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公开(公告)号：US06830097B2
公开(公告)日：2004-12-14
申请号：US10259311
申请日：2002-09-27
IPC分类号： F28D1502
CPC分类号： F28F3/025 , F28D15/0275 , F28D2021/0029 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink (10) is provided for use with a fan (16) for cooling an electronic component (12) wherein the heat sink (10) transfers heat from a heat rejecting surface (14) of the electronic component (12) to a cooling airflow provided by the fan (16). The heat sink (10) includes a heat conducting base member (20) having a substantially planar heat receiving surface (22) for overlaying the heat rejecting surface (14) of the electronic component (12) to receive heat therefrom, a heat conducting tower (24) extending from a side of the base member (20) opposite from the heat receiving surface (22) to receive heat therefrom, and a pair of serpentine fins (30) to transfer heat from the tower (24) to the airflow and the environment surrounding the heat sink (10).
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公开(公告)号：US07013958B2
公开(公告)日：2006-03-21
申请号：US11128454
申请日：2005-05-13
申请人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
发明人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
IPC分类号： F28D15/00
CPC分类号： F28D15/046 , F28D15/0233 , Y10T29/49353
摘要： A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.
摘要翻译： 提供了一种用于热管的开槽烧结芯，其具有多个单独的颗粒，它们共同产生平均粒径。 带槽的烧结芯还包括至少两个相邻的焊盘，它们通过设置在焊盘之间的颗粒层彼此流体连通，其中颗粒层包括至少一个不超过约六个平均粒径的尺寸。 还提供了一种热管，其包括具有平均直径的多个单独颗粒的带槽芯。 带槽的芯包括至少两个相邻的焊盘，它们通过设置在焊盘之间的颗粒层彼此流体连通，所述颗粒层包括小于约六个平均粒径。 还提供了一种根据上述结构制作热管芯的方法。
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公开(公告)号：US5818693A
公开(公告)日：1998-10-06
申请号：US780858
申请日：1997-01-09
申请人： Scott D. Garner , Jerome E. Toth
发明人： Scott D. Garner , Jerome E. Toth
CPC分类号： G06F1/203
摘要： The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.
摘要翻译： 该装置是用于膝上型计算机的冷却结构，其中热量传递到显示屏幕后面的壳体的热管中。 屏幕后面的热管通过保持夹具与盖的外壁互连，保持夹具优选地在制造期间被整合到盖壁中。 该盖特别构造有高导热碳纤维，其被定向成优先地将热量从热管传导到盖并且将热量散布在盖的整个外表面上以便耗散到环境中。
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公开(公告)号：US07071408B2
公开(公告)日：2006-07-04
申请号：US11218747
申请日：2005-09-02
申请人： Scott D. Garner
发明人： Scott D. Garner
IPC分类号： H05K7/20
CPC分类号： H05K7/20681 , H05K7/20809 , H05K7/20818
摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first-thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
摘要翻译： 提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。 散热装置包括热管，热量总线包括环形热虹吸管。 第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。 第二热量总线还可以包括环路虹吸管。 还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散到比装置相对较大的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热 将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。
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公开(公告)号：US06657121B2
公开(公告)日：2003-12-02
申请号：US10180166
申请日：2002-06-26
申请人： Scott D. Garner
发明人： Scott D. Garner
IPC分类号： H05K720
CPC分类号： H05K7/20681 , H05K7/20809 , H05K7/20818
摘要： A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e.g., a second loop thermosyphon, convection fin, or cold plate.
摘要翻译： 提供了一种热能管理系统，其具有与至少一个半导体芯片可操作地接合的散热装置和与散热装置可操作地接合的热母线，以将热能从散热装置输送到散热器。 散热装置包括热管，热量总线包括环形热虹吸管。 第二热母线可以与第一热母线可操作地接合，以将热能从第一热母线传输到散热器。 第二热量总线还可以包括环路虹吸管。 还提供了一种在电子系统中管理热能的方法，其包括将一个或多个装置产生的热能扩散在相对大于装置的表面上，将环形热虹吸管的蒸发器部分热耦合到表面，以及热 将环形热虹吸管的冷凝部分耦合到热能吸收器，例如第二回路热虹吸管，对流翅片或冷板。
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公开(公告)号：US06437437B1
公开(公告)日：2002-08-20
申请号：US09753893
申请日：2001-01-03
申请人： Jon Zuo , Scott D. Garner
发明人： Jon Zuo , Scott D. Garner
IPC分类号： H01L2310
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01322 , H01L2924/16152 , H01L2224/0401
摘要： A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.
摘要翻译： 提供一种半导体封装，其包括具有顶表面的基板，盖和附接到基板的顶表面的至少一个半导体器件。 盖被固定到基板上，以在内表面和基板之间形成空间，使得半导体器件驻留在该空间内。 盖具有包括多个微通道的内表面。 灯芯与多个微通道和半导体器件面对面地定位，其中两相可汽化液体设置在该空间内。
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公开(公告)号：US09466551B1
公开(公告)日：2016-10-11
申请号：US13385235
申请日：2012-02-09
IPC分类号： F28F11/06 , F28D15/00 , H01L23/473 , F28D15/02
CPC分类号： H01L23/473 , F28D15/0241 , F28D15/0275 , F28F2275/08 , H05K7/1404 , H05K7/20672
摘要： The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.
摘要翻译： 该装置是具有将夹具的固定基部连接到每个可动夹紧部的热管的传热夹。 在基座部分和每个夹紧部分的热管部分之间的连接热管部分是足够柔性的，以允许夹紧部件的所需夹紧和松开运动。 因此，热管在夹紧的电路板或其他装置与可用的散热器之间提供了优异的传热路径。
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公开(公告)号：US6065664A
公开(公告)日：2000-05-23
申请号：US131528
申请日：1998-08-10
申请人： Scott D. Garner , Douglas W. Grove
发明人： Scott D. Garner , Douglas W. Grove
IPC分类号： B21D39/06 , B21D53/02 , B23K1/012 , B23P11/00 , B21D39/04 , B21D39/08 , B23K31/02 , B23P11/02
CPC分类号： B23P11/005 , B21D39/06 , B21D53/02 , B23K1/012 , F28D15/0275 , B23K2201/06 , B23K2203/10 , B23P2700/09 , F28F2275/06 , F28F2275/125 , Y10T29/49375 , Y10T29/49865
摘要： The disclosure is for a method of installing a heat pipe within another structure. A completely processed heat pipe is coated with solder and inserted into a cylindrical hole within the structure with sliding clearance. The casing of the heat pipe is then expanded into tight contact with the surrounding hole by heating the heat pipe and expanding the heat pipe casing with the heat pipe's own internal vapor pressure. The application of heat also simultaneously melts the solder to bond the heat pipe into the hole.
摘要翻译： 本公开是用于在另一结构内安装热管的方法。 完全加工的热管涂有焊料，并插入到具有滑动间隙的结构内的圆柱形孔中。 然后通过加热热管并且利用热管本身的内部蒸汽压膨胀热管壳体，将热管的壳体膨胀成与周围孔紧密接触。 热的应用也同时熔化焊料以将热管粘合到孔中。
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公开(公告)号：US5566751A
公开(公告)日：1996-10-22
申请号：US446502
申请日：1995-05-22
CPC分类号： F28D15/06 , F28D15/0258
摘要： The apparatus is a non-condensible gas venting device for vapor sources which can include a sonic orifice for vapor pressure reduction in high vapor pressure systems. A typical vapor source has a evaporator chamber with an evaporating wick containing liquid which is heated and produces vapor. The invention is a venting chamber connected to the evaporator chamber so that the vapor has access to the venting chamber. The venting chamber also includes a condensing wick interconnected to the evaporating wick in the evaporator chamber by a capillary capillary device through which the condensed liquid is returned to the evaporating wick. The condenser chamber is vented to a lower pressure region or vacuum so that non-condensible gas present moves out of the condenser chamber into the lower pressure while the vapor is trapped by the condensing wick and is retained in the system.
摘要翻译： 该装置是用于蒸汽源的不可冷凝气体排放装置，其可以包括用于在高蒸气压系统中蒸气压降低的声孔。 典型的蒸汽源具有蒸发室，其具有包含液体的蒸发芯，其被加热并产生蒸气。 本发明是连接到蒸发器室的排气室，使得蒸气可以进入排气室。 通风室还包括通过毛细管毛细管装置与蒸发器室中的蒸发芯互连的冷凝芯，冷凝的液体通过毛细管毛细管返回到蒸发芯。 冷凝器室被排放到较低的压力区域或真空，使得存在的不可冷凝气体从冷凝器室移出到较低的压力，同时蒸汽被冷凝芯捕获并保留在系统中。
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公开(公告)号：US06938680B2
公开(公告)日：2005-09-06
申请号：US10618965
申请日：2003-07-14
申请人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
发明人： Scott D. Garner , James E. Lindemuth , Jerome E. Toth , John H. Rosenfeld , Kenneth G. Minnerly
IPC分类号： F28D15/04 , H01L23/427 , F28D15/00
CPC分类号： F28D15/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.
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