公开(公告)号：US09181411B2

公开(公告)日：2015-11-10

申请号：US12952280

申请日：2010-11-23

申请人： Kyung Hyun Baek ,  Jung Bae Jun ,  Jung Kyu Ju

发明人： Kyung Hyun Baek ,  Jung Bae Jun ,  Jung Kyu Ju

IPC分类号： C08G18/48 ,  C08J9/14 ,  C08J9/12 ,  C08J9/32

CPC分类号： C08J9/14 ,  C08J9/127 ,  C08J9/32 ,  C08J2203/06 ,  C08J2203/12 ,  C08J2203/14 ,  C08J2203/142 ,  C08J2205/10 ,  C08J2375/04

摘要： The present invention provides rigid polyurethane foam comprising thermally expandable particles which are displaced to penetrate a strut of a structure of the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. Further, the rigid polyurethane foam can comprise hollow thermally expanded particles which are displaced to penetrate a surface of a cell in the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. The rigid polyurethane of the present invention can have excellent insulating properties.

摘要翻译： 本发明提供硬质聚氨酯泡沫，其包括热膨胀性颗粒，其被移动以穿透聚氨酯泡沫的结构的支柱，使得颗粒在发泡期间暴露于聚氨酯泡沫的一个或多个泡孔中。 此外，硬质聚氨酯泡沫可以包括中空热膨胀颗粒，其被移位以穿透聚氨酯泡沫中的电池表面，使得在发泡期间颗粒暴露于聚氨酯泡沫的一个或多个泡孔中。 本发明的硬质聚氨酯可以具有优异的绝缘性。

公开(公告)号：US20110123807A1

公开(公告)日：2011-05-26

申请号：US12952303

申请日：2010-11-23

申请人： Jung Bae Jun ,  Kyung Hyun Baek ,  Jung Kyu Ju

发明人： Jung Bae Jun ,  Kyung Hyun Baek ,  Jung Kyu Ju

IPC分类号： C08J9/16

CPC分类号： B01J13/14 ,  Y10T428/2998

摘要： The present invention provides a thermally expandable microsphere having a core-shell structure comprising: a shell including a thermoplastic polymer and a long-chain crosslinking agent having a weight-average molecular weight between cross-linking sites of more than about 500; and a core including a foaming agent. The thermally expandable microsphere of the present invention can have excellent foaming characteristics and an even (uniform) microsphere diameter.

摘要翻译： 本发明提供了一种具有核 - 壳结构的热膨胀性微球，其包括：包含热塑性聚合物的壳和交联位点之间的重均分子量大于约500的长链交联剂; 和包含发泡剂的核心。 本发明的热膨胀性微球可以具有优异的发泡特性和均匀（均匀）的微球直径。

公开(公告)号：US08089151B2

公开(公告)日：2012-01-03

申请号：US11500018

申请日：2006-08-07

申请人： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

发明人： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC分类号： H01L23/48

CPC分类号： H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

摘要翻译： 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。

公开(公告)号：US08828543B2

公开(公告)日：2014-09-09

申请号：US11966040

申请日：2007-12-28

申请人： Tae Sub Bae ,  Jin Gyu Park ,  Jung Bae Jun ,  Jae Ho Lee ,  Jung Il Park ,  Sang Woon Lee

发明人： Tae Sub Bae ,  Jin Gyu Park ,  Jung Bae Jun ,  Jae Ho Lee ,  Jung Il Park ,  Sang Woon Lee

IPC分类号： B32B5/16 ,  B05D3/04 ,  H05K3/32

CPC分类号： H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/25 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).

摘要翻译： 本文公开了具有优异的电可靠性的各向异性导电颗粒，其可用作电连接结构的材料。 进一步公开了一种制备导电颗粒的方法，该导电颗粒包括聚合物树脂基础颗粒和形成在基础颗粒表面上的导电复合金属镀层，其中导电复合金属镀层具有基本上连续的密度梯度，并且可以包括镍（Ni）和 金（Au）。

公开(公告)号：US07815999B2

公开(公告)日：2010-10-19

申请号：US11595574

申请日：2006-11-10

申请人： Jin Gyu Park ,  Tae Sub Bae ,  Jung Bae Jun ,  Jae Ho Lee ,  Jae Geun Hong

发明人： Jin Gyu Park ,  Tae Sub Bae ,  Jung Bae Jun ,  Jae Ho Lee ,  Jae Geun Hong

IPC分类号： B32B5/16 ,  B32B19/00 ,  B32B9/00 ,  B05D1/12 ,  B05D1/36 ,  B05D7/00

CPC分类号： H01B1/22 ,  H01L2224/29399 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0224 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

摘要： An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.

摘要翻译： 公开了用于各向异性导电膜的绝缘导电颗粒。 颗粒的一个实施方案包括不连续地固定在导电颗粒的表面上的导电颗粒和绝缘固定颗粒。 绝缘颗粒与其他相邻的绝缘导电颗粒提供绝缘，而绝缘导电颗粒电连接在电极之间，绝缘固定颗粒偏离其位置。 本公开还提供了制造绝缘导电颗粒的方法，包含绝缘导电颗粒的各向异性导电粘合剂膜以及使用该膜的电连接结构。

公开(公告)号：US08129023B2

公开(公告)日：2012-03-06

申请号：US11763521

申请日：2007-06-15

申请人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

发明人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

IPC分类号： B32B27/02 ,  B32B5/16 ,  B05D7/00 ,  H01B1/00

CPC分类号： H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998

摘要： Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.

摘要翻译： 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。

公开(公告)号：US07851063B2

公开(公告)日：2010-12-14

申请号：US11828559

申请日：2007-07-26

申请人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

发明人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee ,  Tae Sub Bae

IPC分类号： B32B5/16

CPC分类号： H01B1/22 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

摘要： Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.

摘要翻译： 本文公开了各向异性导电粘合剂膜中所含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒可以表现出优异的电可靠性。 进一步公开了当包含作为组分的聚合物颗粒的导电颗粒的粘合剂膜被插入并在连接基板之间被压缩时，具有良好的压缩变形性和变形性的可恢复性而不破裂的聚合物颗粒，从而实现了颗粒和连接之间的足够的接触面积 底物。 由于聚合物颗粒具有球形，均匀的粒径和窄的粒径分布，因此颗粒可以表现出增强的导电性能。

公开(公告)号：US07566494B2

公开(公告)日：2009-07-28

申请号：US11325813

申请日：2006-01-05

申请人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee

发明人： Jung Bae Jun ,  Jin Gyu Park ,  Jae Ho Lee

IPC分类号： B32B5/66

CPC分类号： H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

摘要： Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided.In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.

摘要翻译： 提供绝缘导电颗粒，各向异性粘合膜和使用其的电连接。 在本发明的一些实施方式中，绝缘性导电性粒子包括具有与其结合的绝缘性微粒的导电性粒子，其中绝缘性微粒包括硬质粒子区域和软质功能性树脂区域，其中，所述软质功能性树脂区域具有能够 结合金属。

公开(公告)号：US20070145585A1

公开(公告)日：2007-06-28

申请号：US11500018

申请日：2006-08-07

申请人： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

发明人： Jung Bae Jun ,  Jin Gyu Park ,  Heung Se Lee

IPC分类号： H01L23/48

CPC分类号： H05K3/323 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29444 ,  H01L2224/2989 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19042 ,  H05K2201/0218 ,  H05K2201/0233 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle.Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.

摘要翻译： 本发明的实施方案包括导电颗粒，其包含在聚合物树脂颗粒的表面上形成的具有小于约1.5重量％的磷含量的导电镍/金（Ni / Au）复合金属层。 也包括其形成方法。 具有小于约1.5重量％的磷的Ni / Au复合金属层的导电颗粒可以具有相对高的导电性，同时提供Ni / Au金属层对聚合物树脂颗粒的相对良好的粘附。 本发明的其它实施方案提供了包含根据本发明实施方案的导电颗粒的各向异性粘合剂组合物。