-
1.发明授权Alumina insulation for coating implantable components and other microminiature devices 有权用于涂层可植入组件和其他微型设备的氧化铝绝缘公开(公告)号：US07160672B2
公开(公告)日：2007-01-09
申请号：US11150547
申请日：2005-06-10
CPC分类号： G03F7/70641 , A61N1/02 , A61N1/375 , C23C14/042 , H01L21/308 , H01L23/291 , H01L2924/0002 , H05K3/284 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265 , H01L2924/00
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zerconia, or other ceramic, less than 25 microns thick, e.g., 5–10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
摘要翻译： 保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。 涂层或包封材料包括薄层或多层氧化铝，稀土或其它小于25微米厚，例如5-10微米厚的陶瓷。 氧化铝层可以在相对较低的温度下施加。 一旦施加，该层提供优异的气密性，并防止漏电。 即使非常薄，氧化铝层保持优异的绝缘特性。 在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳25密耳面积的面积上表现出低于10pA的漏电流，同时在高达80℃的温度下浸入盐水溶液中 一个三个月的时间。
-
2.发明授权公开(公告)号：US06472122B1
公开(公告)日：2002-10-29
申请号：US09393438
申请日：1999-09-09
IPC分类号： G03F716
CPC分类号： G03F7/70641 , A61N1/02 , A61N1/375 , C23C14/042 , H01L21/308 , H01L23/291 , H01L2924/0002 , H05K3/284 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265 , H01L2924/00
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zerconia, or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
摘要翻译： 保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。 涂层或包封材料包括薄层或多层氧化铝，稀土或其它小于25微米厚，例如5-10微米厚的陶瓷。 氧化铝层可以在相对较低的温度下施加。 一旦施加，该层提供优异的气密性，并防止漏电。 即使非常薄，氧化铝层保持优异的绝缘特性。 在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳25密耳面积的面积上表现出低于10pA的泄漏电流，同时在高达80℃的温度下浸入盐水溶液中 一个三个月的时间。
-
3.发明授权Alumina insulation for coating implantable components and other microminiature devices 有权用于涂层可植入组件和其他微型设备的氧化铝绝缘公开(公告)号：US07235350B2
公开(公告)日：2007-06-26
申请号：US10969758
申请日：2004-10-20
CPC分类号： G03F7/70641 , A61N1/02 , A61N1/375 , C23C14/042 , H01L21/308 , H01L23/291 , H01L2924/0002 , H05K3/284 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265 , H01L2924/00
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at a relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
摘要翻译： 保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。 涂层或包封材料包括厚度小于25微米，例如5-10微米厚的氧化铝，氧化锆或其它陶瓷的薄层或多层。 氧化铝层可以在相对较低的温度下施加。 一旦施加，该层提供优异的气密性，并防止漏电。 即使非常薄，氧化铝层保持优异的绝缘特性。 在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳25密耳面积的面积上表现出低于10pA的漏电流，同时在高达80℃的温度下浸入盐水溶液中 一个三个月的时间。
-
4.发明授权Alumina insulation for coating implantable components and other microminiature devices 有权用于涂层可植入组件和其他微型设备的氧化铝绝缘公开(公告)号：US06844023B2
公开(公告)日：2005-01-18
申请号：US10251633
申请日：2002-09-20
IPC分类号： A61L2/00 , A61N1/02 , B05D3/00 , B32B9/00 , C23C14/00 , C23C14/04 , G03F1/00 , G03F7/20 , H01L21/308 , H01L23/29 , H05K3/28
CPC分类号： G03F7/70641 , A61N1/02 , A61N1/375 , C23C14/042 , H01L21/308 , H01L23/291 , H01L2924/0002 , H05K3/284 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265 , H01L2924/00
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
摘要翻译： 保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。 涂层或包封材料包括厚度小于25微米，例如5-10微米厚的氧化铝，氧化锆或其它陶瓷的薄层或多层。 氧化铝层可以在相对较低的温度下施加。 一旦施加，该层提供优异的气密性，并防止漏电。 即使非常薄，氧化铝层保持优异的绝缘特性。 在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳×25密耳面积的面积上表现出小于10pA的漏电流，同时在高达80℃的温度下浸入盐水溶液中 一个三个月的时间。
-
5.发明授权Alumina insulation for coating implantable components and other microminiature devices 失效用于涂层可植入组件和其他微型设备的氧化铝绝缘
公开(公告)号：US6043437A
公开(公告)日：2000-03-28
申请号：US994515
申请日：1997-12-19
IPC分类号： A61L2/00 , A61N1/02 , B05D3/00 , B32B9/00 , C23C14/00 , C23C14/04 , G03F1/00 , G03F7/20 , H01L21/308 , H01L23/29 , H05K3/28 , H05K1/03
CPC分类号： G03F7/70641 , C23C14/042 , H01L21/308 , H01L23/291 , H05K3/284 , A61N1/02 , A61N1/375 , H01L2924/0002 , Y10T29/49144 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/265
摘要： A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material includes a thin layer or layers of alumina, zirconia, or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils while soaking in a saline solution at temperatures up to 80.degree. C. over a three month period.
摘要翻译： 保护性的，生物相容的涂层或包封材料保护和绝缘想要植入生物体组织的组件或装置。 涂层或包封材料包括小于25微米厚，例如5-10微米厚的氧化铝，氧化锆或其它陶瓷的薄层或多层。 氧化铝层可以在相对较低的温度下施加。 一旦施加，该层提供优异的气密性，并防止漏电。 即使非常薄，氧化铝层保持优异的绝缘特性。 在一个实施方案中，小于约6微米厚的氧化铝层提供了一种绝缘涂层，其在75密耳×25密耳的区域上表现出低于10pA的漏电流，同时在温度高达80℃的盐水溶液中浸泡 三个月的时间。
-
公开(公告)号：US07555328B2
公开(公告)日：2009-06-30
申请号：US11392163
申请日：2006-03-29
IPC分类号： A61B5/145
CPC分类号： A61N1/36585 , A61B5/0031 , A61B5/14532 , A61B5/14546 , A61B5/14865 , A61B5/4839 , A61B2560/0219 , A61M5/1723 , A61N1/05 , A61N1/372 , A61N1/3754 , H01L23/3107 , H01L29/0657 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensor may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.
摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是与其上形成有集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背靠背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。
-
公开(公告)号：US06498043B1
公开(公告)日：2002-12-24
申请号：US09718782
申请日：2000-11-22
IPC分类号： H01L2100
CPC分类号： A61N1/36585 , A61B5/0031 , A61B5/14532 , A61B5/14546 , A61B5/14865 , A61B5/4839 , A61B2560/0219 , A61M5/1723 , A61N1/05 , A61N1/372 , A61N1/3754 , H01L23/3107 , H01L29/0657 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.
摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是形成有集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背对背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。
-
公开(公告)号：US06259937B1
公开(公告)日：2001-07-10
申请号：US09100310
申请日：1998-06-19
IPC分类号： A61N105
CPC分类号： A61N1/36585 , A61B5/0031 , A61B5/14532 , A61B5/14546 , A61B5/14865 , A61B5/4839 , A61B2560/0219 , A61M5/1723 , A61N1/05 , A61N1/372 , A61N1/3754 , H01L23/3107 , H01L29/0657 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.
摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是与其上形成有集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背对背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。
-
公开(公告)号：US07079881B2
公开(公告)日：2006-07-18
申请号：US10288038
申请日：2002-11-04
IPC分类号： A61N5/00
CPC分类号： A61N1/36585 , A61B5/0031 , A61B5/14532 , A61B5/14546 , A61B5/14865 , A61B5/4839 , A61B2560/0219 , A61M5/1723 , A61N1/05 , A61N1/372 , A61N1/3754 , H01L23/3107 , H01L29/0657 , H01L2924/0002 , H01L2924/19041 , H01L2924/00
摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.
-
公开(公告)号：US08414489B2
公开(公告)日：2013-04-09
申请号：US11034371
申请日：2005-01-12
申请人： Rajiv Shah , Shaun M. Pendo , Rebecca K. Gottlieb , Gil Bruso , Gopikrishnan Soundararajan , Katherine T. Wolfe
发明人： Rajiv Shah , Shaun M. Pendo , Rebecca K. Gottlieb , Gil Bruso , Gopikrishnan Soundararajan , Katherine T. Wolfe
CPC分类号： A61B5/14532 , A61B5/0031 , A61B5/14865 , A61B5/412 , C12Q1/006
摘要： The disclosure provides methods for fabricating a long-term analyte sensor for measuring at least one analyte in the body of a user. The analyte sensors made by these methods include a plurality of analyte contacting sensor elements and at least one structure for relaying information to and from the sensor. The analyte sensor so fabricated further includes at least one sensor protection membrane that is controllable in a manner such that sensor elements may be activated (e.g. exposed to the external environment) at different times so as to extend the useful life of the sensor. In illustrative analyte sensors, the analyte is glucose.
摘要翻译： 本公开提供了制造用于测量使用者身体中的至少一种分析物的长期分析物传感器的方法。 通过这些方法制造的分析物传感器包括多个分析物接触传感器元件和用于将信息传递到传感器和从传感器传递信息的至少一个结构。 如此制造的分析物传感器还包括至少一个传感器保护膜，该传感器保护膜可以以不同时间使得传感器元件被激活（例如暴露于外部环境）的方式被控制，以延长传感器的使用寿命。 在说明性的分析物传感器中，分析物是葡萄糖。
-
-
-
-
-
-
-
-
-
搜索结果
205 条记录 (耗时 0.037 秒)
