利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.021 秒)

    Removal of liquid from pullulan
    1.
    发明授权
    Removal of liquid from pullulan 失效
    从支链淀粉中除去液体

    公开(公告)号：US5709801A

    公开(公告)日：1998-01-20

    申请号：US708847

    申请日：1996-09-09

    申请人： Kanji Murofushi ,  Shigehiro Nagura ,  Jiro Moriya

    发明人： Kanji Murofushi ,  Shigehiro Nagura ,  Jiro Moriya

    IPC分类号： B30B9/20 ,  C08B37/00 ,  B01D37/00

    CPC分类号： C08B37/0018 ,  B30B9/202

    摘要： Pullulan is precipitated from an aqueous solution by mixing with a hydrophilic organic solvent incapable of dissolving pullulan. Solid pullulan is then separated from the liquid component of the dispersion by feeding the dispersion into a V-type disk press having a pair of discoid screens arranged so that the distance between them decreases as they are rotated. The pullulan dispersion is pressed by the discoid screens, recovering the liquid component through the screens. The resulting low-liquid-content pullulan continues to rotate together with the screens to an outlet, where it is discharged from the press.

    摘要翻译： 通过与不能溶解支链淀粉的亲水性有机溶剂混合，从水溶液中沉淀支链淀粉。 然后通过将分散体输送到具有一对盘状筛网的V型盘压榨机中，使分散体的液体组分分离，使得它们之间的距离随着其旋转而减小。 支链淀粉分散体被盘状筛网压制，通过筛网回收液体组分。 所得到的低液体含量的支链淀粉继续与筛网一起旋转到出口，在那里从压榨机排出。

    Method for polishing angular substrates
    5.
    发明授权
    Method for polishing angular substrates 有权
    抛光角基底的方法

    公开(公告)号：US06790129B2

    公开(公告)日：2004-09-14

    申请号：US10214114

    申请日：2002-08-08

    申请人： Jiro Moriya ,  Masataka Watanabe ,  Satoshi Okazaki ,  Hidekazu Ozawa ,  You Ishii ,  Shunichiro Kojima

    发明人： Jiro Moriya ,  Masataka Watanabe ,  Satoshi Okazaki ,  Hidekazu Ozawa ,  You Ishii ,  Shunichiro Kojima

    IPC分类号： B24B700

    CPC分类号： B24B37/042

    摘要： An angular substrate polishing method includes the steps of holding an angular substrate having a surface to be polished within a guide ring of a substrate holding head; pressing the substrate surface to be polished, and also one surface of the guide ring, against a polishing pad; and independently rotating the polishing pad and the substrate-holding head together with the substrate it holds while pressing the polishing pad-contacting surface of the guide ring against the polishing pad, to thereby polish the substrate surface. During the polishing step, a pressing force is applied to the guide ring which is separate from the pressing force applied to the substrate, enhancing the flatness of the polished substrate.

    摘要翻译： 角度衬底抛光方法包括以下步骤：将具有待抛光表面的角度衬底保持在衬底保持头的引导环内; 将抛光的基板表面以及引导环的一个表面压在抛光垫上; 并且在将导向环的抛光垫接触表面压靠在抛光垫上的同时，将抛光垫和基板保持头一起与其保持的基板一起旋转，从而抛光基板表面。 在抛光步骤期间，对导向环施加压力，该导向环与施加到基板上的按压力分开，提高抛光基板的平整度。

    Electronic device, battery pack, and method of computing battery pack capacity
    7.
    发明授权
    Electronic device, battery pack, and method of computing battery pack capacity 有权
    电子设备，电池组和计算电池组容量的方法

    公开(公告)号：US09153848B2

    公开(公告)日：2015-10-06

    申请号：US13274715

    申请日：2011-10-17

    申请人： Ryoichi Nakashima ,  Ryota Hashizume ,  Jiro Moriya ,  Yukio Tsuchiya ,  Junya Yamada ,  Takashi Mutou

    发明人： Ryoichi Nakashima ,  Ryota Hashizume ,  Jiro Moriya ,  Yukio Tsuchiya ,  Junya Yamada ,  Takashi Mutou

    IPC分类号： G01R31/36 ,  H01M10/48 ,  H01M10/42 ,  H01M10/0525

    CPC分类号： H01M10/48 ,  G01R31/361 ,  G01R31/3682 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/488

    摘要： An electronic device includes a battery capacity computing unit configured to compute a current full-charge capacity of a currently inserted battery apparatus having secondary cells. The battery capacity computing unit acquires at least information on a full-charge capacity of the battery apparatus in a brand-new state and information on the battery charge/discharge cycle count from the battery apparatus, retains a correction coefficient used when computing the current full-charge capacity of the battery apparatus, and calculates the current full-charge capacity of the battery apparatus using the information on the full-charge capacity of the battery apparatus in a brand-new state, the information on the battery charge/discharge cycle count, and the correction coefficient.

    摘要翻译： 电子设备包括电池容量计算单元，其被配置为计算当前插入的具有二次电池的电池装置的当前满充电容量。 电池容量计算单元至少获取关于全新状态的电池装置的满充电容量的信息和来自电池装置的电池充电/放电周期计数的信息，保留当计算当前充满电时使用的校正系数 电池装置的充电容量，并且使用关于全新状态的电池装置的全充电容量的信息来计算电池装置的当前满充电容量，关于电池充电/放电周期数的信息 ，和校正系数。

    Angular substrates
    9.
    发明授权
    Angular substrates 有权

    公开(公告)号：US07122280B2

    公开(公告)日：2006-10-17

    申请号：US10214113

    申请日：2002-08-08

    申请人： Jiro Moriya ,  Masataka Watanabe ,  Satoshi Okazaki

    发明人： Jiro Moriya ,  Masataka Watanabe ,  Satoshi Okazaki

    IPC分类号： H01L21/44

    CPC分类号： H01L21/30625 ,  G03F1/60 ,  H01L21/02035 ,  Y10T428/12528

    摘要： A square substrate has a pair of opposed major surfaces and peripheral end faces therebetween, wherein a tapered edge portion is disposed between the peripheral end face and each major surface to define an inner boundary with the major surface, and has a width of 0.2–1 mm from the peripheral end face. Both or either one of the major surfaces of the substrate has a flatness of up to 0.5 μm in an outside region of the substrate that extends between a position spaced 3 mm inward from the peripheral end face and the inner boundary of the tapered edge portion.