Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
    2.
    发明授权
    Memory cell arrangement, method for controlling a memory cell, memory array and electronic device 有权
    存储单元布置,用于控制存储单元的方法,存储器阵列和电子设备

    公开(公告)号:US08320191B2

    公开(公告)日:2012-11-27

    申请号:US12049132

    申请日:2008-03-14

    IPC分类号: G11C16/04

    摘要: In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

    摘要翻译: 在本发明的一个实施例中,存储单元布置包括衬底和包括电荷存储存储单元结构和选择结构的至少一个存储单元。 存储单元布置还包括第一掺杂阱,第二掺杂阱和布置在衬底内的第三掺杂阱,其中电荷存储存储单元结构布置在第一掺杂阱中或上方,第一掺杂阱布置在 第二掺杂阱,并且第二掺杂阱被布置在第三掺杂阱内。 存储单元布置还包括与存储单元耦合并被配置为控制存储单元的控制电路,使得通过至少第一掺杂阱对电荷存储存储单元结构进行充电或放电来对电荷存储存储单元结构进行编程或擦除 。

    Memory Cell Arrangement, Method for Controlling a Memory Cell, Memory Array and Electronic Device
    3.
    发明申请
    Memory Cell Arrangement, Method for Controlling a Memory Cell, Memory Array and Electronic Device 有权
    存储单元布置,用于控制存储单元,存储器阵列和电子设备的方法

    公开(公告)号:US20090059678A1

    公开(公告)日:2009-03-05

    申请号:US12049132

    申请日:2008-03-14

    IPC分类号: G11C16/02 G11C11/40

    摘要: In an embodiment of the invention, a memory cell arrangement includes a substrate and at least one memory cell including a charge storing memory cell structure and a select structure. The memory cell arrangement further includes a first doping well, a second doping well and a third doping well arranged within the substrate, wherein the charge storing memory cell structure is arranged in or above the first doping well, the first doping well is arranged within the second doping well, and the second doping well is arranged within the third doping well. The memory cell arrangement further includes a control circuit coupled with the memory cell and configured to control the memory cell such that the charge storing memory cell structure is programmed or erased by charging or discharging the charge storing memory cell structure via at least the first doping well.

    摘要翻译: 在本发明的一个实施例中,存储单元布置包括衬底和包括电荷存储存储单元结构和选择结构的至少一个存储单元。 存储单元布置还包括第一掺杂阱,第二掺杂阱和布置在衬底内的第三掺杂阱,其中电荷存储存储单元结构布置在第一掺杂阱中或上方,第一掺杂阱布置在 第二掺杂阱,并且第二掺杂阱被布置在第三掺杂阱内。 存储单元布置还包括与存储单元耦合并被配置为控制存储单元的控制电路,使得通过至少第一掺杂阱对电荷存储存储单元结构进行充电或放电来对电荷存储存储单元结构进行编程或擦除 。

    Method for making semiconductor device
    4.
    发明授权
    Method for making semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US08470670B2

    公开(公告)日:2013-06-25

    申请号:US12565459

    申请日:2009-09-23

    IPC分类号: H01L21/336

    摘要: One or more embodiments may relate to a method for making a semiconductor device, including: a method for making a semiconductor device, comprising: providing a substrate; forming a charge storage layer over the substrate; forming a control gate layer over the charge storage layer; forming a mask over the control gate layer; using the mask, etching the control gate layer and the charge storage layer; forming a select gate layer over the etched control gate layer and the etched charge storage layer; forming an additional layer over the select gate layer; etching the additional layer to form sidewall spacers over the select gate layer; and etching the select gate layer.

    摘要翻译: 一个或多个实施例可以涉及制造半导体器件的方法,包括:制造半导体器件的方法,包括:提供衬底; 在所述基板上形成电荷存储层; 在所述电荷存储层上形成控制栅极层; 在所述控制栅极层上形成掩模; 使用掩模,蚀刻控制栅极层和电荷存储层; 在蚀刻的控制栅极层和蚀刻的电荷存储层上形成选择栅极层; 在所述选择栅极层上形成附加层; 蚀刻附加层以在选择栅极层上形成侧壁间隔物; 并蚀刻选择栅极层。

    Semiconductor device and method for its fabrication
    5.
    发明授权
    Semiconductor device and method for its fabrication 有权
    半导体器件及其制造方法

    公开(公告)号:US6111294A

    公开(公告)日:2000-08-29

    申请号:US201734

    申请日:1998-11-30

    申请人: Robert Strenz

    发明人: Robert Strenz

    CPC分类号: H01L27/088

    摘要: A semiconductor device has a semiconductor substrate of a first conductivity type. A first well of a second conductivity type is disposed in the semiconductor substrate. A second well of the first conductivity type is disposed in the first well. A third well of the second conductivity is disposed in the second well. A MOS transistor having a source region and a drain region of the first conductivity type is disposed in the third well.

    摘要翻译: 半导体器件具有第一导电类型的半导体衬底。 第二导电类型的第一阱设置在半导体衬底中。 第一导电类型的第二阱设置在第一阱中。 第二导电性的第三阱设置在第二阱中。 具有第一导电类型的源极区域和漏极区域的MOS晶体管设置在第三阱中。

    Transistor arrangement and integrated circuit
    6.
    发明授权
    Transistor arrangement and integrated circuit 有权
    晶体管布置和集成电路

    公开(公告)号:US08410815B2

    公开(公告)日:2013-04-02

    申请号:US12958428

    申请日:2010-12-02

    IPC分类号: H03K19/094

    摘要: A transistor arrangement includes a switch transistor and a sense transistor. The switch transistor includes a charge storing structure and a control structure. The sense transistor includes a charge storing structure, a control structure and a select structure. The charge storing structure of the switch transistor is electrically connected to the charge storing structure of the sense transistor. The sense transistor is configured such that the select structure and the control structure of the sense transistor may be electrically controlled independently from one another.

    摘要翻译: 晶体管装置包括开关晶体管和感测晶体管。 开关晶体管包括电荷存储结构和控制结构。 感测晶体管包括电荷存储结构,控制结构和选择结构。 开关晶体管的电荷存储结构电连接到感测晶体管的电荷存储结构。 感测晶体管被配置为使得感测晶体管的选择结构和控制结构可以彼此独立地电控制。

    MEMORY DEVICE, MEMORY AND METHOD FOR PROCESSING SUCH MEMORY
    7.
    发明申请
    MEMORY DEVICE, MEMORY AND METHOD FOR PROCESSING SUCH MEMORY 有权
    用于处理这样的存储器的存储器件,存储器和方法

    公开(公告)号:US20090014776A1

    公开(公告)日:2009-01-15

    申请号:US11776197

    申请日:2007-07-11

    IPC分类号: H01L29/788 H01L21/336

    摘要: An integrated memory device, an integrated memory chip and a method for fabricating an integrated memory device is disclosed. One embodiment provides at least one integrated memory device with a drain, a source, a floating gate, a selection gate and a control gate, wherein the conductivity between the drain and the source can be controlled independently via the control gate.

    摘要翻译: 公开了一种集成存储器件,集成存储器芯片和用于制造集成存储器件的方法。 一个实施例提供了具有漏极,源极,浮动栅极,选择栅极和控制栅极的至少一个集成存储器件,其中漏极和源极之间的电导率可以经由控制栅极独立地被控制。

    Method of manufacture of a semiconductor having a triple well structure
    8.
    发明授权
    Method of manufacture of a semiconductor having a triple well structure 失效
    具有三重阱结构的半导体的制造方法

    公开(公告)号:US06372568B1

    公开(公告)日:2002-04-16

    申请号:US09615529

    申请日:2000-07-13

    申请人: Robert Strenz

    发明人: Robert Strenz

    IPC分类号: H01L218234

    CPC分类号: H01L27/088

    摘要: A method for fabricating a semiconductor device comprises implantating and diffusing a first well in a semiconductor substrate. A second well is implantated and diffused in the first well. A third well is implantated in the second well and a MOS transistor is formed in the third well.

    摘要翻译: 一种用于制造半导体器件的方法,包括在半导体衬底中植入和扩散第一阱。 第二个井被植入和扩散在第一个井中。 在第二阱中注入第三阱,在第三阱中形成MOS晶体管。

    Memory cell arrangements and methods for manufacturing a memory cell arrangement
    9.
    发明申请
    Memory cell arrangements and methods for manufacturing a memory cell arrangement 审中-公开
    存储单元布置和用于制造存储单元布置的方法

    公开(公告)号:US20090309149A1

    公开(公告)日:2009-12-17

    申请号:US12138200

    申请日:2008-06-12

    IPC分类号: H01L29/788 H01L21/336

    摘要: In an embodiment, a memory cell arrangement is provided which may include a charge storing memory cell comprising a first active area running along a first direction, a second active area disposed next to the charge storing memory cell, the second active area running along a second direction, the second direction being different from the first direction, and a select structure disposed above the second active area configured to control a current flow through the second active area.

    摘要翻译: 在一个实施例中,提供一种存储单元布置,其可以包括电荷存储存储单元,该存储单元包括沿着第一方向延伸的第一有源区,布置在电荷存储存储单元旁边的第二有源区,沿着第二方向延伸的第二有源区 方向,所述第二方向与所述第一方向不同,以及选择结构,设置在所述第二有效区域上方,被配置为控制通过所述第二有效区域的电流。

    Method for manufacturing a memory cell arrangement
    10.
    发明授权
    Method for manufacturing a memory cell arrangement 有权
    用于制造存储单元布置的方法

    公开(公告)号:US07611941B1

    公开(公告)日:2009-11-03

    申请号:US12141547

    申请日:2008-06-18

    IPC分类号: H01L21/8238

    摘要: In an embodiment of the invention, a method for manufacturing a memory cell arrangement includes forming a charge storing memory cell layer stack over a substrate; forming first and second select structures over, respectively, first and second sidewalls of the charge storing memory cell layer stack, wherein the first and second select structures in each case comprise a select gate configured as a spacer and laterally disposed from the respective sidewall of the charge storing memory cell layer stack; and removing a portion of the charge storing memory cell layer stack between the first and second select structures after formation of the first and second select structures, thereby forming first and second charge storing memory cell structures.

    摘要翻译: 在本发明的一个实施例中,一种用于制造存储单元布置的方法包括在衬底上形成电荷存储存储单元层堆叠; 在电荷存储存储存储单元层堆叠的第一和第二侧壁分别形成第一和第二选择结构,其中第一和第二选择结构在每种情况下都包括配置为间隔物的选择栅极, 电荷存储存储单元层堆叠; 以及在形成第一和第二选择结构之后,去除第一和第二选择结构之间的电荷存储存储单元层堆叠的一部分,从而形成第一和第二电荷存储存储单元结构。