公开(公告)号：US20090205853A1

公开(公告)日：2009-08-20

申请号：US12296922

申请日：2007-04-10

申请人： Karl-Gunnar Larsson ,  Anders Hult

发明人： Karl-Gunnar Larsson ,  Anders Hult

IPC分类号： H05K1/03 ,  B05D1/00 ,  H05H1/00 ,  B05D3/10 ,  B05D5/00 ,  B32B15/085

CPC分类号： D21H19/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1893 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  C23C26/00 ,  C25D5/022 ,  D21H19/08 ,  D21H23/30 ,  H05K3/387 ,  H05K2201/0158 ,  Y10T428/265 ,  Y10T428/31692

摘要： There is disclosed a method for applying a first metal on a substrate, which method comprises the steps a) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

摘要翻译： 公开了一种在衬底上施加第一金属的方法，该方法包括以下步骤：a）在所述衬底的表面上制备聚合物，所述聚合物包含羧基和至少一种第二金属的吸附离子，所述离子被吸附在 pH高于7，b）将所述离子还原成第二金属，和c）将所述第一金属沉积在所述第二金属的还原离子上。 本发明还包括根据该方法制造的物体。 本发明的优点包括改善金属涂层的附着力，可能涂覆许多困难的材料。 该工艺适合大规模连续生产，减少金属的浪费。 根据本发明制造的电路显示改进的信号完整性。 还有可能制造电路，其顺序地以不同图案的几层导体构成。 也可以制造线宽非常小的电路。

公开(公告)号：US20090297840A1

公开(公告)日：2009-12-03

申请号：US12296663

申请日：2007-04-10

申请人： Karl-Gunnar Larsson ,  Anders Hult

发明人： Karl-Gunnar Larsson ,  Anders Hult

IPC分类号： B32B15/12 ,  B05D1/38 ,  H05H1/00 ,  B05D5/00

CPC分类号： D21H19/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/31 ,  C23C18/40 ,  C23C26/00 ,  D21H19/08 ,  D21H23/30 ,  H05K1/03 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0284 ,  H05K2203/095 ,  Y10T428/265 ,  Y10T428/31703

摘要： There is disclosed a method for applying a first metal on paper, which method comprises the steps a) producing polymers on the surface of said paper, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

摘要翻译： 公开了一种在纸上施加第一金属的方法，该方法包括以下步骤：a）在所述纸的表面上制备聚合物，所述聚合物包含羧基和至少一种第二金属的吸附离子，所述离子被吸附在 b）将所述离子还原成第二金属，和c）将所述第一金属沉积在所述第二金属的还原离子上。 本发明还包括根据该方法制造的物体。 本发明的优点包括改善金属涂层的附着力，可能涂覆许多困难的材料。 该工艺适合大规模连续生产，减少金属的浪费。 根据本发明制造的电路显示改进的信号完整性。 还有可能制造电路，其顺序地以不同图案的几层导体构成。 也可以制造线宽非常小的电路。

公开(公告)号：US20140017575A1

公开(公告)日：2014-01-16

申请号：US13885616

申请日：2011-11-16

申请人： Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

发明人： Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

IPC分类号： C23C16/02 ,  H01M8/02 ,  H01L31/04 ,  H05K1/02

CPC分类号： C23C16/0272 ,  B05D1/62 ,  C23C18/1601 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1803 ,  C23C18/1834 ,  C23C18/1851 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/2086 ,  H01L31/04 ,  H01M4/8825 ,  H01M4/886 ,  H01M8/02 ,  H05K1/02 ,  H05K3/387 ,  H05K2203/095 ,  H05K2203/1168 ,  Y10T428/12063 ,  Y10T428/12396 ,  Y10T428/12493

摘要： A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.

摘要翻译： 一种在基材上施用金属的方法包括：a）通过在等离子体中处理涂覆涂层，所述等离子体包含选自最多10个碳原子的化合物和不饱和单体，和b1）在所述基材的表面上制备聚合物， 所述聚合物包含羧基和第二金属的吸附离子，将所述离子还原成第二金属，或者b2）在表面上产生聚合物，使所述基材的表面与至少一种的胶态金属颗粒的分散体接触 第二金属，和c）将所述第一金属沉积在所述第二金属上。 优点包括可以涂覆对例如低pH或溶剂敏感的材料。 包括玻璃，极少数无法提取氢原子的SiO 2以及含有卤素原子的聚合物材料的底材可以以良好的粘合力涂覆。

公开(公告)号：US06303278B1

公开(公告)日：2001-10-16

申请号：US09015943

申请日：1998-01-30

申请人： Karl-Gunnar Larsson ,  Alf Lage Pettersson ,  Stig Tomas Hedlund ,  Willis Rudolf Forsling ,  Lars Anders Gunneriusson ,  Mats Einar Eugen Lindberg

发明人： Karl-Gunnar Larsson ,  Alf Lage Pettersson ,  Stig Tomas Hedlund ,  Willis Rudolf Forsling ,  Lars Anders Gunneriusson ,  Mats Einar Eugen Lindberg

IPC分类号： G03C500

CPC分类号： H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1682 ,  H05K2203/1168

摘要： In using a photoinitiator and irradiation with UV-light suitable monomers can be selectively inoculated on the surface of a non conducting substrate in a distinct pattern. Metal ions are thereafter absorbed by these monomers and are reduced. To this pattern further conducting materials, e.g. metals, can thereafter be added in a conventional way. The method according to the invention comprises a fully additive method to produce a circuit board with high resolution and the production of functional components directly on a non conducting substrate. (FIG. 2)

摘要翻译： 在使用光引发剂并用UV光照射时，可以以不同的图案将合适的单体选择性地接种在非导电基材的表面上。 然后金属离子被这些单体吸收并被还原。 对于这种图案，进一步的导电材料，例如 金属，之后可以以常规方式加入。 根据本发明的方法包括完全添加的方法来生产具有高分辨率的电路板和直接在非导电衬底上产生功能组件。 （图2）

公开(公告)号：US10934617B2

公开(公告)日：2021-03-02

申请号：US13885616

申请日：2011-11-16

申请人： Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

发明人： Sven Göthe ,  Björn Atthoff ,  Karl-Gunnar Larsson

IPC分类号： C23C16/02 ,  C23C18/16 ,  C23C18/18 ,  H05K3/38 ,  H01M4/88 ,  B05D1/00 ,  C23C18/20 ,  H01L31/04 ,  H01M8/02 ,  H05K1/02

摘要： A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of the substrate, the polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing the ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of the substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing the first metal on the second metal. Advantages include that materials sensitive to, for instance, low pH or solvents can be coated. Substrates including glass, SiO2 with very few or no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.