Resin composition, electronic component using the same and production method therefor
    3.
    发明授权
    Resin composition, electronic component using the same and production method therefor 有权
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US08610526B2

    公开(公告)日:2013-12-17

    申请号:US13571015

    申请日:2012-08-09

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末状存在,熔点为70〜150℃,树脂组合物的室温下的粘度为50000〜150000mPa·s。

    Resin Composition, Electronic Component using the Same and Production Method Therefor
    4.
    发明申请
    Resin Composition, Electronic Component using the Same and Production Method Therefor 有权
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US20120299688A1

    公开(公告)日:2012-11-29

    申请号:US13571015

    申请日:2012-08-09

    IPC分类号: H01F5/00

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa.s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末形式存在,熔点为70〜150℃,树脂组合物在室温下的粘度为50000〜150000mPa.s。

    Resin Composition, Electronic Component using the Same and Production Method Therefor
    9.
    发明申请
    Resin Composition, Electronic Component using the Same and Production Method Therefor 审中-公开
    树脂组合物,使用该组合物的电子部件及其制造方法

    公开(公告)号:US20100155648A1

    公开(公告)日:2010-06-24

    申请号:US12640792

    申请日:2009-12-17

    IPC分类号: H01F1/00 B05D5/12

    CPC分类号: H01F1/28 H01F1/37 H01F41/0246

    摘要: Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.

    摘要翻译: 公开了一种树脂组合物,其包含其中含有40体积%以上的热固性树脂,其中含有5〜30体积%的蜡,其中:所述热固性树脂在室温下以液体形式存在 ; 蜡在室温下呈粉末状存在,熔点为70〜150℃,树脂组合物的室温下的粘度为50000〜150000mPa·s。