摘要:
The present inventors discovered that lectins recognize extremely small differences in sugar chain structures, and that by using this ability to recognize sugar chain structures, numerous sugar chain structures can be distinguished using the strong or weak interaction patterns of about ten types of lectins. Therefore, by reference to and use of control interaction data, in which large amounts of data on the interactions between sugar chains and lectins have been collected, the structures of subject sugar chains can be identified, estimated, and such with high accuracy.
摘要:
As a result of investigating the optimum conditions of methods for immobilizing proteins that interact with sugar chains onto a substrate, it was revealed that coating the surface of a slide glass with GTMS enables immobilization at a higher S/N ratio than conventionally possible. Moreover, by using a substrate to which a rubber with a number of holes was affixed to form a number of reaction vessels, and further by spotting lectins onto the substrate and washing with PBST, the weak interactions between sugar chains and lectins were successfully detected with improved sensitivity. In addition, by introducing an evanescent excitation-type scanner, it became possible to detect the interactions between lectins and sugar chains without washing away the probe solution.
摘要:
As a result of investigating the optimum conditions of methods for immobilizing proteins that interact with sugar chains onto a substrate, it was revealed that coating the surface of a slide glass with GTMS enables immobilization at a higher S/N ratio than conventionally possible. Moreover, by using a substrate to which a rubber with a number of holes was affixed to form a number of reaction vessels, and further by spotting lectins onto the substrate and washing with PBST, the weak interactions between sugar chains and lectins were successfully detected with improved sensitivity. In addition, by introducing an evanescent excitation-type scanner, it became possible to detect the interactions between lectins and sugar chains without washing away the probe solution.
摘要:
It is intended to provide a method by which sugar chains having GlcNAc transferred by GnT-V can be accurately detected, screened and purified. In this detection method, two kinds of lectins differing in detailed GlcNAc-specificity are used together. As shown in FIG. 1(I), for example, a sample containing sugar chains having GlcNAc transferred by GnT-V is screened by using a lectin GSL-II, which recognizes sugar chains having GlcNAc transferred by GnT-V, and then the screened sample is screened again by using another lectin BLL, which does not recognizes sugar chains having GlcNAc transferred by GnT-V, to thereby detect, screen and purify the sugar chains having GlcNAc transferred by GnT-V alone.
摘要:
A device for starting an occupant crash protector can output, as a start signal, a logical product of an output of a collision determining mechanism and an output of a non-collision determining mechanism. The collision determining mechanism detects a collision including an impact that does not require a start-up. The non-collision determining mechanism detects only a collision that requires a start-up using a value obtained by subtracting a value varied with time from the output of an acceleration sensor and integrating the result of the subtraction.
摘要:
The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.
摘要:
A micro-etching composition and a printed circuit board fabricated by using the micro-etching composition are provided. The micro-etching composition, comprising a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source, can continuously treat the surface of copper and copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit. The printed circuit board exhibits excellent adhesion between inner layer circuit patterns and insulation resin layers, and is free from haloing.
摘要:
An arrival time of each piece of data is calculated from an occurrence time of the piece of data and a transmission unit time period of the piece of data, and pieces of data are transmitted in the order of increasing a calculated value.
摘要:
The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.
摘要:
A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.