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公开(公告)号：US20100291488A1
公开(公告)日：2010-11-18
申请号：US12805371
申请日：2010-07-27
Applicant: Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
Inventor： Soon-Oh Jung , Cheol-Ho Choi , Chang-Hyun Nam , Hong-Won Kim , Seung-Chul Kim
CPC classification number: H05K3/108 , H05K3/181 , H05K3/4661 , H05K2201/0344 , Y10T29/49124 , Y10T428/31678
Abstract: A method for manufacturing a cone board including: preparing a core insulation layer including one or more resins selected from the group consisting of epoxy resins and bismaleimide triazine resins; and forming a first nickel layer on at least one surface of the core insulation layer by electroless plating
Abstract translation: 一种锥形板的制造方法，包括：制备包含一种或多种选自环氧树脂和双马来酰亚胺三嗪树脂的树脂的芯绝缘层; 以及通过无电镀在所述芯绝缘层的至少一个表面上形成第一镍层
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2.发明申请公开(公告)号：US20100096177A1
公开(公告)日：2010-04-22
申请号：US12320284
申请日：2009-01-22
Applicant: Seok Kyu Lee , Soon OH Jung , Jong Kuk Hong , Soon Jin Cho
Inventor： Seok Kyu Lee , Soon OH Jung , Jong Kuk Hong , Soon Jin Cho
CPC classification number: H05K3/00 , H05K1/113 , H05K3/0052 , H05K3/007 , H05K3/4007 , H05K3/426 , H05K3/4682 , H05K2201/0367 , H05K2201/09563 , H05K2201/096 , H05K2203/0156 , H05K2203/054 , H05K2203/1572
Abstract: Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.
Abstract translation: 本文公开了具有填充通孔焊盘的无芯基板及其制造方法。 绝缘层形成在堆积层的两侧，并且通孔焊盘嵌入在绝缘层中，使得通孔焊盘与绝缘层齐平。 通孔焊盘不与衬底分离，因此焊盘的可靠性增加。 凸起的平坦度增加，因此倒装芯片的结合变得容易。
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公开(公告)号：US20110079349A1
公开(公告)日：2011-04-07
申请号：US12654360
申请日：2009-12-17
Applicant: Suk Hyeon Cho , Chang Sup Ryu , Jin Yong An , Soon Oh Jung , Sung Won Jeong , Byung Moon Kim , Dong Ju Jeon , Seok Kyu Lee , Jin Ho Kim
Inventor： Suk Hyeon Cho , Chang Sup Ryu , Jin Yong An , Soon Oh Jung , Sung Won Jeong , Byung Moon Kim , Dong Ju Jeon , Seok Kyu Lee , Jin Ho Kim
CPC classification number: H05K3/4682 , H05K3/0035 , H05K3/0052 , H05K3/007 , H05K3/0097 , H05K3/28 , H05K2203/066 , H05K2203/1536
Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.
Abstract translation: 本发明提供一种制造印刷电路板的方法，包括以下步骤：制备分别通过依次堆叠隔离膜和第一绝缘层而形成的一对原材料和粘合剂层; 在粘合剂层中嵌入彼此相对的一对原料，同时将释放膜设置在内层上; 在所述第一绝缘层上形成第二绝缘层，所述第二绝缘层具有穿过其形成的通孔和形成在与所述通孔连接的上表面上的电路图案; 第二和第一绝缘层，剥离膜和粘合剂层的切割边缘部分; 以及从所述第一绝缘层移除所述脱模膜。
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公开(公告)号：US20110056614A1
公开(公告)日：2011-03-10
申请号：US12649899
申请日：2009-12-30
Applicant: Jin-Yong AN , Soon-Oh Jung , Dong-Ju Jeon
Inventor： Jin-Yong AN , Soon-Oh Jung , Dong-Ju Jeon
CPC classification number: C25D7/12 , C25D11/04 , H05K1/0271 , H05K3/007 , H05K3/4682 , H05K2201/2009 , H05K2203/0152 , H05K2203/0376 , Y10T156/1052
Abstract: A manufacturing method of a circuit board is disclosed. The manufacturing method of a circuit board in accordance with the present invention includes forming a separation layer on a carrier, stacking an adhesion layer which is coupled to the carrier and covers the separation layer, forming a circuit layer on the adhesion layer, forming a circuit board unit by cutting the separation layer, the adhesion layer and the circuit layer such that the separation layer is separated from the carrier, and forming a stiffener by processing the separation layer of the circuit board unit. The manufacturing method of a circuit board in accordance with the present invention can reduce the cost and time for forming the stiffener by forming the stiffener together in the manufacturing process of the circuit board.
Abstract translation: 公开了一种电路板的制造方法。 根据本发明的电路板的制造方法包括在载体上形成分离层，层叠粘合层，该粘合层与载体结合并覆盖分离层，在粘合层上形成电路层，形成电路 通过切割分离层，粘合层和电路层，使得分离层与载体分离，并通过加工电路板单元的分离层形成加强件。 根据本发明的电路板的制造方法可以通过在电路板的制造过程中形成加强件来减少形成加强件的成本和时间。
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公开(公告)号：US20070045821A1
公开(公告)日：2007-03-01
申请号：US11508306
申请日：2006-08-23
Applicant: Seung-Hyun Cho , Han Kim , Soon-Oh Jung
Inventor： Seung-Hyun Cho , Han Kim , Soon-Oh Jung
IPC: H01L23/12
CPC classification number: H01L23/147 , H01L23/49822 , H01L2924/0002 , H05K1/0271 , H05K3/4644 , H05K2201/09354 , H05K2201/09781 , H01L2924/00
Abstract: A printed circuit board for inhibiting warpage is disclosed. The printed circuit board has a core layer, which is formed by an insulating material; a circuit pattern layer, which is formed in the upper part of the core layer and has a central area, in which a circuit pattern is formed, and a fringe, which surrounds the central area and is made of a material of high stiffness; an insulating layer, which is formed in the upper part of the circuit pattern layer; and a solder resist, which is formed in the upper part of the insulating layer. The printed circuit board with a dual type inner structure in accordance with the present invention has an effect of inhibiting warpage by having an inner structure in which the rim is made of a material that is hardly warped and a vertex in which the rim is shaped round.
Abstract translation: 公开了一种用于抑制翘曲的印刷电路板。 印刷电路板具有由绝缘材料形成的芯层; 电路图案层，其形成在芯层的上部并具有形成电路图案的中心区域和围绕中心区域并由高刚度材料制成的边缘; 绝缘层，其形成在电路图案层的上部; 以及形成在绝缘层的上部的阻焊剂。 根据本发明的具有双重内部结构的印刷电路板具有通过具有内部结构来抑制翘曲的效果，其中边缘由几乎不翘曲的材料制成，并且边缘形成圆顶的顶点 。
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Patent Agency Ranking
公开(公告)号：US07971352B2
公开(公告)日：2011-07-05
申请号：US12213465
申请日：2008-06-19
Applicant: Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
Inventor： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
CPC classification number: H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。
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7.发明申请公开(公告)号：US20110048786A1
公开(公告)日：2011-03-03
申请号：US12870137
申请日：2010-08-27
Applicant: Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
Inventor： Suk Hyeon Cho , Jin Yong Ahn , Soon Oh Jung , Dong Ju Jeon , Ki Hwan Kim , Byung Moon Kim
CPC classification number: H05K3/4015 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K2201/0367 , H05K2201/10242 , H05K2203/0338 , Y10T29/49155
Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
Abstract translation: 这里公开了具有凹凸的印刷电路板及其制造方法。 具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。 凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。
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公开(公告)号：US07707715B2
公开(公告)日：2010-05-04
申请号：US12005610
申请日：2007-12-28
Applicant: Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
Inventor： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC: H05K3/00
CPC classification number: H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
Abstract translation: 公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。
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公开(公告)号：US20090151160A1
公开(公告)日：2009-06-18
申请号：US12213465
申请日：2008-06-19
Applicant: Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
Inventor： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
CPC classification number: H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。
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10.发明授权公开(公告)号：US08445790B2
公开(公告)日：2013-05-21
申请号：US12320284
申请日：2009-01-22
Applicant: Seok Kyu Lee , Soon Oh Jung , Jong Kuk Hong , Soon Jin Cho
Inventor： Seok Kyu Lee , Soon Oh Jung , Jong Kuk Hong , Soon Jin Cho
IPC: H05K1/11
CPC classification number: H05K3/00 , H05K1/113 , H05K3/0052 , H05K3/007 , H05K3/4007 , H05K3/426 , H05K3/4682 , H05K2201/0367 , H05K2201/09563 , H05K2201/096 , H05K2203/0156 , H05K2203/054 , H05K2203/1572
Abstract: Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.
Abstract translation: 本文公开了具有填充通孔焊盘的无芯基板及其制造方法。 绝缘层形成在堆积层的两侧，并且通孔焊盘嵌入在绝缘层中，使得通孔焊盘与绝缘层齐平。 通孔焊盘不与衬底分离，因此焊盘的可靠性增加。 凸起的平坦度增加，因此倒装芯片的结合变得容易。
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