公开(公告)号：US20170154785A1

公开(公告)日：2017-06-01

申请号：US15208001

申请日：2016-07-12

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yasuhito YOSHIMIZU ,  Hiroyasu llMORI ,  Katsuhiro SATO

IPC: H01L21/311 ,  C23F1/16 ,  H01L21/67 ,  H01L27/115 ,  H01L21/02

CPC classification number: H01L21/31144 ,  C23F1/16 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31111 ,  H01L21/32134 ,  H01L21/32139 ,  H01L21/32155 ,  H01L21/6708 ,  H01L27/11582 ,  H01L28/00

Abstract: According to one embodiment, a method for manufacturing a semiconductor device includes the following processes. Second layers and first layers are alternately stacked on a substrate to form a stack. A mask layer is formed on the first layer in a surface of the stack. A part of the mask layer is removed to expose part of the first layer, and a protective layer is formed in a surface layer of the mask layer. The exposed first layer is etched with a first etching solution to expose part of the second layer after forming the protective layer. The exposed second layer is etched with a second etching solution after etching the first layer. The mask layer is etched with a third etching solution to further expose part of the first layer, after etching the first layer and etching the second layer.

公开(公告)号：US20160365240A1

公开(公告)日：2016-12-15

申请号：US14986977

申请日：2016-01-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tomohiko SUGITA ,  Katsuhiro SATO ,  Hiroyasu llMORI ,  Yoshihiro OGAWA

IPC: H01L21/02 ,  B08B3/10 ,  H01L21/67

CPC classification number: H01L21/02052 ,  H01L21/67028

Abstract: In one embodiment, a substrate treatment method includes cleaning and rinsing a surface of a substrate provided with a pattern, and supplying a solidifying agent containing liquid that contains a solidifying agent to the cleaned and rinsed surface of the substrate. The method further includes precipitating the solidifying agent as solid on the surface of the substrate, and decomposing and gasifying the solid to remove the solid from the surface of the substrate. Furthermore the solidifying agent contains an ammonium salt, and the ammonium salt contains an ammonium ion or an ion having a structure in which at least one of four hydrogen atoms of an ammonium ion is substituted with another atom or an atom group.

Abstract translation: 在一个实施方案中，基材处理方法包括清洗和冲洗具有图案的基材的表面，并将含有固化剂的含有液体的固化剂供应到基材的经清洁和漂洗的表面。 该方法还包括将固体凝固剂沉淀在基材的表面上，并将固体分解和气化以从基材表面除去固体。 此外，固化剂含有铵盐，铵盐含有铵离子或具有铵离子的四个氢原子中的至少一个被其它原子或原子基团取代的结构的离子。

公开(公告)号：US20170250069A1

公开(公告)日：2017-08-31

申请号：US15239243

申请日：2016-08-17

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tomohiko SUGITA ,  Hiroyasu llMORI ,  Yoshihiro OGAWA

IPC: H01L21/02 ,  H01L21/687 ,  B08B3/12 ,  H01L21/67 ,  B01D43/00 ,  B01D49/00

CPC classification number: H01L21/02057 ,  B01D21/283 ,  B01D43/00 ,  B01D49/006 ,  B01D51/08 ,  B08B3/12 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/68764

Abstract: In one embodiment, a dust collecting apparatus includes a container configured to contain a fluid that includes particles to be collected. The apparatus further includes one or more sound sources configured to generate, in the container, a standing sound wave including at least one node to trap the particles in a vicinity of the node. The one or more sound sources are configured to generate the standing sound wave so that the node does not contact a wall face of the container or contacts a predetermined portion of the wall face of the container. The predetermined portion is formed of a member that prevents the particles from leaving from the node located in a vicinity of the predetermined portion.