Abstract:
An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.
Abstract:
An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.
Abstract:
3D measurements of features on a workpiece, such as ball height, co-planarity, component thickness, or warpage, are determined. The system includes a broadband light source, a microlens array, a tunable color filter, a lens system, and a detector. The microlens array can focus a light beam to a points in a focal plane of the microlens array. The tunable color filter can narrow the light beam to a band at a central wavelength. The lens system can provide longitudinal chromatic aberration whereby different wavelengths are imaged at different distances from the lens system.
Abstract:
An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.
Abstract:
An object carrier, a system and a method is disclosed for the back light inspection of transparent or semitransparent objects. The carrier has a carrier base layer with photo luminescent properties which carries the transparent or semitransparent object on top of the layer. The transparent or semitransparent object could be a wafer and the object carrier could be a wafer chuck. At least one light source being arranged above the object carrier such that excitation light emitted from the at least one light source is directed through the transparent or semitransparent object to the layer with photo luminescent properties. The light returned from the layer with photo luminescent properties is collected by an objective and registered by a sensor.
Abstract:
An object carrier, a system and a method is disclosed for the back light inspection of transparent or semitransparent objects. The carrier has a carrier base layer with photo luminescent properties which carries the transparent or semitransparent object on top of the layer. The transparent or semitransparent object could be a wafer and the object carrier could be a wafer chuck. At least one light source being arranged above the object carrier such that excitation light emitted from the at least one light source is directed through the transparent or semitransparent object to the layer with photo luminescent properties. The light returned from the layer with photo luminescent properties is collected by an objective and registered by a sensor.
Abstract:
An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.