公开(公告)号：US06452113B2

公开(公告)日：2002-09-17

申请号：US09785892

申请日：2001-02-16

申请人： Joseph Ted Dibene, II ,  David H. Hartke ,  James Hjerpe Kaskade ,  Carl E. Hoge

发明人： Joseph Ted Dibene, II ,  David H. Hartke ,  James Hjerpe Kaskade ,  Carl E. Hoge

IPC分类号： H05K116

CPC分类号： H01L23/433 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

摘要： A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

摘要翻译： 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US06847529B2

公开(公告)日：2005-01-25

申请号：US10036957

申请日：2001-12-20

申请人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H05K1/11

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US07881072B2

公开(公告)日：2011-02-01

申请号：US11502682

申请日：2006-08-11

申请人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US06304450B1

公开(公告)日：2001-10-16

申请号：US09353428

申请日：1999-07-15

申请人： Joseph Ted Dibene, II ,  David Hartke

发明人： Joseph Ted Dibene, II ,  David Hartke

IPC分类号： H05K720

CPC分类号： H05K7/20509 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734

摘要： An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.