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    Apparatus for drying semiconductor wafers using isopropyl alcohol
    3.
    发明授权
    Apparatus for drying semiconductor wafers using isopropyl alcohol 失效
    使用异丙醇干燥半导体晶片的装置

    公开(公告)号：US5855077A

    公开(公告)日：1999-01-05

    申请号：US759566

    申请日：1996-12-04

    申请人： Chang-Hyun Nam ,  Yong-Sun Ko

    发明人： Chang-Hyun Nam ,  Yong-Sun Ko

    IPC分类号： H01L21/304 ,  H01L21/00 ,  F26B5/04

    CPC分类号： H01L21/67034

    摘要： An apparatus for drying semiconductor wafers using IPA (Isopropyl Alcohol) vapor includes a first chamber for producing the IPA vapor, and a second chamber connected to the first chamber through an IPA supply line, for receiving the IPA vapor and drying semiconductor wafers using the IPA vapor. With the drying apparatus, the first and second chambers are separated from each other, which allows the process steps of producing the IPA vapor and the drying the wafers to be separately performed. The drying apparatus thus prevents particles from being generated in the second chamber during the drying process. The wafers can be dried without a variation in temperature in the second chamber. The IPA vapor is exhausted from the second chamber by introducing nitrogen into the second chamber. As a result, the IPA vapor in the second chamber is not liquified and thereby leaves no substance to adhere to a contact portion between a wafer carrier and each wafer.

    摘要翻译： 使用IPA（异丙醇）蒸汽干燥半导体晶片的设备包括用于产生IPA蒸气的第一室和通过IPA供应管线连接到第一室的第二室，用于接收IPA蒸汽并使用IPA干燥半导体晶片 汽。 利用干燥装置，第一和第二室彼此分离，这允许产生IPA蒸气和干燥晶片以分开执行的工艺步骤。 因此，干燥装置防止在干燥过程中在第二室中产生颗粒。 可以在第二室中没有温度变化的情况下干燥晶片。 通过将氮气引入第二室，IPA蒸气从第二室排出。 结果，第二室中的IPA蒸气不液化，从而不会留下物质粘附到晶片载体和每个晶片之间的接触部分。

    Method of forming solder resist pattern
    8.
    发明授权
    Method of forming solder resist pattern 失效
    形成阻焊图案的方法

    公开(公告)号：US07435352B2

    公开(公告)日：2008-10-14

    申请号：US10677182

    申请日：2003-10-02

    申请人： Jee-Soo Mok ,  Jang-Kyu Kang ,  Chang-Hyun Nam

    发明人： Jee-Soo Mok ,  Jang-Kyu Kang ,  Chang-Hyun Nam

    IPC分类号： H01B13/00

    CPC分类号： H05K3/28 ,  H05K3/0032 ,  H05K3/383 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2203/0257 ,  Y10T29/49128 ,  Y10T29/49165

    摘要： A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.

    摘要翻译： 形成阻焊剂图案的方法包括在基板的两面上层压半固化的热固性膜，并根据阻焊掩模图案激光烧蚀层压的热固性膜。 该方法适用于通过堆积过程或并行工艺制造的多层印刷电路板。 由于简化的工艺，可以降低制造成本和提高阻焊图案的精度。