摘要:
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
摘要:
A semiconductor device includes a metal terminal provided on a semiconductor substrate and a protection element. The protection element includes an insulated gate field-effect transistor. The transistor has a first diffusion layer of a reverse conductive-type formed on one conductive type region of the semiconductor substrate and connected to the metal terminal, as its source. The transistor also includes a second diffusion layer of a reverse conductive-type connected to an electrode wire having a constant electric potential, as its source, and has a gate electrode connected to the electrode wire. A lateral bipolar transistor includes a third diffusion layer of a reverse conductive-type formed with a constant spaced distance with respect to the second diffusion layer and connected to the metal terminal, as its collector, and also has the second diffusion layer as its emitter, and furthermore has the one conductive-type region as its base. Thus, a semiconductor device is protected from an electrostatic discharge (ESD) breakdown device even though having high density and a high operating speed.
摘要:
On the surface of a p-type semiconductor substrate, an n-type diffusion layer is formed. The diffusion layer is in contact with an aluminum wiring via a contact hole formed through an interlayer insulation layer to electrical connection. Immediately beneath the contact portion of the aluminum wiring, a contact n-type diffusion layer having higher impurity concentration than the n-type diffusion layer and having deeper junction depth. Outside of the contact n-type diffusion layer is surrounded by a low impurity concentration n well. With the construction, when an electrostatic pulse is applied to an external terminal connected to the shallow diffusion layer, junction breakdown of the diffusion layer can be successfully prevented.
摘要:
In an output circuit having first and second MOS transistors in series between a first power supply line and a second power supply line, and a third MOS transistor, the gates of the first and second transistors are connected to first and second input nodes, respectively, and an output node is provided between the first and second MOS transistors. The third MOS transistor is connected between one of the input nodes and the output node. The gate of the third MOS transistor is connected to a third power supply line.
摘要:
A via transmission line for a multilayer printed circuit board (PCB) in which a wave guiding channel is formed by a signal via or a number of signal vias, an assembly of ground vias surrounding the signal via or corresponding number of coupled signal vias, a set of ground plates from conductor layers of the multilayer PCB, and a clearance hole. In this via transmission line, the signal via, or the number of signal vias forms an inner conductive boundary, ground vias and ground plates from conductor layers of the multilayer PCB form an outer conductive boundary, and the clearance hole provides both isolation of the inner conductive boundary from the outer conductive boundary and high-performance broadband operation of the via transmission line by means of the predetermined clearance hole cross-sectional shape and dimensions where the cross-sectional shape of the clearance hole is defined by the arrangement of ground vias in the outer conductive boundary and dimensions of the clearance hole are determined according to a method to minimize frequency-dependent return losses caused by specific corrugations of the outer conductive boundary formed by ground plates in the wave guiding channel of the via transmission line.
摘要:
A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
摘要:
A Semiconductor integrated circuit with a protection circuit against electrostatic discharge. A clamping element is connected with MIS transistor to prevent the breakdown under the charged device model. A parasitic bipolar transistor, a MOS transistor or MIS transistor whose gate is composed of an insulating film thicker than that of the transfer gate, can be used as the clamping element.
摘要:
In a semiconductor device including a semiconductor substrate, first and second external terminals, a first impurity diffusion region connected to the first external terminal, and second and third impurity diffusion regions forming a MIS transistor, one of the second and third impurity diffusion regions facing the first impurity region is connected to the second external terminal. The distance between the first diffusion region and the MIS transistor is substantially smaller than a certain value compared to conventional device.
摘要:
A semiconductor device according to this invention comprises a first power supply (Vcc) wiring, a second power supply (Gnd) wiring, a first, a second and a third protective elements (3-1, 3-2 and 3-3), a first connecting wiring which connects in common one ends of the first, the second and the third protective elements, a second connecting wiring which connects the other ends of the first, the second and the third protective elements, and a third connecting wiring which connects the first connecting wiring and the first power supply wiring. The third connecting wiring has a resistance which is higher than that of the first connecting wiring.
摘要:
An input/output protection device for protecting an internal circuit of an integrated circuit formed on a P-type substrate, from an electrostatic discharge (ESD), includes a thyristor connected between a terminal connected to the internal circuit and a common wiring conductor. The protection device comprises a N-well formed in the P-type substrate, a first P-type diffused region formed in the N-well and connected to the terminal, a first N-diffused region formed to adjoin the first N-well, a second P-type diffused region formed in close proximity to the first N-type diffused region, and a second N-type diffused region formed in the P-type substrate and connected to the common wiring conductor. An external resistor is connected between the first P-type diffused region and the first N-type diffused region, and another external resistor is connected between the second P-type diffused region and the second N-type diffused region. A diode is constituted of the first N-diffused region and the second P-type diffused region in close proximity to each other, so that the diode has a low parasitic resistance. Thus, when a negative electrostatic pulse is applied to the terminal, the diode allows a forward current to flow from the common wiring conductor to the terminal through a low impedance path including the first resistor, the diode and the second resistor.