摘要:
An LED module includes a carrier and a number of light sources. Each light source is arranged on the carrier in such a way that the LED module comprises a radiation uniformity which is less than the statistical mean of a radiation uniformity distribution, wherein the radiation uniformity distribution is based on a plurality of LED modules with a random arrangement of the light sources.
摘要:
An LED module includes a carrier and a number of light sources. Each light source is arranged on the carrier in such a way that the LED module comprises a radiation uniformity which is less than the statistical mean of a radiation uniformity distribution, wherein the radiation uniformity distribution is based on a plurality of LED modules with a random arrangement of the light sources.
摘要:
A subassembly for a document validator. In an implementation, the subassembly includes a housing, a light pipe core seated in the housing, a light control layer and at least one light source. The apparatus may also include a prism structure layer between a top diffusing surface and the light control structure. The housing may also include at least one input light port on at least one end of the light pipe core.
摘要:
An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要:
An illumination device comprises at least one light module (1) wherein the light module (1) comprises a circuit board (2) to which a plurality of groups (30) of light sources (3a, 3b, 3c) are applied and a carrier (6) on which the light module (1) is fixed. A display apparatus comprising such an illumination device is also disclosed.
摘要:
An illumination device comprises at least one light module (1) wherein the light module (1) comprises a circuit board (2) to which a plurality of groups (30) of light sources (3a, 3b, 3c) are applied and a carrier (6) on which the light module (1) is fixed, is specified. A display apparatus comprising such an illumination device is also disclosed.
摘要:
A lighting arrangement comprises an optical apparatus (4) with a radiation outlet surface (41) and an optoelectronic component (2) for producing radiation, with an element (3) which is formed like a reflector being formed. The shape and arrangement of the element are suitable for deflecting radiation generated in the component through the radiation outlet surface, and the element is designed to specifically absorb this radiation. The lighting arrangement is preferably intended for particularly homogeneous back-lighting of display apparatuses such as liquid crystal displays (LCDs).
摘要:
A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.
摘要:
Disclosed is an illumination device comprising a radiation-emitting front side and a multiplicity of light sources (R, G, B), wherein said multiplicity of light sources (R, G, B) is divided into light source groups (LG) and the light source groups (LG) are arranged on the grid points of a first regular grid.
摘要:
A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.