括在至少一个接地层与信号层之间形成至少一个填充有金属的硅，

公开(公告)号：US08898605B2

公开(公告)日：2014-11-25

申请号：US12911327

申请日：2010-10-25

申请人： Hanyi Ding ,  Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Hanyi Ding ,  Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： G06F17/50 ,  H01P3/08 ,  H01P1/15

CPC分类号： H01P3/08 ,  H01P1/15 ,  Y10T29/49117

摘要： An on-chip tunable transmission line (t-line), methods of manufacture and design structures are provided. The structure includes a tunable transmission line (t-line) with fixed characteristic impedance comprising functionally-differentiated switches used for inductance and capacitance, respectively.

摘要翻译： 提供片上可调输电线（t线），制造方法和设计结构。 该结构包括具有固定特性阻抗的可调传输线（t线），分别包括用于电感和电容的功能差分开关。

公开(公告)号：US08164397B2

公开(公告)日：2012-04-24

申请号：US12542368

申请日：2009-08-17

申请人： Guoan Wang ,  Wayne H. Woods, Jr.

发明人： Guoan Wang ,  Wayne H. Woods, Jr.

IPC分类号： H03H7/38

CPC分类号： H01P3/081 ,  H01P3/006

摘要： A method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications. A method includes: forming a plurality of openings in a ground plane associated with a signal line; forming a plurality of capacitance plates in the plurality of openings; and connecting the plurality of capacitance plates to the signal line with a plurality of posts extending between the signal line and the plurality of capacitance plates.

摘要翻译： 用于多频带和超宽带应用的阻抗优化微带传输线的方法，结构和设计结构。 一种方法包括：在与信号线相关联的接地平面中形成多个开口; 在所述多个开口中形成多个电容板; 以及在所述信号线与所述多个电容板之间延伸的多个支柱将所述多个电容板连接到所述信号线。

公开(公告)号：US08120145B2

公开(公告)日：2012-02-21

申请号：US12140364

申请日：2008-06-17

申请人： Amit Bavisi ,  Hanyi Ding ,  Guoan Wang ,  Wayne H. Woods, Jr. ,  Jiansheng Xu

发明人： Amit Bavisi ,  Hanyi Ding ,  Guoan Wang ,  Wayne H. Woods, Jr. ,  Jiansheng Xu

IPC分类号： H01L27/06

CPC分类号： H01P1/20363

摘要： A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a substrate including a silicon layer. Furthermore, the design structure includes a metal layer on a bottom side of the silicon layer and a dielectric layer on a top side of the silicon layer. Additionally, the design structure includes a top-side interconnect of the through-silicon via bandpass filter on a surface of the dielectric layer and a plurality of contacts in the dielectric layer in contact with the top-side interconnect. Further, the design structure includes a plurality of through-silicon vias through the substrate and in contact with the plurality of contacts, respectively, and the metal layer.

摘要翻译： 设计结构体现在用于设计，制造或测试设计的机器可读介质中。 该设计结构包括具有硅层的基板。 此外，设计结构包括在硅层的底侧上的金属层和在硅层的顶侧上的介电层。 此外，该设计结构包括在电介质层的表面上的通过硅通孔带通滤波器的顶侧互连以及与顶侧互连件接触的介电层中的多个触点。 此外，设计结构包括分别通过基板并与多个触点和金属层接触的多个穿硅通孔。