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公开(公告)号:US07120029B2
公开(公告)日:2006-10-10
申请号:US10668187
申请日:2003-09-24
申请人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
发明人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
IPC分类号: H05K1/14
CPC分类号: G06K19/07743 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , Y10S439/945 , Y10S439/946 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
摘要翻译: 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中,平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置,更靠近作为存储卡的一个短边的第一端侧,作为位于存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。
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公开(公告)号:US20060220202A1
公开(公告)日:2006-10-05
申请号:US11423755
申请日:2006-06-13
IPC分类号: H01L23/02
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载到由热固性树脂材料制成的壳体2上,并用由热固性树脂材料制成的密封部分密封,从而制造IC卡。 IC体包括:在其背面形成有外部连接端子的布线基板; 半导体芯片,其负载在所述布线基板的表面上,并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US07971791B2
公开(公告)日:2011-07-05
申请号:US10562727
申请日:2003-07-03
申请人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
CPC分类号: G06K19/077 , G06K19/07732 , H01L24/06 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要: A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed.
摘要翻译: 多功能卡装置具有连接到接口控制器和外部连接端子的外部连接端子,接口控制器,存储器和安全控制器。 接口控制器具有多个接口控制模式,并且根据来自外部的指令通过控制模式来控制外部接口动作和存储器接口动作。 外部连接端子具有针对每个接口控制模式个性化的单个端子,以及共用公共端子。 公共端子包括时钟输入端子,电源端子和接地端子。 数据终端和安全控制器的专用终端包括在各个终端中。 外部连接终端的部分共享和个性化可以保证接口的可靠性,并且可以通过某种接口控制模式来增加对物理量的控制。 安全控制器独立接口的安全过程也可以保证。
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公开(公告)号:US07946500B2
公开(公告)日:2011-05-24
申请号:US11957469
申请日:2007-12-16
申请人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号: G06K19/06
CPC分类号: G06K19/07732 , G06K19/005 , G06K19/077 , G06K19/07749
摘要: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
摘要翻译: 通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。 具有存储卡的两个天线连接引脚被分成两个区域,其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。 由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大,所以提供了两个天线连接引脚,并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡 一个可能的电源引脚与存储卡不对应的非接触式接口。 因此,可以形成与非接触式接口相对应的存储卡的引脚区域,而不会脱离与非接触式接口对应的存储卡的引脚区域。
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公开(公告)号:US07615855B2
公开(公告)日:2009-11-10
申请号:US12116190
申请日:2008-05-06
CPC分类号: H05K3/284 , B29C45/14647 , B29C45/14655 , B29C45/1657 , B29C45/1671 , B29C2045/1673 , H01L21/563 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H05K1/117 , H05K2201/10159 , H05K2203/1316 , H05K2203/1572 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
摘要翻译: 将IC体装载到由热固性树脂材料制成的壳体2上,并用由热固性树脂材料制成的密封部分密封,从而制造IC卡。 IC体包括:在其背面形成有外部连接端子的布线基板; 半导体芯片,其负载在所述布线基板的表面上,并且经由互连电连接到所述外部连接端子; 以及由热固性树脂材料制成的密封部分以覆盖半导体芯片和接合线。 密封部形成为使外部连接端子露出。 本发明可以提高IC卡的强度,同时降低制造成本,提高可靠性。
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公开(公告)号:US07478473B2
公开(公告)日:2009-01-20
申请号:US11536433
申请日:2006-09-28
申请人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
发明人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
IPC分类号: H05K3/30
CPC分类号: G06K19/07743 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , Y10S439/945 , Y10S439/946 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
摘要翻译: 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中,平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置,更靠近作为存储卡的一个短边的第一端侧,作为位于存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。
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公开(公告)号:US07416133B2
公开(公告)日:2008-08-26
申请号:US10961136
申请日:2004-10-12
申请人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada
发明人: Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada
IPC分类号: G05F17/00
CPC分类号: G06K19/077 , G06K13/0825 , H01L2224/48091 , H01L2224/48227 , H01L2924/01079 , H01L2924/1815 , H01L2924/00014
摘要: An IC card is prevented from falling off readily an electronic device while maintaining the mechanical strength of the IC card. A recess for preventing a memory card from falling off an electronic device is provided at the side of one side of a principal surface of a cap of the memory card which is configured by fitting a memory body in a recess formed on a parts mounting surface of the cap. The bottom of the recess is terminated in the middle of the thickness of the cap. This construction makes it possible to prevent the memory card from falling off readily an electronic device while maintaining the mechanical strength of the memory card.
摘要翻译: 在保持IC卡的机械强度的同时,防止IC卡容易脱落。 在存储卡的帽的主表面的一侧设置有用于防止存储卡从电子设备脱落的凹部,其通过将存储器体装配在形成在 这顶帽子。 凹槽的底部终止于盖的厚度的中间。 这种结构使得可以在保持存储卡的机械强度的同时防止存储卡容易地脱落电子设备。
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公开(公告)号:US20070023885A1
公开(公告)日:2007-02-01
申请号:US11536433
申请日:2006-09-28
申请人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
发明人: Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi , Junichiro Osako , Tamaki Wada
IPC分类号: H01L23/02
CPC分类号: G06K19/07743 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , Y10S439/945 , Y10S439/946 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , H01L2924/00014 , H01L2924/00
摘要: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
摘要翻译: 提高IC卡的生产率。 在其中具有布线基板的存储体和安装在布线基板的主表面上的半导体芯片被夹持在第一壳体和第二壳体之间的类型的存储卡中,平面轮廓 存储器体小于存储卡的平面轮廓的一半。 存储体被布置成相对于位于第一端侧和第二端侧之间的中线的位置,更靠近作为存储卡的一个短边的第一端侧,作为位于存储卡上的存储卡的相对的短边 与第一端侧相对的一侧。 将第一和第二种情况下的存储体配置区域以外的区域用作另一功能区域。
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公开(公告)号:US07823793B2
公开(公告)日:2010-11-02
申请号:US12261993
申请日:2008-10-30
IPC分类号: G06K19/06
CPC分类号: G06K19/07732 , G06K19/0719 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H05K1/0268 , H05K1/117 , H01L2924/00014 , H01L2924/00
摘要: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
摘要翻译: IC卡和卡适配器被设计成使得特定标准(例如,MMC标准)的IC卡与IC卡和其他标准的终端(例如,MS卡标准和USB终端标准)兼容。 在IC卡(MMC)中,连接到闪速存储器的控制器IC包括电压下拉检测器,模式控制器,USB模式接口控制器,MS模式接口控制器和MMC / SD模式接口控制器。 卡适配器足以具有易于形成的部件,成本低廉,例如布线和电阻器。 IC卡的电压下拉检测器检测由电阻引起的电压下拉,模式控制器选择USB模式接口控制器,MS模式接口控制器或MMC / SD模式接口控制器,使IC 卡与相应的IC卡标准兼容。
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公开(公告)号:US20080272197A1
公开(公告)日:2008-11-06
申请号:US11957469
申请日:2007-12-16
申请人: Hirotaka NISHIZAWA , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人: Hirotaka NISHIZAWA , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号: G06K19/067
CPC分类号: G06K19/07732 , G06K19/005 , G06K19/077 , G06K19/07749
摘要: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
摘要翻译: 通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。 具有存储卡的两个天线连接引脚被分成两个区域,其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。 由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大,所以提供了两个天线连接引脚,并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡 一个可能的电源引脚与存储卡不对应的非接触式接口。 因此,可以形成与非接触式接口相对应的存储卡的引脚区域,而不会脱离与非接触式接口对应的存储卡的引脚区域。
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