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    SPRINGS AND METHODS OF FORMING SAME
    4.
    发明申请
    SPRINGS AND METHODS OF FORMING SAME 审中-公开
    弹簧及其形成方法

    公开(公告)号：US20110156361A1

    公开(公告)日：2011-06-30

    申请号：US12981295

    申请日：2010-12-29

    申请人： Hamid Reza Ghalambor ,  Karthik Vaideeswaran

    发明人： Hamid Reza Ghalambor ,  Karthik Vaideeswaran

    IPC分类号： F16J15/16 ,  B23P13/00

    CPC分类号： F16J15/3452 ,  B23K26/0093 ,  F16F1/02 ,  F16J15/3212 ,  F16J15/3236 ,  Y10T29/49609

    摘要： A seal includes a polymeric jacket defining a seal surface and an inner cavity extending within the polymeric jacket along a length of the polymeric jacket. The seal further includes a spring extending within the inner cavity and including a plurality of laser cut spring elements. The seal can be disposed between a static component and a rotatable component.

    摘要翻译： 密封件包括限定密封表面的聚合物护套和沿着聚合物护套的长度在聚合护套内延伸的内腔。 密封件还包括在内腔内延伸并包括多个激光切割弹簧元件的弹簧。 密封件可以设置在静态部件和可旋转部件之间。

    MODULAR POLYMERIC EMI/RFI SEAL
    5.
    发明申请
    MODULAR POLYMERIC EMI/RFI SEAL 审中-公开
    模块化POLYMERIC EMI / RFI密封

    公开(公告)号：US20110079962A1

    公开(公告)日：2011-04-07

    申请号：US12897398

    申请日：2010-10-04

    申请人： Donald M. Munro ,  Jon M. Lenhert ,  Karthik Vaideeswaran ,  Jose R. Sousa

    发明人： Donald M. Munro ,  Jon M. Lenhert ,  Karthik Vaideeswaran ,  Jose R. Sousa

    IPC分类号： F16J15/16 ,  F16J15/02 ,  B29C37/00

    CPC分类号： F16J15/3212 ,  F16J15/3236

    摘要： A seal includes a seal body including an annular cavity, and an annular spring within the annular cavity. The seal body, the seal body includes a composite material having a thermoplastic material and a filler. The composite material can have a Young's Modulus of at least about 0.5 GPa, a volume resistitivity of not greater than about 200 Ohm-cm, an elongation of at least about 20%, a surface resistitivity of not greater than about 104 Ohm/sq, or any combination thereof.

    摘要翻译： 密封件包括包括环形空腔的密封体和环形空腔内的环形弹簧。 密封体，密封体包括具有热塑性材料和填料的复合材料。 复合材料可以具有至少约0.5GPa的杨氏模量，不大于约200欧姆 - 厘米的体积电阻率，至少约20％的伸长率，不大于约104欧姆/平方厘米的表面电阻率， 或其任何组合。

    Radiation curable compositions having improved flexibility
    6.
    发明授权
    Radiation curable compositions having improved flexibility 有权
    具有改善柔性的可辐射固化组合物

    公开(公告)号：US07423073B2

    公开(公告)日：2008-09-09

    申请号：US10995806

    申请日：2004-11-23

    申请人： James M. Mrvos ,  Girish S. Patil ,  Karthik Vaideeswaran

    发明人： James M. Mrvos ,  Girish S. Patil ,  Karthik Vaideeswaran

    IPC分类号： C08F2/46 ,  C08F2/50 ,  C08J3/28 ,  B41J2/135 ,  B41J2/16

    CPC分类号： C08G59/68 ,  B41J2/1603 ,  B41J2/1637 ,  C08L63/00 ,  G03F7/038

    摘要： A radiation curable resin composition having improved flexibility. The radiation curable composition having from about 5 to about 50 weight percent of a difunctional polymeric compound; from about 1 to about 10 weight percent of a photoinitiator; from about 1 to about 10 weight percent of a flexibilizer agent, wherein the flexibilizer agent has a molecular weight ranging from about 400 to about 10,000; and about 30 to about 90 weight percent of the non-photoreactive solvent, wherein the weight percents are based on the total weight of the resin composition. Ink jet print heads and ink jet printing apparatusess comprising ink jet print heads utilizing the radiation curable resin compositions are also included.

    摘要翻译： 一种具有改善柔性的辐射固化树脂组合物。 所述可辐射固化组合物具有约5至约50重量％的双官能聚合物; 约1至约10重量％的光引发剂; 约1至约10重量％的增韧剂，其中所述增韧剂的分子量范围为约400至约10,000; 和约30至约90重量％的非光反应性溶剂，其中重量百分比基于树脂组合物的总重量。 还包括使用该辐射固化树脂组合物的喷墨打印头和喷墨打印设备，包括喷墨打印头。

    Method for making a micro-fluid ejection device
    9.
    发明授权
    Method for making a micro-fluid ejection device 有权
    制造微流体喷射装置的方法

    公开(公告)号：US06881677B1

    公开(公告)日：2005-04-19

    申请号：US10803009

    申请日：2004-03-17

    申请人： Girish Shivaji Patil ,  Karthik Vaideeswaran

    发明人： Girish Shivaji Patil ,  Karthik Vaideeswaran

    IPC分类号： B41J2/16 ,  H01L21/302 ,  H01L21/461

    CPC分类号： B81C1/00531 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B81B2201/052

    摘要： A method for forming a fluid feed via in a semiconductor substrate chip for a micro-fluid ejection head. The method includes applying a photoresist planarization and protection layer to a first surface of the chip. The photoresist planarization and protection layer is patterned and developed to define at least one fluid feed via location. A strippable layer is applied to the photoresist planarization and protection layer on the chip. The strippable layer is patterned and developed with a photomask to define the at least one fluid feed via location in the strippable layer. The chip is then dry etched to form at least one fluid feed via in the defined feed via location. Before or after etching the chip, deprotection of the strippable layer is induced so that the strippable layer can be substantially removed with a solvent without substantially affecting the photoresist planarization and protection layer.

    摘要翻译： 一种用于在用于微流体喷射头的半导体衬底芯片中形成流体供给通孔的方法。 该方法包括将光致抗蚀剂平坦化和保护层应用于芯片的第一表面。 光致抗蚀剂平坦化和保护层被图案化和显影以限定至少一个通过位置的流体馈送。 可剥离层被施加到芯片上的光致抗蚀剂平坦化和保护层。 可剥离层被图案化并用光掩模显影以限定通过可剥离层中的位置的至少一个流体进料。 然后将芯片干蚀刻以在定义的进料通过位置形成至少一个流体进料通孔。 在蚀刻芯片之前或之后，诱导可剥离层的脱保护，使得可剥离层可以基本上用溶剂除去而基本上不影响光致抗蚀剂平坦化和保护层。