公开(公告)号：US20050258518A1

公开(公告)日：2005-11-24

申请号：US10851170

申请日：2004-05-24

申请人： Jun-Young Yang ,  You-Ock Joo ,  Kwan-Yong Chung

发明人： Jun-Young Yang ,  You-Ock Joo ,  Kwan-Yong Chung

IPC分类号： H01L23/02 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232

CPC分类号： H01L27/14625 ,  H01L24/73 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An image sensor package module with a leadless leadframe between chips includes a chip carrier, an image sensor chip, an integrated circuit chip, and a flexible printed circuit board. The chip carrier comprises a leadless leadframe and a pre-molded body. The leadless leadframe has a plurality of leads. The pre-molded body is completely filled among the leads and has a dam on the upper surfaces of the leads. The upper surfaces and lower surfaces of the leads are exposed on the pre-molded body. The image sensor chip is attached to the chip carrier inside the dam and electrically connected to the upper surfaces of the leads. The integrated circuit chip is mounted on the lower surfaces of the leads via bumps. The flexible printed circuit board is electrically connected to the leads for signal transmission.

摘要翻译： 具有芯片之间的无引线框架的图像传感器封装模块包括芯片载体，图像传感器芯片，集成电路芯片和柔性印刷电路板。 芯片载体包括无引线框架和预成型体。 无引线框架具有多个引线。 预成型体完全填充在引线之间，并且在引线的上表面上具有坝。 引线的上表面和下表面暴露在预成型体上。 图像传感器芯片安装在坝内的芯片载体上并电连接到引线的上表面。 集成电路芯片通过凸块安装在引线的下表面上。 柔性印刷电路板电连接到引线用于信号传输。

公开(公告)号：US07439098B2

公开(公告)日：2008-10-21

申请号：US11221812

申请日：2005-09-09

申请人： Jun-Young Yang ,  Tae-Seog Kim ,  You-Ock Joo

发明人： Jun-Young Yang ,  Tae-Seog Kim ,  You-Ock Joo

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/538 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package comprises a silicon substrate having an insulative surface; a patterned metal layer, formed on the insulative surface of the silicon substrate; an insulation layer formed on the patterned metal layer, and the patterned metal layer being partially exposed for functioning as at least a set of the device attaching pads and ball attaching pads; at least a device electrically connected to the set of the device attaching pads; a sealing compound for covering portions of the insulative surface of the silicon substrate and encapsulating the devices; and a plurality of solder balls attached to the set of ball attaching pads.

摘要翻译： 半导体封装包括具有绝缘表面的硅衬底; 形成在硅衬底的绝缘表面上的图案化金属层; 形成在所述图案化金属层上的绝缘层，并且所述图案化金属层被部分地暴露以用作至少一组所述装置附接垫和球附着垫; 至少一个电连接到该组装置连接焊盘的装置; 用于覆盖硅衬底的绝缘表面的部分并封装器件的密封化合物; 以及附接到所述一组球附着垫的多个焊球。

公开(公告)号：US20070087471A1

公开(公告)日：2007-04-19

申请号：US11221812

申请日：2005-09-09

申请人： Jun-Young Yang ,  Tae-Suk Kim ,  You-Ock Joo

发明人： Jun-Young Yang ,  Tae-Suk Kim ,  You-Ock Joo

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/538 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package comprises a silicon substrate having an insulative surface; a patterned metal layer, formed on the insulative surface of the silicon substrate; an insulation layer formed on the patterned metal layer, and the patterned metal layer being partially exposed for functioning as at least a set of the device attaching pads and ball attaching pads; at least a device electrically connected to the set of the device attaching pads; a sealing compound for covering portions of the insulative surface of the silicon substrate and encapsulating the devices; and a plurality of solder balls attached to the set of ball attaching pads.

摘要翻译： 半导体封装包括具有绝缘表面的硅衬底; 形成在硅衬底的绝缘表面上的图案化金属层; 形成在所述图案化金属层上的绝缘层，并且所述图案化金属层被部分地暴露以用作至少一组所述装置附接垫和球附着垫; 至少一个电连接到该组装置连接焊盘的装置; 用于覆盖硅衬底的绝缘表面的部分并封装器件的密封化合物; 以及附接到所述一组球附着垫的多个焊球。

公开(公告)号：US20060216868A1

公开(公告)日：2006-09-28

申请号：US11088773

申请日：2005-03-25

申请人： Jun-Young Yang ,  You-Ock Joo ,  Chang-Kyu Ahn ,  Jung-Tae Kim ,  Sung-Sig Kang

发明人： Jun-Young Yang ,  You-Ock Joo ,  Chang-Kyu Ahn ,  Jung-Tae Kim ,  Sung-Sig Kang

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The fabrication and device of package structure with a plurality of conductive contacts are provided herein. At least one chip is attached among the conductive pads on the surface of a wafer. A number of conductive wires are attached on the conductive pads and encapsulated by a layer. The layer is removed from the top thereof until to expose the conductive contacts derived from the conductive wires.

摘要翻译： 本文提供具有多个导电触点的封装结构的制造和器件。 在晶片表面的导电焊盘中至少安装一个芯片。 多个导线附着在导电焊盘上并被一层封装。 该层从其顶部移除，直到暴露出从导线导出的导电接触点。