Pattern forming method, pattern, chemical amplification resist composition and resist film
    6.
    发明授权
    Pattern forming method, pattern, chemical amplification resist composition and resist film 有权
    图案形成方法,图案,化学放大抗蚀剂组合物和抗蚀剂膜

    公开(公告)号:US08808965B2

    公开(公告)日:2014-08-19

    申请号:US13522147

    申请日:2011-01-13

    摘要: A pattern forming method comprising (i) a step of forming a film from a chemical amplification resist composition (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains (A) a resin containing a repeating unit having two or more hydroxyl groups, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a crosslinking agent and (D) a solvent; a pattern formed by the pattern forming method; a chemical amplification resist composition used in the pattern forming method; and a resist film formed using the chemical amplification resist composition.

    摘要翻译: 一种图案形成方法,包括(i)从化学放大抗蚀剂组合物形成膜的步骤(ii)暴露所述膜的步骤,和(iii)通过使用含有机溶剂的显影剂显影所述曝光的膜的步骤, 其中,所述化学增幅抗蚀剂组合物含有(A)含有具有2个以上羟基的重复单元的树脂,(B)能够在光化射线或辐射照射时能够产生酸的化合物,(C)交联剂和( D)溶剂; 由图案形成方法形成的图案; 在图案形成方法中使用的化学放大抗蚀剂组合物; 以及使用该化学放大抗蚀剂组合物形成的抗蚀剂膜。

    PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM
    7.
    发明申请
    PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM 有权
    图案形成方法,图案,化学放大电阻组合物和电阻膜

    公开(公告)号:US20120288691A1

    公开(公告)日:2012-11-15

    申请号:US13522147

    申请日:2011-01-13

    摘要: A pattern forming method comprising (i) a step of forming a film from a chemical amplification resist composition (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains (A) a resin containing a repeating unit having two or more hydroxyl groups, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a crosslinking agent and (D) a solvent; a pattern formed by the pattern forming method; a chemical amplification resist composition used in the pattern forming method; and a resist film formed using the chemical amplification resist composition.

    摘要翻译: 一种图案形成方法,包括(i)从化学放大抗蚀剂组合物形成膜的步骤(ii)暴露所述膜的步骤,和(iii)通过使用含有机溶剂的显影剂显影所述曝光的膜的步骤, 其中,所述化学增幅抗蚀剂组合物含有(A)含有具有2个以上羟基的重复单元的树脂,(B)能够在光化射线或辐射照射时能够产生酸的化合物,(C)交联剂和( D)溶剂; 由图案形成方法形成的图案; 在图案形成方法中使用的化学放大抗蚀剂组合物; 以及使用该化学放大抗蚀剂组合物形成的抗蚀剂膜。

    PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM
    8.
    发明申请
    PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM 有权
    图案形成方法,化学放大电阻组合物和电阻膜

    公开(公告)号:US20120148957A1

    公开(公告)日:2012-06-14

    申请号:US13390847

    申请日:2010-10-05

    IPC分类号: G03F7/20 G03F7/075 G03F7/004

    摘要: A pattern forming method includes: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a crosslinking agent; and (D) a solvent, a negative chemical amplification resist composition used in the method, and a resist film formed from the negative chemical amplification resist composition.

    摘要翻译: 图案形成方法包括:(i)从化学放大抗蚀剂组合物形成膜; (ii)使膜曝光,形成曝光膜; 和(iii)通过使用含有机溶剂的显影剂显影所述曝光的膜,其中所述化学增幅抗蚀剂组合物含有:(A)基本上不溶于碱的树脂; (B)能够在用光化射线或辐射照射时能产生酸的化合物; (C)交联剂; 和(D)本方法中使用的溶剂,负性化学增幅抗蚀剂组合物和由负极化学增幅抗蚀剂组合物形成的抗蚀剂膜。