公开(公告)号：US5193053A

公开(公告)日：1993-03-09

申请号：US781772

申请日：1991-10-23

申请人： Kaoru Sonobe

发明人： Kaoru Sonobe

IPC分类号： H01L23/50 ,  H01L23/24

CPC分类号： H01L23/24 ,  H01L2224/48091 ,  H01L2224/49171

摘要： A plastic semiconductor device has a lead frame provided with an island for received a semiconductor element. A plurality of leads project from a square outer frame and are distributed around the periphery of the island. An insulating substrate covers and is bonded to one principal surface of the island while exposing the semiconductor element. Distributing wires are formed on one principal surface of the insulating substrate to conform with the leads. A conductive substance connects the distributing wires to the leads and fills any through-holes formed in the insulating substrate. Bonding wires connect input-output terminals of the semiconductor element to the leads. A resin body encloses and embeds the bonding wires and the semiconductor element. A heat sink may be bonded to the back face of the island.

摘要翻译： 塑料半导体器件具有设置有用于接收半导体元件的岛的引线框架。 多个引线从正方形的外框架突出并分布在岛的周边。 绝缘基板在暴露半导体元件的同时覆盖并结合到岛的一个主表面。 分布线形成在绝缘基板的一个主表面上以与引线一致。 导电物质将分配线连接到引线并填充形成在绝缘基板中的任何通孔。 接合线将半导体元件的输入 - 输出端子连接到引线。 树脂体包围并嵌入接合线和半导体元件。 散热器可以粘合到岛的背面。

公开(公告)号：US08461690B2

公开(公告)日：2013-06-11

申请号：US12969909

申请日：2010-12-16

申请人： Masanori Yoshida ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

发明人： Masanori Yoshida ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

IPC分类号： H01L29/40

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.

摘要翻译： 一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片 形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板 并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

公开(公告)号：US08253258B2

公开(公告)日：2012-08-28

申请号：US12717724

申请日：2010-03-04

申请人： Kaoru Sonobe ,  Hidehiro Takeshima ,  Shinei Sato

发明人： Kaoru Sonobe ,  Hidehiro Takeshima ,  Shinei Sato

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/15151 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48237

摘要： The present invention provides a semiconductor device which includes a semiconductor chip formed with an electrode pad on one surface thereof, a wiring board having a wiring pattern, with its one surface opposing the other surface of the semiconductor chip, a wire for electrically connecting the electrode pad of the semiconductor chip with the wiring pattern of the wiring board, an external terminal arranged on the other surface of the wiring board for electrical connection with the electrode pad through the wire and wiring pattern, and a sealant for fixing the semiconductor chip on one surface of the wiring board such that a hollow is formed between the other surface of the semiconductor chip and the one surface of the wiring board. The wiring board includes a throughhole communicating with the hollow.

摘要翻译： 本发明提供一种半导体器件，其包括在其一个表面上形成有电极焊盘的半导体芯片，具有布线图案的布线板，其一个表面与半导体芯片的另一个表面相对，用于将电极电连接 具有布线板的布线图案的半导体芯片的焊盘，布置在布线板的另一个表面上的外部端子，用于通过导线和布线图案与电极焊盘电连接;以及密封剂，用于将半导体芯片固定在一个 表面，使得在半导体芯片的另一个表面和布线板的一个表面之间形成中空部。 布线板包括与中空部连通的通孔。

公开(公告)号：US20110147945A1

公开(公告)日：2011-06-23

申请号：US12969909

申请日：2010-12-16

申请人： Masanori YOSHIDA ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

发明人： Masanori YOSHIDA ,  Daisuke Tsuji ,  Masahito Yamato ,  Jun Sasaki ,  Kaoru Sonobe ,  Akira Ide ,  Masahiro Yamaguchi

IPC分类号： H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.

摘要翻译： 一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片 形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板 并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

公开(公告)号：US5393705A

公开(公告)日：1995-02-28

申请号：US200576

申请日：1994-02-22

申请人： Kaoru Sonobe

发明人： Kaoru Sonobe

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L21/565 ,  H01L23/4334 ,  H01L23/49524 ,  H01L24/50 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121

摘要： A molded semiconductor device comprises a semiconductor chip mounted on an island portion, and external leads coupled with ball pumps on the semiconductor chip by means of a conductive leads patterned on a film carrier, and the conductive leads are formed from a conductive lattice pattern on the film carrier available for other molded devices by selectively cutting the conductive lattice pattern with, for example, a laser beam generator, thereby reducing the production cost.

摘要翻译： 模制的半导体器件包括安装在岛状部分上的半导体芯片，以及通过图案化在膜载体上的导电引线与半导体芯片上的球泵耦合的外部引线，并且导电引线由导电晶格图案形成 通过用例如激光束发生器选择性地切割导电格子图案，可以用于其它模制装置的薄膜载体，从而降低生产成本。