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    Molding a polishing pad having integral window
    1.
    发明授权
    Molding a polishing pad having integral window 有权
    成型具有整体窗的抛光垫

    公开(公告)号：US06387312B1

    公开(公告)日：2002-05-14

    申请号：US09666418

    申请日：2000-09-20

    申请人： John V. H. Roberts ,  Barry Scott Pinheiro ,  David B. James

    发明人： John V. H. Roberts ,  Barry Scott Pinheiro ,  David B. James

    IPC分类号： B29B700

    CPC分类号： B24B37/205 ,  B24D3/28

    摘要： A polishing pad is formed by solidifying a flowable polymeric material at different rates of cooling to provide a polishing pad with a transparent region and an adjacent opaque region. Types of polymeric material suitable for making the polishing pad include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer.

    摘要翻译： 通过以不同的冷却速度固化可流动的聚合物材料形成抛光垫，以提供具有透明区域和相邻不透明区域的抛光垫。 适用于制造抛光垫的聚合物材料的类型包括单一热塑性材料，热塑性材料的共混物和反应性热固性聚合物。

    Molded polishing pad having integral window
    2.
    发明授权
    Molded polishing pad having integral window 有权
    具有整体窗口的模制抛光垫

    公开(公告)号：US06171181B2

    公开(公告)日：2001-01-09

    申请号：US09375962

    申请日：1999-08-17

    申请人： John V. H. Roberts ,  Barry Scott Pinheiro ,  David B. James

    发明人： John V. H. Roberts ,  Barry Scott Pinheiro ,  David B. James

    IPC分类号： B24D1100

    CPC分类号： B24B37/205 ,  B24D3/28

    摘要： A polishing pad is formed as a one-piece article having a region which is transparent and an adjacent region which is opaque. The article is formed by solidifying a flowable polymeric material which at least initially has a uniform composition. The flowable polymeric material is processed during a molding operation to provide the transparent region and the adjacent opaque region. Types of polymeric material suitable for making the polishing pad include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer.

    摘要翻译： 抛光垫形成为具有透明区域和不透明的相邻区域的单件制品。 该制品通过固化至少最初具有均匀组成的可流动的聚合材料而形成。 在模制操作期间处理可流动的聚合物材料以提供透明区域和相邻的不透明区域。 适用于制造抛光垫的聚合物材料的类型包括单一热塑性材料，热塑性材料的共混物和反应性热固性聚合物。

    Hydrolytically stable grooved polishing pads for chemical mechanical planarization
    4.
    发明授权
    Hydrolytically stable grooved polishing pads for chemical mechanical planarization 有权
    水解稳定的槽式抛光垫用于化学机械平面化

    公开(公告)号：US06749485B1

    公开(公告)日：2004-06-15

    申请号：US09665841

    申请日：2000-09-20

    申请人： David B. James ,  Arun Vishwanathan ,  Lee Melbourne Cook ,  Peter A. Burke ,  David Shidner ,  Joseph K. So ,  John V. H. Roberts

    发明人： David B. James ,  Arun Vishwanathan ,  Lee Melbourne Cook ,  Peter A. Burke ,  David Shidner ,  Joseph K. So ,  John V. H. Roberts

    IPC分类号： B24B100

    CPC分类号： B24B37/26 ,  B24B13/04 ,  B24B37/042 ,  B24D3/28 ,  Y10S451/921

    摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness and hydrolytic stability.

    摘要翻译： 用于在半导体晶片上抛光金属镶嵌结构的改进的焊盘和工艺。 该方法包括以下步骤：将聚合物片材的表面压在聚合物片材的表面上，并与含有亚微米级颗粒的含水基液体组合，并提供在压力下使晶片和抛光垫片相对运动的装置， 接触导致平面去除所述晶片的表面，其中抛光垫在去除所述负载时具有低弹性恢复，使得片材的机械响应大大无弹性。 改进的垫的特征在于具有高的能量耗散以及高的垫刚度和水解稳定性。

    Grooved polishing pads for chemical mechanical planarization
    6.
    发明授权
    Grooved polishing pads for chemical mechanical planarization 有权
    用于化学机械平面化的凹槽抛光垫

    公开(公告)号：US06736709B1

    公开(公告)日：2004-05-18

    申请号：US09631783

    申请日：2000-08-03

    申请人： David B. James ,  Arun Vishwanathan ,  Lee Melbourne Cook ,  Peter A. Burke ,  David Shidner ,  Joseph K. So ,  John V. H. Roberts

    发明人： David B. James ,  Arun Vishwanathan ,  Lee Melbourne Cook ,  Peter A. Burke ,  David Shidner ,  Joseph K. So ,  John V. H. Roberts

    IPC分类号： B24B500

    CPC分类号： B24B37/26 ,  B24D3/28

    摘要： An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing, pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad also exhibits a stable morphology that can be reproduced easily and consistently. The pad surface has macro-texture that includes perforations as well as surface groove designs The surface groove designs have specific relationships between groove depth and overall pad thickness and groove.area and land area. The pad of this invention resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, better slurry distribution and waste removal from the pad surface, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).

    摘要翻译： 用于在半导体晶片上抛光金属镶嵌结构的改进的焊盘和工艺。 该方法包括以下步骤：将聚合物片材的表面压在聚合物片材的表面上，与水性液体组合，任选地含有亚微米级的颗粒，并提供用于在压力下使晶片和抛光垫相对运动的装置，使得移动 加压接触导致所述晶片的表面的平面去除，其中抛光垫在去除所述负载时具有低弹性恢复，使得片材的机械响应大大无弹性。 改进的焊盘的特征在于具有高的能量耗散以及高焊盘刚度。 该垫还具有稳定的形态，可以容易地和一致地再现。 焊盘表面具有包括穿孔以及表面凹槽设计的宏观纹理。表面凹槽设计具有凹槽深度和总体垫厚度以及凹槽和凹槽面积之间的具体关系。 本发明的垫子抵抗玻璃窗，从而需要较少的频繁和较不积极的调理。 这种抛光垫的优点是金属特征的低凹陷，低氧化物侵蚀，减少的焊盘调节，更长的焊盘寿命，更好的浆料分布和从焊盘表面的废物移除，高金属去除速率，良好的平坦化和较低的缺陷（划痕 和光点缺陷）。

    Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad
    9.
    发明授权
    Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad 有权
    用于形成多孔反应注射成型的化学机械抛光垫的装置

    公开(公告)号：US07537446B2

    公开(公告)日：2009-05-26

    申请号：US11398260

    申请日：2006-04-04

    申请人： David B. James ,  John V. H. Roberts

    发明人： David B. James ,  John V. H. Roberts

    IPC分类号： B29C44/06 ,  B01F13/02

    CPC分类号： B01F3/1271 ,  B01F5/102 ,  B01F13/103 ,  B24B37/20 ,  B24D18/00 ,  B29B7/7461 ,  B29B7/748 ,  B29B7/7485 ,  B29B7/76 ,  B29B7/90 ,  B29C67/246 ,  B29K2075/00

    摘要： The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres, a isocyanate storage tank with isocyanates and a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres. The invention further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the isocyanates, a closed mold for reaction-injection molding the mixture and a vacuum for degassing at least one of the tank, isocyanate storage tank or the mold.

    摘要翻译： 本发明提供了一种用于形成化学机械抛光垫的装置，包括具有聚合材料的罐，具有微球的储存仓，具有异氰酸酯的异氰酸酯储存罐和用于形成聚合物材料的预混合物的预混料制备罐 微球。 本发明还提供了一种用于储存预混合物的预混合运行罐，用于形成预混合物和异氰酸酯的混合物的混合器，用于反应注射成型混合物的封闭模具和用于将至少一种 罐，异氰酸盐储罐或模具。